2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第9页

Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM 用三维有限元法设计三维微电子元件的热机械可靠性

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813881

S. Belhenini, A. Tougui, F. Dosseul

{"title":"Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM","authors":"S. Belhenini, A. Tougui, F. Dosseul","doi":"10.1109/EUROSIME.2014.6813881","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813881","url":null,"abstract":"3D microelectronic components are exposed to electrical, thermal, mechanical and chemical stresses generated by storage, transport, manipulation, functioning and environment. The reliability of the components depends partially on the reliability of interconnections which insures the mechanical and the electrical junctions between components and printed circuits. Reliability has to be evaluated on mechanical demonstrators before the production stage. It is currently studied by employing standardized tests. Modeling has been proven to be a very efficient tool in IC Packaging reliability, especially for designing and optimization, compared with experimental standardized tests, which are expensive and time-consuming. In this work, the board level thermomechanical reliability of a 3D chip to wafer component was evaluated by using a coupled thermal-structural numerical analysis. 3D FEM results were employing in the design optimization of 3D components. The critical solder bump strain energy density is used as the principal reliability criteria. The influence of the internal architectures of 3D components and the TSVs locations on the thermomechanical reliability has been studied.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129491471","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments 汽车用低TG环氧基胶粘剂在DMA和松弛实验中的粘弹性表征挑战

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813833

I. Maus, H. Preu, M. Niessner, M. Fink, K. Jansen, R. Pantou, B. Michel, B. Wunderle

{"title":"Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments","authors":"I. Maus, H. Preu, M. Niessner, M. Fink, K. Jansen, R. Pantou, B. Michel, B. Wunderle","doi":"10.1109/EUROSIME.2014.6813833","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813833","url":null,"abstract":"Microelectronic devices integrate more and more diverse materials in order to miniaturize the packages. Epoxy resins enable smaller electronic devices with promising features [1]. The performance and the reliability of the product are highly dependent on the material behavior of the components and on their interaction under different loading situation. Electrically conductive adhesives are widely used in semiconductor technology. The focus of this work is set on Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles. The aim of this work is the material characterization of highly filled epoxy based die attach materials by dynamic mechanical analysis (DMA) and relaxation experiments in order to derive the elastic and a viscoelastic material model in a wide temperature range and the thermo mechanical analysis TMA measurement results to obtain the coefficient of thermal expansion CTE and information about the residual stresses in the adhesive material. A comparison and discussion of measurement and simulation results from FEA with implemented material models obtained using DMA and relaxation experiment will be done. We use as an example to illustrate our method a measurement from two glue samples A and B. The measurement of the epoxy based highly filled die attach material is a challenging topic. We show how to overcome the difficulties in measuring these materials.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125081644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

A new life-test equipment designed for medium-duty electromagnetic contactors 一种新型中型电磁接触器寿命试验装置

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813836

S. Biyik, Murat Aydin

{"title":"A new life-test equipment designed for medium-duty electromagnetic contactors","authors":"S. Biyik, Murat Aydin","doi":"10.1109/EUROSIME.2014.6813836","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813836","url":null,"abstract":"In this study, a new test equipment, which is capable of performing arc-erosion experiments of electrical contacts on a medium-duty contactor, was designed and manufactured. The current load value of the system was gradually adjustable up to 30 A via control buttons located on the device. The make/break counts (cycle) and delay times of electrical contacts were adjusted by an electronic flasher. The number of operations was readily adjusted to desired counts before tests, and was monitored along the whole test on the LCD display of up/down counter. Inductive loads consisting transformers were used to achieve real-life operating conditions. A contactor having pole number of 3, switching power of 37 kW, and switching current of 75 A was used to conduct arc-erosion experiments. The test conditions for this contactor were 220 V operating voltage, 50 Hz frequency, and 20 A switching current. The switching frequency and delay time were selected as 1,000 times per hour and 2.6 s, respectively. Arc-erosion experiments were carried out by using the contactor up to 40,000 operations. The contact surfaces were analyzed by using scanning electron microscopy. The chemical compositions nearby arc were determined by energy dispersive x-ray spectroscopy. The experimental results showed that the contact surfaces were reasonably affected by the arc-erosion, which leads to mass loss by material migration and/or evaporation. Arc-affected zones were enlarged with the increasing operation number. It was concluded that the stationary contacts underwent major erosion.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116498766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Thermo-mechanical stress induced by CPI on 3D interposer package CPI 在三维插层封装上引起的热机械应力

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813821

M. Lofrano, Mario Gonzalez

引用次数: 3

Comparation of thermal and hygro effects on the degradation of LED package 热和湿气对LED封装降解的影响比较

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813782

Xiaosong Ma, G. Zhang

{"title":"Comparation of thermal and hygro effects on the degradation of LED package","authors":"Xiaosong Ma, G. Zhang","doi":"10.1109/EUROSIME.2014.6813782","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813782","url":null,"abstract":"Humidity test is common to all the packaged integrated circuits, few works have been reported on the study of the humidity effects combined with high temperature on packaged LEDs. Moreover, the packaged LEDs are also subjected to moisture environment in many of their applications. In this work, the high temperature-humidity (95°C-85% RH) aging test is used to evaluate the reliability of the packaged LEDs with respect to their optical output properties. The degradation of two kinds of commercial packaged light-emitting diodes (LEDs) are investigated using high temperature aging combined with fast moisture diffusion method, which is quatitively calculated by simulation. First, the tested LED devises is put in the chamber for 84 hours at 95°C/85%RH, then the temperature is set to 85°C in order to know the effects of moistute loss, and then the LED devises are under stress conditions 65°C/85%RH for 50 hours. At last sample are put in the oven for 25 hours at 105 °C. An optical measurement system consisting of a one-meter diameter integrating sphere and a spectroradiometer is set up to measure the luminous flux of the LEDs. The spectral flux responsivity of the measurement system is calibrated at the start and the end of the measurement of LEDs to achieve high measurement accuracy. During the optical measurement, the LED under test is powered up with a nominal constant current as recommended by the manufacturers of the packaged LEDs. Temperature and moisture has effects on both type of epoxy packaged LED the luminous flux, temperature color but almost no effectsof the color purity, peak wave length and half wave width. Further study are still onging to investigated the relation between aging time and optical degradation and also relation between moisture content and optical degradation.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130267488","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Process and reliability of SF6/O2 plasma etched copper TSVs SF6/O2等离子蚀刻铜tsv的工艺及可靠性

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813768

L. Filipovic, R. L. de Orio, S. Selberherr

引用次数: 3

Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips 使用压阻应力芯片进行传递成型过程中实时原位应力测量的实验研究和解释

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813837

Ali R. Rezaie Adli, K. Jansen, F. Schindler-Saefkow, F. Rost

{"title":"Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips","authors":"Ali R. Rezaie Adli, K. Jansen, F. Schindler-Saefkow, F. Rost","doi":"10.1109/EUROSIME.2014.6813837","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813837","url":null,"abstract":"This paper describes a method used for experimental real-time monitoring of thermo-mechanical stress build-up during integrated circuit encapsulation. To detect the stress variations during molding, special stress measuring chips were employed. The working principle of the stress chip is based on the piezoresistive sensors embedded on the surface in a 6 by 6 matrix distribution. [1] The tests were performed at several temperatures and initial conversion ranges. The stages of the molding were analyzed step by step and the shear stress and the normal stress difference distribution was investigated based on sensor locations and the orientation of the chip. The chips are connected to a flexible polyimide board via four wire bonding at one side of the chip. The conductive tracks are extended to the edge of the board where the data acquisition system is soldered to connection pads. The material of the board ensures an elasticity inside the mold cavity and it is proven that it can withstand the weight and clamping pressure applied by the mold wall without causing any damage to the connections.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132752215","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Using molecular modeling to uncover the origins of subtle solvation-based film defects 利用分子模型揭示细微溶剂化薄膜缺陷的起源

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813770

N. Iwamoto, Teri Baldwin

{"title":"Using molecular modeling to uncover the origins of subtle solvation-based film defects","authors":"N. Iwamoto, Teri Baldwin","doi":"10.1109/EUROSIME.2014.6813770","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813770","url":null,"abstract":"Summary form only given. A series of lithographic metallization steps are used to build up the interconnect network on the chip during wafer fabrication and one often overlooked film technology that is an integral part of the process is the bottom anti-reflective coating (BARC), used to enable the production of uniform fine features in the resist. In order to create these features, near-perfect thin films must be produced, and any surface defect found during the spin-coating process is unacceptable, especially as interconnect densities become finer and finer. Recently, a defect was found that seemed to be sporadic in manifestation and proved to be difficult to explain from normal inspection of the BARC manufacturing process, which included inspection of every step of the process from incoming raw materials through final filtration and packaging. At that point, molecular modeling was called in to simulate a mechanism that could cause the defect. This molecular modeling encompassed a variety of methods, including thermodynamic calculations of the reaction steps using quantum mechanics and several molecular dynamics techniques to calculate solvation compatibilities (a cohesive energy density calculation), cohesive modulus on suspect oligomers, and simulation of temperature history-dependent pathways of the cohesive energy density on a high suspect oligomer. This final simulation uncovered a temperature sensitivity which explained the origin of the sporadic defects. This discovery initiated corrective actions that led to a final resolution. This paper will describe the modeling that was done and show the often forensic nature of uncovering the origin of this defect using molecular modeling. This example demonstrates how molecular modeling's role can be expanded by being used in a purely investigative manner rather than a predictive one.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134345790","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Mutiphysics study of RF/microwave planar devices: Effect of the input signal power 射频/微波平面器件的多物理场研究:输入信号功率的影响

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813816

M. Sánchez-Soriano, Michael Edwards, Y. Quéré, D. Andersson, S. Cadiou, C. Quendo

引用次数: 15

Investigation of color shift of LEDs-based lighting products led照明产品色移的研究

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813802

S. Koh, H. Ye, M. Yazdan Mehr, J. Wei, W. V. van Driel, L. Zhao, G. Zhang

{"title":"Investigation of color shift of LEDs-based lighting products","authors":"S. Koh, H. Ye, M. Yazdan Mehr, J. Wei, W. V. van Driel, L. Zhao, G. Zhang","doi":"10.1109/EUROSIME.2014.6813802","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813802","url":null,"abstract":"LED has the potential to revolutionize the lighting industry with their long lifetime and high efficacy. However, the long lifetime claimed by the manufacturers is often based solely on the estimated lumen depreciation and this is insufficient since the color shift of LEDs products is another important issue that need to be considered for LEDs products in order for them to perform their intended function. It has been shown through DOE's CALIPER program and GATEWAY program that color aging during LED products lifetime can be so extensive that it could be considered as a failure to the end-user. Nevertheless, although performance evaluation based on LED lumen depreciation had been well documented and established, literature on the performance evaluation based on color shift is very limited. This is because the mechanism for color shift is not well understood, nor the measurement/characterization methods. Therefore, an investigation of color aging over lifetime is urgently needed. Therefore, this paper will attempt to address the color shift of the plastic lenses and proposed a model for predicting color shift in LEDs lenses.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"142 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116350800","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6