Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability

R. Dudek, R. Doring, P. Sommer, B. Seiler, K. Kreyssig, H. Walter, M. Becker, M. Gunther
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引用次数: 27

Abstract

For high temperature interconnection sintered silver can be used, however, it induces new demands on the thermo-mechanical design. That issue requires knowledge on the thermo-mechanical reliability of silver sintered devices, the subject of this paper. Material characteristics of the sinter layers are needed for simulation, which are addressed in the first part of the paper. Based on material properties of pure silver, for sintered silver with different porosities effective material characteristics have been derived by use of a micromechanical cell model. Shear loadings with in-situ deformation analyses have also been made to investigate sintered silver behavior. A complicated dependence on processing, temperature, and deformation rate is seen. Based on different effective constitutive models for the sintered interconnects, stress loadings are studied for a power module, an IGBT on DCB substrate, for passive and active thermal cycling. For the passive cycle complex interactions of the different layers of the stack are observed, which are not seen in a module with soft solder bonding. This result can be attributed to the missing decoupling by the soft soldering layer. Failure risks are evaluated by both conventional FEA and cohesive zone modeling. A quite different stress situation is depicted for active power cycling. The situation is even more complex and it is obvious from the simulations, that active power cycling can induce failure modes different from passive cycling.
烧结银行为及其对igbt模块可靠性影响的实验与有限元结合研究
烧结银可以用于高温互连,但这对热机械设计提出了新的要求。这个问题需要对银烧结装置的热机械可靠性有一定的了解,这也是本文的主题。模拟需要烧结层的材料特性,这在本文的第一部分中得到了解决。基于纯银的材料特性,利用微力学单元模型推导了不同孔隙率烧结银的有效材料特性。剪切载荷和原位变形分析也被用来研究烧结银的行为。加工过程、温度和变形率之间存在复杂的关系。基于不同的烧结互连有效本构模型,研究了功率模块、DCB基板上的IGBT在被动和主动热循环下的应力载荷。对于被动循环,可以观察到堆叠不同层之间复杂的相互作用,这在软焊接模块中是看不到的。这一结果可归因于软焊接层的失耦。采用传统有限元法和内聚区模型对失效风险进行了评估。有功功率循环的应力情况则完全不同。仿真结果表明,有功循环诱发的失效模式不同于无功循环。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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