An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI:10.1109/EUROSIME.2014.6813793

Emad A. Poshtan, S. Rzepka, B. Michel, C. Silber, B. Wunderle

{"title":"An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions","authors":"Emad A. Poshtan, S. Rzepka, B. Michel, C. Silber, B. Wunderle","doi":"10.1109/EUROSIME.2014.6813793","DOIUrl":null,"url":null,"abstract":"In this paper, an accelerated and cost-effective characterization method for bi-material interfaces under cyclic loading using a Miniaturized Cyclic Mixed-mode Bending (MCMB) test setup is presented. The Modified Single Leg Bending (MSLB) samples are acquired directly from production-line Thin Quad Flat Package (TQFP) which provide a mixed-mode I + II loading condition. Under sub-critical cyclic loading, crack was found to occur at the polymer-metal interface. The crack length is measured using three methods: (i) in-situ measurements using microscope (ii) gray scale correlation method (iii) numerical method. The crack growth rate was found to have a power-law dependence on the strain Energy Release Rate (ERR) range. In addition influence of plasma cleaning on interfacial adhesion properties namely, crack initiation and propagation is discussed.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2014.6813793","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

Abstract

In this paper, an accelerated and cost-effective characterization method for bi-material interfaces under cyclic loading using a Miniaturized Cyclic Mixed-mode Bending (MCMB) test setup is presented. The Modified Single Leg Bending (MSLB) samples are acquired directly from production-line Thin Quad Flat Package (TQFP) which provide a mixed-mode I + II loading condition. Under sub-critical cyclic loading, crack was found to occur at the polymer-metal interface. The crack length is measured using three methods: (i) in-situ measurements using microscope (ii) gray scale correlation method (iii) numerical method. The crack growth rate was found to have a power-law dependence on the strain Energy Release Rate (ERR) range. In addition influence of plasma cleaning on interfacial adhesion properties namely, crack initiation and propagation is discussed.

查看原文本刊更多论文

循环加载条件下微电子封装双材料界面表征的加速方法

本文提出了一种基于微型循环混合模弯曲(MCMB)试验装置的双材料界面在循环载荷下的快速、经济的表征方法。改进的单腿弯曲(MSLB)样品直接从生产线薄四平面封装(TQFP)中获得，该生产线提供混合模式I + II加载条件。在亚临界循环加载下，聚合物-金属界面处出现裂纹。裂纹长度的测量方法有三种:(1)显微镜原位测量;(2)灰度相关法;(3)数值法。发现裂纹扩展速率与应变能释放率(ERR)范围呈幂律关系。此外，还讨论了等离子体清洗对界面粘附性能即裂纹萌生和扩展的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

自引率

0.00%

发文量