用实验和数值模拟方法分析电磁波传播中的串扰现象

Alicja Palczynska, A. Wymyslowski, T. Bieniek, G. Janczyk, D. Pasquet, T. Dinh
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引用次数: 4

摘要

串扰(XT)是一种影响信号在电子电路中传播的现象。在一般情况下,如果一个信号在一个系统中传输,它会在另一个系统中产生不希望的效果,这是由于串扰。串扰通常是由寄生电容、电感或导电耦合引起的。在无线通信中,串扰通常被表示为同信道干扰,并且与相邻信道干扰有关。以上对于用于无线射频应用的高频范围尤其重要。在集成电路设计中,串扰通常是指一个信号影响附近的另一个信号。通常耦合是电容性的,但其他形式的耦合和对更远信号的影响有时也很重要,特别是在模拟和数字电路中。主要问题是如何防止这种现象,以保持信号的完整性。有各种各样可能的修复,随着间距的增加,电线重新排序和/或适当的屏蔽。事实上,它需要在原型阶段应用特定的设计规则。本文对串扰问题进行了实验和数值分析。实验测量是在Si衬底上制备的预制测试样品上进行的,该样品具有预定义的铝线/线配置。数值模拟基于有限元法(FEM),包括二维和三维仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Crosstalk phenomena analysis using electromagnetic wave propagation by experimental an numerical simulation methods
Cross-talk (XT) is a phenomenon affecting signals propagated in electronic circuitry. In a general case if a signal is transmitted in one system it creates an undesired effect in another, which is due to the crosstalk. The crosstalk is usually caused by parasitic capacitances, inductances, or conductive coupling. In wireless communication, crosstalk is often denoted as a co-channel interference, and is related to adjacent-channel interference. The above is especially important for high frequency ranges, which are used in wireless RF applications. In integrated circuit design, crosstalk normally refers to a signal affecting another nearby signal. Usually the coupling is capacitive but other forms of coupling and effects on signal further away are sometimes important as well, especially in analogue and digital circuits. The main problem is how to prevent this phenomena in order to sustain the signal integrity. There are a wide variety of possible fixes, with the increased spacing, wire reordering and/or appropriate shielding. In fact it requires application of specific design rules during the prototyping stage. In the paper the experimental and numerical analysis of a crosstalk problem is presented. The experimental measurement were performed on manufactured test samples prepared on Si substrates with predefined configuration of aluminium lines / wires. Numerical modelling was based on finite element method (FEM) including both 2D and 3D simulations.
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