创新液晶聚合物基QFN封装和Sn96.5Ag3Cu0.5焊点内置可靠性的有限元模拟

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI:10.1109/EUROSIME.2014.6813805

Walide Chenniki, I. Bord-Majek, B. Levrier, K. Wongtimnoi, J. Diot, Y. Ousten

{"title":"创新液晶聚合物基QFN封装和Sn96.5Ag3Cu0.5焊点内置可靠性的有限元模拟","authors":"Walide Chenniki, I. Bord-Majek, B. Levrier, K. Wongtimnoi, J. Diot, Y. Ousten","doi":"10.1109/EUROSIME.2014.6813805","DOIUrl":null,"url":null,"abstract":"In this study, Quad Flat No-lead (QFN) cavity package based on LCP and the reliability impact of the package geometry are investigated. A well-established model of Sn96.5Ag3Cu0.5 solder joint fatigue based on the Darveaux's methodology leading to strain energy density estimation is used. A dedicated Design of Experiments (DoE) is performed to assess the optimal thermo-mechanical properties of the LCP package leading to the maximum operating lifetime. A correlation between predicted lifetime results and optimal thermo-mechanical properties of the package is obtained depending on the geometry of the QFN under study.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"145 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint\",\"authors\":\"Walide Chenniki, I. Bord-Majek, B. Levrier, K. Wongtimnoi, J. Diot, Y. Ousten\",\"doi\":\"10.1109/EUROSIME.2014.6813805\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, Quad Flat No-lead (QFN) cavity package based on LCP and the reliability impact of the package geometry are investigated. A well-established model of Sn96.5Ag3Cu0.5 solder joint fatigue based on the Darveaux's methodology leading to strain energy density estimation is used. A dedicated Design of Experiments (DoE) is performed to assess the optimal thermo-mechanical properties of the LCP package leading to the maximum operating lifetime. A correlation between predicted lifetime results and optimal thermo-mechanical properties of the package is obtained depending on the geometry of the QFN under study.\",\"PeriodicalId\":359430,\"journal\":{\"name\":\"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"145 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-04-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2014.6813805\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2014.6813805","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文研究了基于LCP的四平面无引线(QFN)空腔封装及其几何形状对可靠性的影响。建立了基于Darveaux方法的Sn96.5Ag3Cu0.5焊点疲劳模型，该模型可用于应变能密度估算。进行了专门的实验设计(DoE)，以评估LCP包的最佳热机械性能，从而实现最大的使用寿命。预测寿命结果与包的最佳热机械性能之间的相关性取决于所研究的QFN的几何形状。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

In this study, Quad Flat No-lead (QFN) cavity package based on LCP and the reliability impact of the package geometry are investigated. A well-established model of Sn96.5Ag3Cu0.5 solder joint fatigue based on the Darveaux's methodology leading to strain energy density estimation is used. A dedicated Design of Experiments (DoE) is performed to assess the optimal thermo-mechanical properties of the LCP package leading to the maximum operating lifetime. A correlation between predicted lifetime results and optimal thermo-mechanical properties of the package is obtained depending on the geometry of the QFN under study.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

自引率

0.00%

发文量