F. Baccar, F. Le Henaff, L. Théolier, S. Azzopardi, E. Woirgard
{"title":"基于有限元模拟方法的深沟槽终端二极管电特性演化","authors":"F. Baccar, F. Le Henaff, L. Théolier, S. Azzopardi, E. Woirgard","doi":"10.1109/EUROSIME.2014.6813814","DOIUrl":null,"url":null,"abstract":"The main contribution of this work consists in showing the possibility to use the Cyclotene 4026-46 BCB (BenzoCycloButen) resin in thick layer to realize Deep Trench Termination (DT2). The development of the DT2 in power devices strongly depends on its reliability. 2D finite elements simulations were used to determinate the electrical characteristics after mechanical stresses created in the structure. It appears that void created inside the structure does not affect the structure's characteristic; however it changes when a quantity of charge was added at interface Silicon/BCB.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Electrical characteristics evolution of the Deep Trench Termination diode based on a finite elements simulation approach\",\"authors\":\"F. Baccar, F. Le Henaff, L. Théolier, S. Azzopardi, E. Woirgard\",\"doi\":\"10.1109/EUROSIME.2014.6813814\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The main contribution of this work consists in showing the possibility to use the Cyclotene 4026-46 BCB (BenzoCycloButen) resin in thick layer to realize Deep Trench Termination (DT2). The development of the DT2 in power devices strongly depends on its reliability. 2D finite elements simulations were used to determinate the electrical characteristics after mechanical stresses created in the structure. It appears that void created inside the structure does not affect the structure's characteristic; however it changes when a quantity of charge was added at interface Silicon/BCB.\",\"PeriodicalId\":359430,\"journal\":{\"name\":\"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-04-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2014.6813814\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2014.6813814","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electrical characteristics evolution of the Deep Trench Termination diode based on a finite elements simulation approach
The main contribution of this work consists in showing the possibility to use the Cyclotene 4026-46 BCB (BenzoCycloButen) resin in thick layer to realize Deep Trench Termination (DT2). The development of the DT2 in power devices strongly depends on its reliability. 2D finite elements simulations were used to determinate the electrical characteristics after mechanical stresses created in the structure. It appears that void created inside the structure does not affect the structure's characteristic; however it changes when a quantity of charge was added at interface Silicon/BCB.