2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第6页

A model in predicting color of LED packages with different phosphor layer dimensions 不同荧光粉层尺寸的LED封装颜色预测模型

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813823

Cell K. Y. Wong, S. Leung, Y. Xiong, C. Yuan, G. Zhang

引用次数: 6

Hidden Head-In-Pillow soldering failures 隐藏头枕式焊接故障

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813875

B. Vandevelde, G. Willems, B. Allaert

引用次数: 2

Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics 汽车电子元件有限元材料建模中锡基钎料合金粘塑性力学性能的实验研究

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813860

R. Metasch, M. Roellig, A. Kabakchiev, B. Métais, R. Ratchev, K. Meier, K. Wolter

{"title":"Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics","authors":"R. Metasch, M. Roellig, A. Kabakchiev, B. Métais, R. Ratchev, K. Meier, K. Wolter","doi":"10.1109/EUROSIME.2014.6813860","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813860","url":null,"abstract":"Here, we present an advanced experimental procedure for determining the properties of a SnAg3.5 solder alloy in the strain range of primary creep under cyclic load and isothermal conditions. The challenge in this experiment is the accurate high-resolution measurement of sample elongation used for a closed-loop control, as well as avoiding the influence of sensor and specimen clamping. We realized reproducible strain rate control within a total specimen elongation of 60 μm. The tensile-compression experiment comprises strain rate variation for three strain amplitudes with integrated relaxation stages followed by a measurement of cyclic fatigue. The strain rate at every strain stage was varied in the range of 1E-3 to 1E-6 per second. At the end of every strain stage a time-limited relaxation experiment is performed, where the specimen's length is kept constant, while the stress evolution is recorded. Finally, the specimen is subjected to cyclic fatigue until a drop of 50 % of the initial materials strength is reached. The total procedure is performed in a temperature range from -40 to 150 °C. We prove the capability of common creep models to map the observed cyclic stress-strain hysteresis as well as stress dependency on strain rate. The results reveal substantial limitations of common stationary creep models and strongly suggest the application of advanced visco-plastic material models for an accurate description of the solder alloy properties. The experimental data presented can be used for the calibration of unified visco-plastic constitutive models initially proposed by Chaboché et al. and further extended during the past two decades.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129789165","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC 三维集成tsv高空间分辨率残余应力测定:HR-XRD、拉曼光谱和fibDAC的比较

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813868

D. Vogel, U. Zschenderlein, E. Auerswald, O. Holck, P. Ramm, B. Wunderle, R. Pufall

{"title":"Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC","authors":"D. Vogel, U. Zschenderlein, E. Auerswald, O. Holck, P. Ramm, B. Wunderle, R. Pufall","doi":"10.1109/EUROSIME.2014.6813868","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813868","url":null,"abstract":"Three different experimental methods have been used to determine mechanical stresses in silicon nearby tungsten TSVs - HR-XRD performed at a synchrotron beamline, microRaman spectroscopy and stress relief techniques put into effect by FIB ion milling. All methods possess, to a different extend, high spatial resolution capabilities. However they differ in their sensitivity and response to the particular stress tensor components relevant for the residual stress state nearby TSV structures. Stress measurements were performed on test samples with TSVs in thinned dies, which were SLID bonded to a thicker Si substrate die. The measurements captured stresses introduced by the W-TSV as well as by the wafer bonding process. A stress range from several MPa to hundreds of MPa could have been covered with a spatial allocation ranging from 100 nm to tens of microns. Measurement results were compared to each other and to simulated stresses from finite element analysis.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"15 15","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120966151","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Failure mode analysis and optimization of assembled high temperature pressure sensors 组合式高温压力传感器失效模式分析与优化

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813862

R. Zeiser, S. Ayub, M. Berndt, Jens Müller, J. Wilde

{"title":"Failure mode analysis and optimization of assembled high temperature pressure sensors","authors":"R. Zeiser, S. Ayub, M. Berndt, Jens Müller, J. Wilde","doi":"10.1109/EUROSIME.2014.6813862","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813862","url":null,"abstract":"Thermal-mechanical stresses are a dominant factor limiting the reliability of sensor-systems in harsh automotive environments. Strains and stresses and their effect on the performance and reliability of pressure sensors with operation temperatures up to 500 °C are analyzed with FE-simulations in this study. Platinum based, resistive pressure sensors, fabricated in thin film technology and bulk micro-machining are the subject of this study. The packaging technology combines ceramic substrates with low coefficients of thermal expansion (CTE) and a glass-solder process. The investigated sensor substrates were AlN, Si3N4 and a Low-Temperature-Cofired-Ceramic (LTCC). Two different assembly variants were chosen for the interconnection of the sensors: platinum thin wire bonding and gold micro bump interconnections. 3D FE-models of the sensor-assemblies, including temperature dependent materials properties were developed to analyze the distribution of mechanical stresses in the different assembly components. We measured the global chip-deformation at room temperature for verification of our FE-models. With combination of FE-simulations and metallographic device-cross-sections, cracks in the cavity sealing were identified as major failure mechanism of our sensors. According to the FE-simulations, devices assembled with our flip-chip method combined with LTCC-substrates showed an optimized performance regarding signal-shift and reliability. The sensor-signal drift after the assembly process was reduced from 27% to 3% for the optimized configuration.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"144 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123238468","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Comparison of bondwire life with effective strain method and cohesive zone method for a power package 某电源组件焊线寿命与有效应变法和粘结区法的比较

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813798

Jicheng Zhang, Yangjian Xu, Y. Liu

引用次数: 0

Theoretical and experimental investigations on failure mechanisms occuring during long-term cycling of electrostatic actuators 静电致动器长期循环失效机理的理论与实验研究

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813822

R. Behlert, T. Kunzig, G. Schrag, G. Wachutka

引用次数: 2

Characterization and modeling of the AuCuSn thin solder joint under thermal cycling 热循环条件下AuCuSn薄焊点的表征与建模

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813832

Tiphaine Pélisset, B. Karunamurthy, R. Otremba, T. Antretter

引用次数: 0

Investigation of temperature and moisture effect on interface toughness of EMC and copper using cohesive zone modeling method 用黏聚区模拟方法研究温度和湿度对电磁兼容和铜界面韧性的影响

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813781

Xiaosong Ma, G. Zhang

{"title":"Investigation of temperature and moisture effect on interface toughness of EMC and copper using cohesive zone modeling method","authors":"Xiaosong Ma, G. Zhang","doi":"10.1109/EUROSIME.2014.6813781","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813781","url":null,"abstract":"Interface delamination is one of the most important issues in the microelectronic packaging industry. Epoxy molding compound (EMC) and copper interfaces are the most important interface mostly concerned by the industry and researchers. Delamination between EMC and copper will severely result in product failure. In order to predict this delamination, interface properties should be characterized. Bi-material, copper-EMC, samples are made according to the industrial package processes. A four point bending test system is established in order to perform delamination tests at different temperatures using a universal tester Zwick/Roell Z005. In addition, a Keyence optical system is mounted to capture a series of pictures during the delamination processes. Four point bending tests have been performed at room temperature, 85°C respectively. In addition pre conditioning sample are also tested at room temperature and 85°C respectively after 48 hours pre conditioned at 85°C/85%RH. Experiments show that the “critical delamination load” decreases steadily with temperature increasing. Experiments also show moisture has effect on the “critical delamination load” compared with the dry samples tested at the same temperatures. This means that moisture has effects on the interface toughness between copper and EMC. To quantify the interface properties, numerical simulations of the four point bending test have been performed by using a finite element model comprising cohesive zone elements which will describe the transient delamination process during the four point bending tests. Correspondently, the interface toughness decreases from 21.2 J/m2 at room temperature to 3.7 J/m2 at 85°C as calculated from the cohesive zone element model. These results show that temperature has a large effect on the interface toughness. Saturated moisture, at 85°C/85%RH, decrease about 20% interface toughness between EMC-copper.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"27 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114041421","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Characterization and post simulation of thin-film PZT actuated plates for haptic applications 用于触觉应用的薄膜压电陶瓷驱动板的表征和后仿真

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813769

F. Casset, J. Danel, P. Renaux, C. Chappaz, G. Le Rhun, C. Dieppedale, M. Gorisse, S. Basrour, S. Fanget, P. Ancey, A. Devos, E. Defay

{"title":"Characterization and post simulation of thin-film PZT actuated plates for haptic applications","authors":"F. Casset, J. Danel, P. Renaux, C. Chappaz, G. Le Rhun, C. Dieppedale, M. Gorisse, S. Basrour, S. Fanget, P. Ancey, A. Devos, E. Defay","doi":"10.1109/EUROSIME.2014.6813769","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813769","url":null,"abstract":"The tremendous development of tactile interface in many customers' applications such as Smartphone, tablet PC or touch pad leads industrials to study “haptic interfaces” or “touch screen” solutions. This technology is already used but with limitations such as high power consumption and limited feedback effect (simple vibration). PZT is a good candidate for many actuator applications due to its high piezoelectric coefficient. In particular, it can be used for haptic interfaces to create squeeze-film effect. It consists in changing the friction between the finger and a plate resonator. It provides high granularity level of haptic sensation (texture rendering), using low power consumption compared to existing solutions. We manufactured demonstrators using a generic technology. We proved the concept through electro-mechanical characterizations and haptic feedback effect was noticeable with one's finger on our thin-film PZT demonstrators. In this paper, we presented the characterization and post-simulation of PZT-actuated plates with various actuator configurations. Measurement results, in good agreement with simulation, indicate that 2 actuator columns separated by a wavelength allow obtaining the highest substrate displacement amplitudes.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"4 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114011050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5