{"title":"微电子互连可靠性评估。当前实践和趋势","authors":"P. Borgesen","doi":"10.1109/EUROSIME.2014.6813880","DOIUrl":null,"url":null,"abstract":"When it comes to the long-term reliability of the most common microelectronics interconnects, too little effort is spent on investigating important aspects while a significant amount of day-to-day reliability testing may be more or less wasted. This would seem to be at least partially so because reliability managers often fail to ask themselves what it is that they really want to know. Notably, while rarely explicitly recognized even ongoing `engineering tests' will usually be meaningless unless they reveal something about relative performance in service. This requires a model or at least a quantitative mechanistic understanding.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Assessment of microelectronics interconnect reliability - current practice and trends\",\"authors\":\"P. Borgesen\",\"doi\":\"10.1109/EUROSIME.2014.6813880\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"When it comes to the long-term reliability of the most common microelectronics interconnects, too little effort is spent on investigating important aspects while a significant amount of day-to-day reliability testing may be more or less wasted. This would seem to be at least partially so because reliability managers often fail to ask themselves what it is that they really want to know. Notably, while rarely explicitly recognized even ongoing `engineering tests' will usually be meaningless unless they reveal something about relative performance in service. This requires a model or at least a quantitative mechanistic understanding.\",\"PeriodicalId\":359430,\"journal\":{\"name\":\"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-04-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2014.6813880\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2014.6813880","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Assessment of microelectronics interconnect reliability - current practice and trends
When it comes to the long-term reliability of the most common microelectronics interconnects, too little effort is spent on investigating important aspects while a significant amount of day-to-day reliability testing may be more or less wasted. This would seem to be at least partially so because reliability managers often fail to ask themselves what it is that they really want to know. Notably, while rarely explicitly recognized even ongoing `engineering tests' will usually be meaningless unless they reveal something about relative performance in service. This requires a model or at least a quantitative mechanistic understanding.