2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第5页

The underfill-microbump interaction mechanism in 3D ICs: Impact and mitigation of induced stresses 三维集成电路的下填-微隆起相互作用机制:诱发应力的影响和缓解

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813831

A. Ivankovic, V. Cherman, M. Gonzalez, B. Vandevelde, D. Vandepitte, G. Beyer, E. Beyne, I. De Wolf

{"title":"The underfill-microbump interaction mechanism in 3D ICs: Impact and mitigation of induced stresses","authors":"A. Ivankovic, V. Cherman, M. Gonzalez, B. Vandevelde, D. Vandepitte, G. Beyer, E. Beyne, I. De Wolf","doi":"10.1109/EUROSIME.2014.6813831","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813831","url":null,"abstract":"3D IC assembly processes are introducing new stress mechanisms not observed in 20 environments, which have significant effects on the performance of both BEOL and FEOL. This paper deals with the underfill-microbump interaction mechanism observed after 3D IC stacking and focuses on its scarcely explored impact on the FEOL. FEOL stress sensors and finite element models are employed to analyze the interaction mechanism development on manufactured 2-tier stack test vehicles - memory on 130nm node logic die and 32nm node logic on logic dies. The logic dies vary from 25 to 50 nm in thickness with a thick memory die on top. 3D IC stacking stress reduction design guidelines are established for Si dies, underfill and microbumps such as die thickness, backside passivation, microbump diameter, pitch, height, and underfill Young's modulus, CTE and glass transition temperature. Furthermore, the equivalent zero stress stack bonding temperature and stress build up above underfill glass transition temperature is analyzed. Stress sensor evaluation methodology and stress impact on FEOL devices - planar and FinFETs is briefly discussed within the scope of the topic.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128146218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Thermo-electrical and structural coupled simulations of buckling beam microprobes in high temperature/high current conditions 高温/大电流条件下屈曲梁微探针的热电和结构耦合模拟

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813765

D. Eckhaut, E. Bertarelli, D. Acconcia, R. Vallauri, G. Cocchetti, A. Corigliano

引用次数: 0

Assessment of microelectronics interconnect reliability - current practice and trends 微电子互连可靠性评估。当前实践和趋势

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813880

P. Borgesen

引用次数: 1

Microactuator modeling to develop a new template for the Braille 微致动器建模开发一种新的盲文模板

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813866

S. Soulimane, Med El Amine Brixi Nigassa, B. Bouazza, H. Camon

引用次数: 4

Applications of laser welding to electric connectors 激光焊接在电连接器上的应用

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813764

C. Liao, Shih-Po Liu, K. Liao

引用次数: 0

Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions 设计pcb低周疲劳载荷下的独立寿命评估方法

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813787

P. Fuchs, G. Pinter, T. Krivec

{"title":"Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions","authors":"P. Fuchs, G. Pinter, T. Krivec","doi":"10.1109/EUROSIME.2014.6813787","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813787","url":null,"abstract":"In this work a method was worked on that assesses the lifetime of printed circuit boards (PCBs) under low cycle fatigue conditions. The method was based on finite element models and low cycle fatigue experiments. Verifying it, two significantly different PCB designs and several different PCB built ups were analyzed. Doing so, for the numerical part the individual layer materials were characterized, material models were defined and simulation models were built. A submodelling technique had to be applied in order to evaluate the local loading situation. For the experimental part corresponding PCBs were manufactured and a statistically relevant number of boards were tested in a board level cyclic bend test (BLCBT) while the critical connections were monitored. Based on the results of one PCB a correlation model describing the dependence of the cycles to failure on the local loading situation was formulated and used for the lifetime assessment of the other boards. A very good agreement between predicted and measured results could be shown.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"66 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132764176","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

2-Gb/s/pin DDR3 memory channel design and simulation for carbon reduction 2 gb /s/引脚DDR3内存通道设计与仿真，实现碳减排

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813845

N. Chen

{"title":"2-Gb/s/pin DDR3 memory channel design and simulation for carbon reduction","authors":"N. Chen","doi":"10.1109/EUROSIME.2014.6813845","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813845","url":null,"abstract":"The fabless semiconductor companies should take more responsibility for the global climate change when more and more consumer electronics are being produced. Under the trade-off between the signal quality of DDR3 memory and power consumption, the chip-package-board co-simulations were taken in the frequency domain up to 10 GHz and the time domain at 2 Gb/s to compare two types of channel designs. Results indicated that the proposed channel using the 2.5-layer PCB achieved the lower power consumption with acceptable eye diagrams of overlapping one DDR3 data byte that demonstrated 218-ps eye-aperture time, 1.47-V overshoot, and -0.05-V undershoot for the writing access, and 245-ps eye-aperture time, 1.83-V overshoot, and -0.25-V undershoot for the reading access. Moreover, there would be about 58 tons of carbon reduction per day if one third of global LCD TVs shipped each year use the 2.5-layer PCB design and the low-carbon DDR3 settings. Revising JEDEC Standard to implement two more weak drive strengths in the DDR3 SDRAM is recommended that is beneficial to reduce more power consumption in the consumer electronics.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133333464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint 创新液晶聚合物基QFN封装和Sn96.5Ag3Cu0.5焊点内置可靠性的有限元模拟

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813805

Walide Chenniki, I. Bord-Majek, B. Levrier, K. Wongtimnoi, J. Diot, Y. Ousten

引用次数: 0

Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method 用离子束去层法评价薄膜中残余应力分布

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813785

D. Kozic, R. Treml, R. Schongrundner, R. Brunner, D. Kiener, T. Antretter, Hans-Peter Ganser

引用次数: 3

Analytical stress model for tin based solder material 锡基钎料的解析应力模型

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813854

M. Guyenot, A. Fix

{"title":"Analytical stress model for tin based solder material","authors":"M. Guyenot, A. Fix","doi":"10.1109/EUROSIME.2014.6813854","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813854","url":null,"abstract":"In recent years the activity to predict lifetime focuses more and more on finite element analysis (FEA) using up growing computer power. The description of the material properties especially viscoplastic behavior have to be well known to bring FEA calculations in a good agreement with experimental results concerning solder joints [1, 2]. Typically, creeping of solder materials is specified by extensive mathematics modeling. New research activities concentrate on viscoplastic modeling according to Chaboche [3, 4]. This paper shows a new methodology for lifetime prediction based on stress measurements of tin solder specimens performed by Fraunhofer Society IKTS [5]. Characteristic hysteresis curves of the stress-strain behavior of tin based solder alloy were measured at different temperatures to enable the calculation of elastic and plastic elongation depending on time and temperature. This new approach gets by on complex mathematics equations and FEA. A stress based model combined with lifetime facts offers a rapid lifetime prediction of solder materials. Transferability to solder joints is shown by means of the component CR1206 and its reliability due to thermal cycling experiments. The adjusted analytic calculated results are evaluated by the experimental thermal cycling results and will be transformed to a calculation model for thermal cycle test procedure.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132851848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0