Characterization and modeling of the AuCuSn thin solder joint under thermal cycling

Abstract

Thin Au₂Cu₆Sn₂ solder joints have been identified to provide improved electrical and thermal device performance compared to thicker solder joints [1]. Both the material high thermal conductivity and the reduced joint thickness improve the thermal dissipation through the solder joint, making the thin Au₂Cu₆Sn₂ solder layer very attractive for high power devices. In this paper, we establish a material model for the Au₂Cu₆Sn₂ material in order to study solder thermal fatigue using finite element analysis.