2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling 基于热循环下电子组件疲劳寿命研究，对各向同性导电胶粘剂的性能进行表征和建模

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-05-12 DOI: 10.1109/EUROSIME.2014.6813820

S. Pin, M. Sartor, L. Michel, J. Parain, S. Dareys

{"title":"Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling","authors":"S. Pin, M. Sartor, L. Michel, J. Parain, S. Dareys","doi":"10.1109/EUROSIME.2014.6813820","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813820","url":null,"abstract":"Isotropic conductive adhesives (ICA) are now widely used in industry for a panel of applications such as space electronics manufacturing. Epoxy based adhesives are compliant enough to reliably bond bi-materials with an important coefficient of thermal expansion (CTE) mismatch. However, they are still under investigation for the characterization of their fatigue behaviour. Engineers lack of life prediction tools, although they are available for metallic materials. It is all the more necessary when it comes to severe on-ground qualification tests used to accelerate the demonstration of the die attachment reliability. This study deals with an epoxy based ICA with 80 wt% of silver flakes. The objectives are to characterize the glass/amorphous behaviour of the adhesive and to investigate its numerical implementation in ABAQUS for the on-ground test temperatures. The adhesive viscoelasticity becomes more preponderant with increasing of the temperature. For the time being it has been characterized between 20°C and 50°C. Tensile and creeps tests have been performed in different conditions identification purposes. A viscoelastoplastic model called Two-layers has been fitted to experimental results with success to get the evolution of the material coefficients in function of temperature. The next step consists in the implementation of the complete adhesive behaviour in an ABAQUS 20 model of the microelectronic components in thermal cycling.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129027516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law 用裂纹扩展规律对铝重丝键合接头的寿命进行了建模

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-05-12 DOI: 10.1109/EUROSIME.2014.6813828

A. Grams, T. Prewitz, O. Wittler, S. Schmitz, A. Middendorf, K. Lang

引用次数: 10

System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS VHDL-AMS中基于swcnts的压阻传感器的系统级模型开发

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-05-12 DOI: 10.1109/EUROSIME.2014.6813846

V. Kolchuzhin, J. Mehner, Erik Markert, U. Heinkel, C. Wagner, J. Schuster, T. Gessner

引用次数: 3

Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip 用应力片测量模内、模后固化过程中的相关收缩率

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813807

F. Schindler-Saefkow, F. Rost, A. Rezaie-Adli, K. Jansen, B. Wunderle, J. Keller, S. Rzepka, B. Michel

{"title":"Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip","authors":"F. Schindler-Saefkow, F. Rost, A. Rezaie-Adli, K. Jansen, B. Wunderle, J. Keller, S. Rzepka, B. Michel","doi":"10.1109/EUROSIME.2014.6813807","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813807","url":null,"abstract":"The integration of smart systems into hybrid structures is one of the challenges addressed by the project MERGE - the cluster of excellence on Technologies for Multifunctional Lightweight Structures. As a first example, a sensor system is integrated that is able to explore the thermo-mechanical conditions these systems will typically be exposed to. After briefly describing the sensor system, the paper focuses on the results of the encapsulation step as part of the fabrication process mounting the sensor chip on the test board. The sensor system measures the mechanical stresses during and after transfer molding. In particular, the in-plane components on the chip surface were recorded with high accuracy [1, 2]. Based on these informations, material parameters have been deduced by combining experimental and simulation methods within a Design of Experiment (DoE) study. During the encapsulation process, two sets of effects induce stress into the package simultaneously. On one hand, the coefficients of thermal expansion (CTE) lead to a thermal shrinkage of the materials during cooling from the curing to room temperature. On the other hand, the volume also decreases when the epoxy mold compound (EMC) is cured from its fluid into the final solid stage. This effect is called chemical cure shrinkage [3]. Separating both effects is really a challenge. The method shown in this paper allows quantifying the corresponding material parameters by combining the stress measurements with numerical parameter identification. Based on this method, the investigation on failure modes and reliability of the integrated smart systems can be improved.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121026237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Finite element multi-physics modeling for ohmic contact of microswitches 微动开关欧姆接触的有限元多物理场建模

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813877

H. Liu, D. Leray, P. Pons, S. Colin

{"title":"Finite element multi-physics modeling for ohmic contact of microswitches","authors":"H. Liu, D. Leray, P. Pons, S. Colin","doi":"10.1109/EUROSIME.2014.6813877","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813877","url":null,"abstract":"The purpose of this paper is to investigate the thermoelectrical behaviour of ohmic microcontacts under low force. The temperature in the contact zone is very important for the reliability of microswitches. As it is very difficult to measure the inner temperature, the numerical thermal modelling of electrical contacts offers interesting perspectives. A multi-physics modelling of electrical contact is accomplished with the finite element commercial package ANSYS™. Two approaches for coupled-field analysis are investigated, namely direct and load transfer. The thermo-electro-mechanical modelling is firstly validated with a smooth sphere-plane contact, and then applied for a real rough contact computation, elastic-plastic material deformation is included in the modelling. The temperature distribution on the contact surface is plotted, and the maximum temperature is found around the asperities with the highest deformation. The multi-physics model offers a reliable method to investigate the steady-state thermal behaviour of electrical contact with rough surface included.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121241466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH) 热循环镀铜通孔(PTH)力学性能分析

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813861

H. Walter, A. Kaltwasser, M. Broll, S. Huber, O. Wittler, K. Lang

{"title":"Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH)","authors":"H. Walter, A. Kaltwasser, M. Broll, S. Huber, O. Wittler, K. Lang","doi":"10.1109/EUROSIME.2014.6813861","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813861","url":null,"abstract":"The aim of thermo-mechanical reliability assessment in microelectronic packages is life time prediction under different thermal and mechanical induced stress loads. The analysis of long time stability of thermally loaded Plated- Through-Holes (PTH) in Printed Circuit Board (PCB) also requires an accurate determination of material data. This leads to application of different test and measurement methods, which are allowed to measure mechanical materials properties at micro- and/or nanostructural scale. This paper focuses on application of instrumented nanoindentation measurement technique for analysis of mechanical properties of microelectronic relevant electroplating copper. Nanoindentation method has been widely used for characterization of mechanical behaviour of devices in small volume (especially for PTH) and determined typically elastic mechanical properties (reduced modulus and hardness). In combination of modified Finite-Element (FE) simulation models and nanoindentation test results elastic and plastic material properties of copper in small scale were obtained. It was dimensionless functions for determination of presentable stresses developed, which allows to indicate the stress-strain curve of bulk materials. It is a precondition to implementation of this function that the indentation depth is out of indentation size effect. The presentation of calculated stress-strain curves by using of dimensionless function and the influence of thermal cycling of material behaviour of PTH are subject of this paper.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121330283","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Mechanical analysis of encapsulated metal interconnects under transversal load 横向荷载作用下封装金属互连的力学分析

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813842

B. Van Keymeulen, M. Gonzalez, F. Bossuyt, J. De Baets, J. Vanfleteren

{"title":"Mechanical analysis of encapsulated metal interconnects under transversal load","authors":"B. Van Keymeulen, M. Gonzalez, F. Bossuyt, J. De Baets, J. Vanfleteren","doi":"10.1109/EUROSIME.2014.6813842","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813842","url":null,"abstract":"Novel insights regarding the ability of encapsulated metal interconnections to deform due to bending are presented. Encapsulated metal interconnections are used as electric conductor or measurement system within a wide range of applications fields, e.g. biomedical, wearable, textile applications. Nevertheless the mechanical analysis remains limited to reliability investigation of these configurations while deformability is as important for application fields where, so-called disappearing electronics is the main purpose. An analysis based on the work needed to bend interconnections to a certain curvature will be used to compare different interconnection configurations with each other. The experimental as well as the simulation setup is based on PDMS encapsulated PI-enhanced Cu tracks. The results and conclusions are specific for this type of interconnections, but can be extended to a global conclusion about stretchable interconnections. From the obtained insights it is proven that periodically meander-shaped interconnections need significant less work, up to more than 10 times less, to bend the interconnection to the same curvature compared to straight interconnection lines. Furthermore, the bendability of the straight interconnection lines is determined by the shape of the interconnection, where for meandered tracks the encapsulation will determine this factor, for an encapsulation thickness of maximum 1 mm. It shows out, for the meander-shaped interconnection, that per increase of 250μm encapsulation thickness the work raises with a factor 2. For straight interconnection lines the work in function of the encapsulation thickness is limited to 20%/250μm. For encapsulations > 1mm, the encapsulation thickness will become the predominant factor which determines the deformability for both interconnection shapes.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123292131","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Multiphysical modeling of nanosecond laser dicing on ultra-thin silicon wafers 超薄硅片上纳秒激光切割的多物理模型

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813840

G. Galasso, Manfred Kaltenbacher, B. Karunamurthy, H. Eder, T. Polster

{"title":"Multiphysical modeling of nanosecond laser dicing on ultra-thin silicon wafers","authors":"G. Galasso, Manfred Kaltenbacher, B. Karunamurthy, H. Eder, T. Polster","doi":"10.1109/EUROSIME.2014.6813840","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813840","url":null,"abstract":"We propose an approach for the numerical modeling of a laser ablation (LA) process on silicon targets. The work is motivated by the increasing application of lasers in the separation of ultra-thin power semiconductors. In order to optimize the process, reduce the energy cost per laser pulse and minimize the extension of the thermally induced damage, a deeper insight into the mechanisms underlying laser dicing and a proper selection of laser settings are crucial. Numerical modeling is useful for understanding the tightly coupled physics involved in the interaction of laser with matter, as well as in the identification of the optimum laser configuration. With this aim, two numerical models have been prepared and combined. Initially, we set up a custom written one-dimensional hydrodynamic code which describes the main mechanisms triggered during LA, as vaporization and plasma formation. This first simulation allows to estimate the laser energy loss due to plasma absorption. The remaining available energy is used as input to perform a Finite Element transient thermal simulation on a three-dimensional geometry of the target. Here, an element deactivation technique is adopted to remove the vaporized elements from the computational mesh, therefore describing the geometry and the progressive formation of the ablated crater. The calculated crater geometries have been compared with experimental ones for two fluence values, showing reasonable agreement.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126867633","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Fluid damping in compliant, comb-actuated torsional micromirrors 柔顺、梳状驱动扭转微镜中的流体阻尼

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813871

R. Mirzazadeh, S. Mariani, A. Ghisi, M. de Fazio

引用次数: 11

Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing 使用热电模块和相变缓冲技术的电气过载案例的热管理:仿真、技术和测试

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813857

M. Springborn, B. Wunderle, D. May, R. Mrossko, C. Manier, H. Oppermann, M. A. Ras, R. Mitova

{"title":"Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing","authors":"M. Springborn, B. Wunderle, D. May, R. Mrossko, C. Manier, H. Oppermann, M. A. Ras, R. Mitova","doi":"10.1109/EUROSIME.2014.6813857","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813857","url":null,"abstract":"In this paper, a new and dedicated phase change cooling concept is discussed, following the goal to buffer periodic overload operations of electric power modules and thus keeping junction temperatures constant. A top-mounted latent heat storage material (LHSM) buffer is applied, to soak the overload heat in conjunction with thermo-electric coolers (TECs), which control the temperature and phase change process. The cooling system is going to be realized within an IGBT converter module, undergoing repeated overload situations. The concept features double-sided cooling and assembling as well as new materials and joining technologies such as transient liquid phase bonding/soldering and silver sintering. One-dimensional equivalent circuit estimations and transient electro-thermal FE simulations were used to calculate the cooling performance, extract optimization guidelines and discuss potential difficulties of the concept. Furthermore, the simulations are successively refined and brought into agreement with various test stands and characterization methods of reduced complexity.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114169955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1