Comparison of bondwire life with effective strain method and cohesive zone method for a power package

Abstract

In this paper, the cohesive zone model was used to simulate the stiffness degradation of interfaces between dies and solder joints in a power module. Subsequently, the fatigue life of the solder joints was predicted by the effective strain method. In addition, the cohesive zone model, collabrating with a modified paris' law, was further utilized to investigate the reliability of a wirebond model. At the same time, the effect of the cohesive zone model parameters on the reliability was studied.