2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第7页

MedeA®: Atomistic simulations for designing and testing materials for micro/nano electronics systems MedeA®:用于设计和测试微/纳米电子系统材料的原子模拟

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813850

A. France-Lanord, D. Rigby, A. Mavromaras, V. Eyert, P. Saxe, C. Freeman, E. Wimmer

{"title":"MedeA®: Atomistic simulations for designing and testing materials for micro/nano electronics systems","authors":"A. France-Lanord, D. Rigby, A. Mavromaras, V. Eyert, P. Saxe, C. Freeman, E. Wimmer","doi":"10.1109/EUROSIME.2014.6813850","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813850","url":null,"abstract":"Results of atomic-scale simulations are presented including thermal conductivity, elastic moduli, diffusion, and adhesion. This type of simulations is most conveniently performed with the MedeA® computational environment, which comprises experimental structure databases together with building tools to construct models of complex solids, surfaces, and interfaces for both crystalline and amorphous systems. Central to MedeA® are state-of-the-art modules for the automated calculation of thermodynamic, structural, electronic, mechanical, vibrational, and transport properties combined with the corresponding graphical analysis and visualization tools. These capabilities are illustrated for both inorganic and organic materials. For Si-Ge alloys and amorphous-crystalline silicon superlattices we find a drastic reduction of the thermal conductivity compared with bulk crystalline Si. In addition, the Si-Ge alloys reveal a considerable sensitivity of their thermal conductivity to disorder. The second part of this study addresses properties of epoxy resin based thermosets, including their mechanical stiffness, thermal conductivity, and adhesion on alumina. In addition, we present calculated results for oxygen and water diffusivities in cross-linked epoxy systems and discuss factors influencing such diffusivities as, e.g., mass effects or the concentration of residual hydroxyl groups in the polymer.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114826027","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules 电力电子模块键合线温度循环过程中塑性变形的热力学模拟

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813813

A. Wright, A. Hutzler, A. Schletz, P. Pichler

{"title":"Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules","authors":"A. Wright, A. Hutzler, A. Schletz, P. Pichler","doi":"10.1109/EUROSIME.2014.6813813","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813813","url":null,"abstract":"Modelling was undertaken to investigate the role of bond wire size on reliability in power electronic converters. Experiments have shown that thin 125 μm Al wires used in place of 375 μm Al wires alleviate bond wire lift-off and further outlast other sources of failure such as solder degradation in a power module. To investigate the role of bond-wire size on wire lift-off, the effective plastic strain was estimated through thermo-mechanical simulation. Three-dimensional models were constructed for the thin and thick bond wires, respectively. For the critical deformation of the aluminium bond wires during thermal cycling, a temperature-dependent bi-linear plasticity model was used. The effect of a difference in yield strength for the thin wires was also investigated. Maximum as well as volumetrically averaged values of the effective plastic strain showed significant differences between the thick and thin wires and wires with different yield strengths. The modelling results show higher effective plastic strain for the thick wires - supporting the experimental findings.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115910628","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments 用于传感器应用的嵌入式碳纳米管的最大拔出力的分子动力学模拟和验证纳米尺度实验

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813830

S. Hartmann, O. Hölck, T. Blaudeck, S. Hermann, S. Schulz, T. Gessner, B. Wunderle

{"title":"Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments","authors":"S. Hartmann, O. Hölck, T. Blaudeck, S. Hermann, S. Schulz, T. Gessner, B. Wunderle","doi":"10.1109/EUROSIME.2014.6813830","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813830","url":null,"abstract":"We present investigations of pull-out tests on CNTs embedded in palladium by means of molecular dynamics (MD) and compare our results of maximum pull-out forces with values of nano scale in situ pull-out tests inside a scanning electron microscope (SEM). Our MD model allows the investigation of crucial influencing parameters on the interface behaviour, like CNT diameter, intrinsic CNT defects and functional groups. For the experiments we prepared simple specimens using silicon substrates and wafer level compliant technologies. We realised the nano scale experiment with a nanomanipulation system supporting an AFM cantilever with known stiffness as a force sensing element inside a SEM. Greyscale correlation has been used to evaluate the cantilever deflection. From simulations derived maximum pull-out forces are approximately 17 nN and depend on the existence of intrinsic defects or functional groups and weakly on temperature. Experimentally obtained maximum pull-out forces with values between 16-29 nN are in good agreement with the computational predictions. Our results are of significant interest for the design and a failure-mechanistic treatment of future mechanical sensors with integrated single-walled CNTs showing high piezoresistive gauge factor or other nano scale systems incorporating CNT-metal interfaces.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123832077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Thermo-mechanical stress investigation of integrated SAW strain sensors 集成SAW应变传感器的热-机械应力研究

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813773

Jochen Hempel, Sohaib Anees, J. Wilde, L. Reindl

引用次数: 0

Thermo-mechanical analyses of Printed Board Assembly during reflow process for warpage prediction 印制板组件回流过程中翘曲预测的热力学分析

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813786

Soonwan Chung, Seunghee Oh, Tackmo Lee, Min-Young Park

{"title":"Thermo-mechanical analyses of Printed Board Assembly during reflow process for warpage prediction","authors":"Soonwan Chung, Seunghee Oh, Tackmo Lee, Min-Young Park","doi":"10.1109/EUROSIME.2014.6813786","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813786","url":null,"abstract":"One of the essential requirements for handheld devices such as smart phone, digital camer, and note-PC is the slim design to satisfy the customers' desires. PCB (Printed Circuit Board) should be also thinner for slim appearance. However, the PCB bending stiffness decreases as the PCB becomes thinner, which is one of the most difficult concerns to engineers. Especially, PCB deforms severely during reflow (soldering) process where the peak temperature goes up to 250°C. Therefore, it is necessary for thermo-mechanical quality/reliability engineers to predict PCB deformation at high temperature before PCB manufacturing. The purpose of this paper is to predict PBA (Printed Board Assembly) deformation based on thermo-mechanical finite element analysis by using the following capabilities. First, PCB is modelled in detail in order to obtain the interlayer stress caused by CTE or elastic modulus mismatch between each layer. Also, the contact boundary condition between PCB and rails in the reflower is considered because PCB deformation along the rails cannot be predicted in advance. Last, PCB multiple array placement can be controlled by the user to find the optimized PCB array for minimum PCB warpage. From the numerical results, it is seen that thermo-mechanical analyses of PBA based on detailed modeling can give the engineer PCB warpage prediction.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116899329","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Acquisition unit for in-situ stress measurements in smart electronic systems 智能电子系统中地应力测量的采集单元

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813795

Alicja Palczynska, F. Pesth, P. Gromala, T. Melz, D. Mayer

{"title":"Acquisition unit for in-situ stress measurements in smart electronic systems","authors":"Alicja Palczynska, F. Pesth, P. Gromala, T. Melz, D. Mayer","doi":"10.1109/EUROSIME.2014.6813795","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813795","url":null,"abstract":"Nowadays electronic systems used in automotive industry consolidate a variety of functionalities and features within one unit. Such smart systems consist of standard IC packaging, sensors and actuators. It is required that such systems will survive about 15 years of usage. To assure correct functionality prognostic and health monitoring (PHM) methods can be used. The potential benefits from implementation of these methods include among others reduction of maintenance costs and early warning of possible failure. For automotive industry, for which typical load history is not sufficiently known, this seems to be suitable approach. In today's reliability models some assumptions about the typical load history have to be made, which leads to inaccurate estimations on the remaining useful life. Though, in PHM approach one wants to make a prognosis of a failure so that maintenance can be done at the appropriate time. In this paper, the acquisition unit for in-situ measurements of internal stresses in a novel smart system module is developed. It allows recording the stresses from multiple piezoresistive sensors, at different locations on a surface of a chip, at the same time. As the measurements, that are planned, will be conducted when the smart system is assembled in the engine compartement, it is required that the acquisition unit is portable and immune to harsh conditions. The results of the measurements will be used to monitor the evolution of stress magnitudes in real work conditions.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129625278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Analytical tool for electro-thermal modelling of microbolometers 微测热计电热建模分析工具

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813826

P. Zając, C. Maj, M. Szermer, M. Lobur, A. Napieralski

引用次数: 4

2D micro-chamber for DC plasma working at low power 用于低功率直流等离子体的二维微室

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813810

V. Rochus, V. Samara, B. Vereecke, P. Soussan, B. Onsia, X. Rottenberg

{"title":"2D micro-chamber for DC plasma working at low power","authors":"V. Rochus, V. Samara, B. Vereecke, P. Soussan, B. Onsia, X. Rottenberg","doi":"10.1109/EUROSIME.2014.6813810","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813810","url":null,"abstract":"The plasma micro-chambers proposed in the literature make typically usage of relatively high RF power applied to cavities characterized by their 3D geometry, difficult to integrate on wafer. This work reports on the design, wafer-level fabrication and characterization of 2D DC plasma micro-chambers working at atmospheric pressure with noble and inert gases like helium and argon. The MEMS technology developed for this purpose allows the definition of small gaps in order to reduce the power consumption. The strike and sustain electrodes are made of Titanium Nitrite, material of choice for its hardness, and thus resistance to the ion bombardment, as well as his high melting point temperature, that allows the proximity and contact with high temperature plasmas. Measurements were performed, applying a high voltage to these electrodes, and measuring the relation between the voltage and the current when the plasma is ignited. Considering different gaps between the electrodes we can extract then the power consumed in the plasma and optimize the 2D micro-chamber.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128847720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions 循环加载条件下微电子封装双材料界面表征的加速方法

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813793

Emad A. Poshtan, S. Rzepka, B. Michel, C. Silber, B. Wunderle

引用次数: 7

Crosstalk phenomena analysis using electromagnetic wave propagation by experimental an numerical simulation methods 用实验和数值模拟方法分析电磁波传播中的串扰现象

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813803

Alicja Palczynska, A. Wymyslowski, T. Bieniek, G. Janczyk, D. Pasquet, T. Dinh

{"title":"Crosstalk phenomena analysis using electromagnetic wave propagation by experimental an numerical simulation methods","authors":"Alicja Palczynska, A. Wymyslowski, T. Bieniek, G. Janczyk, D. Pasquet, T. Dinh","doi":"10.1109/EUROSIME.2014.6813803","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813803","url":null,"abstract":"Cross-talk (XT) is a phenomenon affecting signals propagated in electronic circuitry. In a general case if a signal is transmitted in one system it creates an undesired effect in another, which is due to the crosstalk. The crosstalk is usually caused by parasitic capacitances, inductances, or conductive coupling. In wireless communication, crosstalk is often denoted as a co-channel interference, and is related to adjacent-channel interference. The above is especially important for high frequency ranges, which are used in wireless RF applications. In integrated circuit design, crosstalk normally refers to a signal affecting another nearby signal. Usually the coupling is capacitive but other forms of coupling and effects on signal further away are sometimes important as well, especially in analogue and digital circuits. The main problem is how to prevent this phenomena in order to sustain the signal integrity. There are a wide variety of possible fixes, with the increased spacing, wire reordering and/or appropriate shielding. In fact it requires application of specific design rules during the prototyping stage. In the paper the experimental and numerical analysis of a crosstalk problem is presented. The experimental measurement were performed on manufactured test samples prepared on Si substrates with predefined configuration of aluminium lines / wires. Numerical modelling was based on finite element method (FEM) including both 2D and 3D simulations.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129991780","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4