2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition最新文献_第8页

Influence of ammonium tungstate additive in metallization baths on Ni-Cu-P resistive layer properties 金属化液中钨酸铵添加剂对Ni-Cu-P电阻层性能的影响

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346916

W. Filipowski, Z. Pruszowski, K. Waczyński, Natalia Waczyńska-Niemiec, A. Czerwiński, M. Pluska, J. Kulawik

引用次数: 0

Comparison of microvia HDI PCBs with ACF interconnections in accelerated life testing 微孔HDI pcb与ACF互连在加速寿命测试中的比较

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346870

L. Frisk, S. Lahokallio, J. Kiilunen

{"title":"Comparison of microvia HDI PCBs with ACF interconnections in accelerated life testing","authors":"L. Frisk, S. Lahokallio, J. Kiilunen","doi":"10.23919/EMPC.2017.8346870","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346870","url":null,"abstract":"New packaging technologies require high density substrates. In built up high density interconnect (HDI) printed circuit boards (PCB) high density is achieved by using microvias. Such HDI PCBs may be used in many applications. In flip chip technology, a bare chip is attached directly to a substrate which enables very high density. Anisotropic conductive adhesive films (ACF) are often used as interconnection materials in high density flip chip applications, since they enable very high density. In this study, the reliability of flip chip ACF attachments on four different HDI PCBs was studied. The PCBs had similar core layers, but the microvia layers of the PCBs were different. Test chips were attached on these PCBs using an ACF. The reliability of the interconnections was tested using two fast thermal cycling tests and a constant humidity test. Several failures were seen with all PCB materials during the tests. However, no significant differences in the reliability of the different microvia layers was seen. Consequently, the composition of the microvia layer was not found to be critical to the reliability of the ACF interconnections.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114116270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Modelling of silicon carbide JFET in SPICE SPICE中碳化硅JFET的建模

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346919

K. Bargieł, D. Bisewski

引用次数: 2

Hydrogen sensing properties of SnO2 nanocrystalline thin films SnO2纳米晶薄膜的感氢性能

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346917

W. Izydorczyk, Natalia Niemiec, K. Waczyński, J. Uljanow

引用次数: 1

Polyimide foil flip-chip direct bonding 聚酰亚胺箔倒装芯片直接键合

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346897

Martin Deckert, Michael T. Lippert, J. Krzemiński, K. Takagaki, F. Ohl, B. Schmidt

{"title":"Polyimide foil flip-chip direct bonding","authors":"Martin Deckert, Michael T. Lippert, J. Krzemiński, K. Takagaki, F. Ohl, B. Schmidt","doi":"10.23919/EMPC.2017.8346897","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346897","url":null,"abstract":"Recent developments in the field of neuroprosthetics have created a demand for cost-effective advanced bonding techniques to mount polymer-based, thin-film, multi-electrode arrays onto PCBs. Low thicknesses of polymer substrates present challenges for common packaging technologies. Here we implemented a cost-effective direct bonding process of polyimide thin-film electrode arrays using vapor phase soldering. Our polymer foil is composed of PI-2611 and contains embedded gold/platinum/chromium traces. Contact pads are platinum coated and no under bump metallization is required. Instead of using wire bonding techniques, the contact pads are flip-chip bonded directly onto the PCB using a lead free solder paste. Transfer of the foil is carried out by vacuum placement. Soldering is subsequently performed in a vapor phase soldering oven. In contrast to wire bonding on flexible substrate materials, vapor phase soldering results in enhanced contact yield of approximately 99%. The landing area of the thin-film electrode, containing the soldered contact pads, is then passivated with a low-shrinkage epoxy in a pin-transfer process. Using such a low-shrinkage material is paramount to achieve sufficient long-term stability of the solder connections and to stabilize the thin polyimide substrate.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128675916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Data and power distribution via printed electronics in aerospace applications 航空航天应用中通过印刷电子器件的数据和功率分配

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346860

D. Gräf, J. Franke, Nils Ischdonat, M. Hedges, J. Hörber

引用次数: 5

Novel oxidoreductase-based sensor for optical neurotransmitter detection 光学神经递质检测的新型氧化还原酶传感器

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346928

S. Baluta, J. Cabaj, K. Malecha

{"title":"Novel oxidoreductase-based sensor for optical neurotransmitter detection","authors":"S. Baluta, J. Cabaj, K. Malecha","doi":"10.23919/EMPC.2017.8346928","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346928","url":null,"abstract":"In our previous work [1], we have reported the developed optical biosensor for detection of dopamine, where graphene quantum dots (GQDs) were used in the detection system. In such sensor dopamine molecules coated the GQD surface — as a result occurred quenching of fluorescence due to Resonance Energy Transfer (FRET). Changes in fluorescence corresponded to specific concentrations of the neurotransmitter in tested sample. Now we present constructed new optical biosensor for epinephrine detection, which proved a facile and convenient method for this neurotransmitter determination. Epinephrine does not possess any fluorescence properties in opposite to dopamine, so it was essential to prepare a new dye solution for detection system and carrier for epinephrine. The working Fe(II) solution was prepared freshly by mixing with the optimized alkaline buffer. To such prepared dye-solution epinephrine was added (different concentrations), and detected with LTCC (Low Temperature Co-fired Ceramics)-based sensor connected with immobilized biologically active material. An outer platinum electrode was modified with semi-conductive polymer layer based on 2-([2,2'-bithiophene]-5-yl)-6-([2,3'-bithiophene]-5'-yl)-4-(5-hexylthiophene-2-yl)pyridine and laccase, as a basis for determination system of epinephrine. In result, constructed biosensor exhibits good performance, strong affinity between enzyme and catecholamine, fast response and good linear range. Obtained results have shown that the developed system could be used in medical diagnostics for neurotransmitters convenient detection.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125358242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

High voltage WireLED powered directly by mains 230 Volts 高压由市电直接供电，电压230伏

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/empc.2017.8346883

Abdenacer Ait Mani, B. Bouillard, A. Gasse, M. Volpert, B. Soulier, D. Henry, A. Vandeneynde, B. Chambion, F. Mercier, P. Rueda, Vincent Beix, T. Lacave

{"title":"High voltage WireLED powered directly by mains 230 Volts","authors":"Abdenacer Ait Mani, B. Bouillard, A. Gasse, M. Volpert, B. Soulier, D. Henry, A. Vandeneynde, B. Chambion, F. Mercier, P. Rueda, Vincent Beix, T. Lacave","doi":"10.23919/empc.2017.8346883","DOIUrl":"https://doi.org/10.23919/empc.2017.8346883","url":null,"abstract":"For the need of energy saving, LEDs are taking more and more space in lighting modules. Moreover, LEDs add several applications to the lighting function, smartness, dimming, bio photonic applications, a lot of fields that none former light sources could reach [1]. The manufacturers of course must keep the target of making a device compatible with the standards in terms of safety first, but moreover the compactness and reliability with the well-known thermal issues, depending on the wall plug efficiency of the component. In order to manage all the mentioned points, as often, packaging is the key point if one seeks to maximize the lifetime of a LED based luminaire. Indeed, because they are aware of the existing technologies and comparison thanks to quick information available on the Internet, today's customers cannot accept to pay a more expensive light source that have lower performance than the former lighting technologies [2]. The paper that we propose describes the manufacturing and the packaging of a LED device made from GaN micro wires compatible with direct mains powering on the 230 Volts-50 Hz network. We show why the heterogeneous stack to manufacture the lighting device, coupled with the high voltage input is a big challenge. Once the front side wire LEDs patterning is finished, many technological steps remain in order to deliver a WLP assembly ready for the back-end assembly process. The carrier bonding, the back side processing for N and P contacts patterning, the hybridization by flip chip technology using copper bumps or solder balls are roughly described with the related issues. Final thermal and electrical characterizations were conducted to evaluate the performances of the high voltage LED device.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122873911","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Solvent-free fluxing underfill film for electrical interconnection 电气互连用无溶剂助熔剂底填料膜

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346850

Keon‐Soo Jang, Y. Eom, Kwang-Seong Choi, Hyun-Cheol Bae

{"title":"Solvent-free fluxing underfill film for electrical interconnection","authors":"Keon‐Soo Jang, Y. Eom, Kwang-Seong Choi, Hyun-Cheol Bae","doi":"10.23919/EMPC.2017.8346850","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346850","url":null,"abstract":"A variety of underfill materials as film-and paste-types have been developed for electronic package applications, as the die/pitch becomes thinner and finer, recently. The paste-based adhesion such as isotropic conductive pastes (ICPs) is hard to precisely control the required amount, resulting in surplus resins at edges and a laborious process. Common film-based adhesion is deficient in flux, limited to non-oxidizable electrode elements, like Au stud bumps. This film formation also requires solvents or additional UV-curable resins. Here, to overcome these drawbacks, we generated flux-infiltrated adhesive films via a solvent-free, thermally-induced film formation, based on our previous research involved with fluxing underfill pastes. Thermoplastic materials and heat-curable epoxy resins were utilized for newly designed films as a matrix and an adhesive, respectively. They were mixed together at a temperature between the thermoplastic melting and the beginning of epoxy cure to prevent solidification and reaction. The melt-mixture was coated and at the end cooled down onto plastic release films. This solvent-free, facile film fabrication is a promising pathway in terms of convenient processing conditions allowing a solvent-free process during film production. This film also provides a simultaneous fluxing/underfill function during reaction at a temperature where solder components are melted. This solvent-free non-conductive film (NCF) showed good solder wettability and transmittance ∼90%. Toward this end, the combination of thermoplastics and curable resin facilitates flux-adhesive film formation without a solvent and thus has potential to be used for a wide range of electronic package applications.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121631574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Influence of short voltage pulses on thick-film resistors at elevated temperature 高温下短电压脉冲对厚膜电阻的影响

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI: 10.23919/EMPC.2017.8346921

Damian Nowak, Konrad Idziorek

引用次数: 0