Finite element multi-physics modeling for ohmic contact of microswitches

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI:10.1109/EUROSIME.2014.6813877

H. Liu, D. Leray, P. Pons, S. Colin

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引用次数: 6

Abstract

The purpose of this paper is to investigate the thermoelectrical behaviour of ohmic microcontacts under low force. The temperature in the contact zone is very important for the reliability of microswitches. As it is very difficult to measure the inner temperature, the numerical thermal modelling of electrical contacts offers interesting perspectives. A multi-physics modelling of electrical contact is accomplished with the finite element commercial package ANSYS™. Two approaches for coupled-field analysis are investigated, namely direct and load transfer. The thermo-electro-mechanical modelling is firstly validated with a smooth sphere-plane contact, and then applied for a real rough contact computation, elastic-plastic material deformation is included in the modelling. The temperature distribution on the contact surface is plotted, and the maximum temperature is found around the asperities with the highest deformation. The multi-physics model offers a reliable method to investigate the steady-state thermal behaviour of electrical contact with rough surface included.

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微动开关欧姆接触的有限元多物理场建模

本文的目的是研究欧姆微触点在低力作用下的热电行为。接触区温度对微动开关的可靠性至关重要。由于测量内部温度非常困难，电触点的数值热模拟提供了有趣的视角。电接触的多物理场建模是由有限元商业软件包ANSYS™完成的。研究了耦合场分析的两种方法，即直接法和荷载传递法。首先用光滑的球面接触验证了热-电-机械模型，然后应用于实际的粗糙接触计算，建模中考虑了材料的弹塑性变形。绘制了接触面上的温度分布图，发现变形最大的凸点周围的温度最高。多物理场模型为研究含粗糙表面电接触的稳态热行为提供了可靠的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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