某电源组件焊线寿命与有效应变法和粘结区法的比较

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI:10.1109/EUROSIME.2014.6813798

Jicheng Zhang, Yangjian Xu, Y. Liu

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引用次数: 0

摘要

本文采用内聚区模型对电源模块中模具与焊点界面的刚度退化进行了模拟。随后，采用有效应变法对焊点的疲劳寿命进行了预测。此外，结合改进的paris’定律，进一步利用内聚区模型来研究线键模型的可靠性。同时，研究了黏结区模型参数对可靠性的影响。

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Comparison of bondwire life with effective strain method and cohesive zone method for a power package

In this paper, the cohesive zone model was used to simulate the stiffness degradation of interfaces between dies and solder joints in a power module. Subsequently, the fatigue life of the solder joints was predicted by the effective strain method. In addition, the cohesive zone model, collabrating with a modified paris' law, was further utilized to investigate the reliability of a wirebond model. At the same time, the effect of the cohesive zone model parameters on the reliability was studied.

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来源期刊

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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