高压由市电直接供电,电压230伏

Abdenacer Ait Mani, B. Bouillard, A. Gasse, M. Volpert, B. Soulier, D. Henry, A. Vandeneynde, B. Chambion, F. Mercier, P. Rueda, Vincent Beix, T. Lacave
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引用次数: 0

摘要

由于节能的需要,led在照明模块中所占的空间越来越大。此外,led在照明功能、智能、调光、生物光子等诸多领域的应用都是以前的光源无法达到的[1]。当然,制造商必须保持目标,使设备在安全方面符合标准,但更重要的是紧凑性和可靠性与众所周知的热问题,这取决于组件的壁塞效率。为了管理所有提到的问题,通常情况下,如果寻求最大限度地延长LED灯具的使用寿命,封装是关键。事实上,由于互联网上的快速信息,他们了解现有的技术和比较,今天的客户无法接受支付比以前的照明技术性能更低的更昂贵的光源[2]。我们提出的论文描述了由GaN微线制成的LED器件的制造和封装,该器件与230伏-50赫兹网络上的直接电源供电兼容。我们展示了为什么异质堆叠制造照明器件,加上高压输入是一个很大的挑战。一旦前置线led图案化完成,还有许多技术步骤,以便为后端组装过程提供WLP组件。对载流子键合、N和P触点图案的背面加工、利用铜凸点或焊料球的倒装芯片技术进行杂化以及相关问题进行了粗略描述。最后进行了热学和电学表征,以评估高压LED器件的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High voltage WireLED powered directly by mains 230 Volts
For the need of energy saving, LEDs are taking more and more space in lighting modules. Moreover, LEDs add several applications to the lighting function, smartness, dimming, bio photonic applications, a lot of fields that none former light sources could reach [1]. The manufacturers of course must keep the target of making a device compatible with the standards in terms of safety first, but moreover the compactness and reliability with the well-known thermal issues, depending on the wall plug efficiency of the component. In order to manage all the mentioned points, as often, packaging is the key point if one seeks to maximize the lifetime of a LED based luminaire. Indeed, because they are aware of the existing technologies and comparison thanks to quick information available on the Internet, today's customers cannot accept to pay a more expensive light source that have lower performance than the former lighting technologies [2]. The paper that we propose describes the manufacturing and the packaging of a LED device made from GaN micro wires compatible with direct mains powering on the 230 Volts-50 Hz network. We show why the heterogeneous stack to manufacture the lighting device, coupled with the high voltage input is a big challenge. Once the front side wire LEDs patterning is finished, many technological steps remain in order to deliver a WLP assembly ready for the back-end assembly process. The carrier bonding, the back side processing for N and P contacts patterning, the hybridization by flip chip technology using copper bumps or solder balls are roughly described with the related issues. Final thermal and electrical characterizations were conducted to evaluate the performances of the high voltage LED device.
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