2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition最新文献

{"title":"The influence of environmental conditions on the properties of housing materials for power electronics","authors":"B. Böttge, R. Bernhardt, S. Klengel, Sebastian Wels, A. Claudi","doi":"10.23919/EMPC.2017.8346837","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346837","url":null,"abstract":"The study correlates the microstructure of different glass-fiber reinforced thermoplastics, used as housing materials in power electronics, to their electrical behavior under the influence of humidity and temperature. The results show how microstructural defects like voids within the matrix material or gaps between glass-fillers and the polymer matrix lead to an increased water absorption resulting in an elevated ion conductivity and a decrease of the dielectric strength. In addition, a novel specimen geometry is introduced, which allows a deeper study of the long-term behavior and the aging mechanisms of engineering plastics under different environmental conditions.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134478248","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Flip-chip bonding: How to meet high accuracy requirements?","authors":"Caroline Avrillier, P. Metzger","doi":"10.23919/EMPC.2017.8346863","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346863","url":null,"abstract":"This paper presents considerations on key parameters to obtain a high accuracy flip-chip bonding. Mutual interaction between three main blocks, the flip-chip bonder, the components to be bonded and the environment where the process is done is crucial. Three applications will illustrate these considerations.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131449266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Crystal plasticity modeling of the heat affected zone of copper micro-wires","authors":"A. Mazloum-Nejadari, M. Lederer, G. Khatibi, J. Nicolics","doi":"10.23919/EMPC.2017.8346893","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346893","url":null,"abstract":"Due to the ongoing miniaturization of electronic parts, there is the concern that the diameters of micro-wires approach the dimensions of the crystalline microstructure. Owing to fabrication technology and harsh environmental conditions during service, the wires are often exposed to elevated temperature. This leads to grain growth until the cross section of a wire includes only a few grains. In the worst case, wires develop a bamboo-microstructure, where the cross section of a wire is characterized by a single grain. In consequence, depending on the crystallographic orientation, some grains can deform by easy glide. Thereby, the yield stress is drastically reduced compared to polycrystalline materials. In conclusion, the reliability of electronic devices deteriorates. Such effects were studied in detail on the basis of Crystal Plasticity Finite Element simulations. Within this approach, every single grain is modelled according to its own orientation, and crystallographic slip develops on the glide systems with the highest Schmid factors during loading. During glide deformation the dislocation density of activated slip systems increases. This leads to strain hardening, since the dislocations of one glide system appear as forest dislocations for the other systems. In this way, the material strength of a grain depends on its deformation history. A grain embedded in a matrix of neighboring grain shows much higher resistance to plastic deformation than free standing grains. The material parameters of these simulations were chosen from literature to fit experiments for copper single crystals. The results of this study are well illustrated in several deformation plots relating the stress distributions to dislocation densities.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121167684","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Influence of thermal phenomena on characteristics of components of the IGBT module","authors":"P. Górecki, K. Górecki","doi":"10.23919/EMPC.2017.8346885","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346885","url":null,"abstract":"In the paper the results of measurements of the power module illustrating the influence of thermal phenomena on the course of dc characteristics of semiconductor devices contained in this module are presented. The considered module PSI25/06 by Power Sem contains in the common case 2 IGBTs and 2 diodes connected into one branch of an inverter and the thermistor. The influence of changes of the ambient temperature, self-heating phenomena and mutual thermal couplings between semiconductor devices contained in the considered module on their characteristics and on the case temperature of this module is considered.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124005334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effect of bonding conditions on shear strength of joints at 200 °C using Sn-coated Cu particle","authors":"H. Nishikawa, Xiangdong Liu, Siliang He","doi":"10.23919/EMPC.2017.8346890","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346890","url":null,"abstract":"As a recent trend, the silicon carbide (SiC) is of particular interest for semiconductor device. The SiC power device provides the possibility to develop the next-generation power conversion circuit with high efficiency and high power density. Compared with the conventional silicon (Si) device, the SiC device can operate with significant lower power loss and higher operating temperature, which contributes to miniaturization and higher performance of power modules. To assemble these power modules, the high temperature packaging technology such as die attach process is needed. As a die attach process, we focus on a solid-state bonding, which can be operated at a low temperatures. However, some drawbacks of this technology still remain. For example, the duration of this process is too long, up to a few hours, and multiple hours of annealing are required to achieve a thermodynamically stable joint. So we are studying on a solid-state bonding using Sn-coated Cu particles to reduce the bonding time. In this study, we evaluated the effect of bonding conditions on the shear strength of Cu/Cu joints at 200 t using a Sn-coated Cu particle paste and investigated a high temperature reliability of the joints. As a result, the average shear strength of Cu/Cu joints under a formic acid atmosphere was around 25 MPa at a bonding time of 20 min. Then, the joints had nearly 20MP shear strength after the isothermal aging at 250 t for 1000 h.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"250 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132375283","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"PDMS — LTCC lab on chip for photocatalytic effect analysis","authors":"W. Nawrot, Marta Fiedot-Toboła, K. Malecha","doi":"10.23919/EMPC.2017.8346925","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346925","url":null,"abstract":"The purpose of this research is to provide a tailor made tool for analysis of photocatalytic activity in quantum dot colloids (e.g. zinc oxide and titanium dioxide). It should be autonomous, easy and inexpensive to manufacture and use small quantities of analyte. A lab on chip device was developed using a hybrid polymer-ceramic technology for microreactor and inexpensive PCB (Printed Circuit Board) technology for electronic components. The spectrophotometric analysis was replaced with cheaper selective measurement using light emitting diodes (LEDs) and photodetectors. The device provides reliable absorbance measurement despite using simplified method. The expected photocatalytic effect is observable. Moreover, an unexpected photoluminescence phenomenon has probably been detected.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117016476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Analysis of propagation process of conductive electromagnetic disturbances in AC/DC low power converter","authors":"W. Sabat, D. Klepacki, Kazimierz Kuryło, K. Kamuda","doi":"10.23919/EMPC.2017.8346920","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346920","url":null,"abstract":"The results of the experimental work performed for the low power AC/DC model inverter have been presented in this paper. As part of the experimental work, the factors influencing the level and nature of the generated conductive disturbances were investigated. In accordance with the requirements of electromagnetic compatibility standards, each electronic device should have a level of emission of electromagnetic disturbances with a value not exceeding the values specified in the standards. On the example of a model inverter it was shown how the disturbances are generated, how they are propagated in the circuit and how the selection of components for application can influence on the level of generated disturbances.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128524003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Residual free solder process for fluxless solder pastes","authors":"A. Hanss, G. Elger","doi":"10.1108/SSMT-10-2017-0030","DOIUrl":"https://doi.org/10.1108/SSMT-10-2017-0030","url":null,"abstract":"Fluxless soldering, i.e. residue free soldering with the aid of gaseous activation is known for many years, but only well established in the field of opto-and microwave electronics. In low cost high volume applications this technology has not yet become mainstream. In the fluxless soldering the reducing of oxide layers and therefore the wetting of the solder is enabled by means of an activating process gas. After the soldering process, no cleaning process is necessary because no corrosive residues are left on the circuit boards and components. Therefore soldering using solder paste without aggressive chemical ingredients has a high market potential. Expensive preforms could be replaced by paste dispensing or paste printing. The reducing effect of gaseous activator like formic acid vapor on many solder alloys is known in practice. But a detailed scientific analysis on the corresponding reaction mechanisms, especially at the surfaces, only little is investigated. Different chemical reaction channels can occur on the solder surface, i.e. catalytically dissociation of formic acid on the pure or oxidized metal surface and the formation and evaporation of metal formates. In this paper, different solder alloys (SnAgCu, SnPb, BiSn, In) were analyzed with thermal gravimetric analysis (TGA) under formic acid flow. Details on mass change depended to the soldering temperature are presented. Activation temperatures are estimated and correlated to heating processes. Based on the analysis, fluxless solder pastes and suitable soldering processes are developed and presented. It is applied on high power unpackaged flip chip LEDs which can be assembled directly on a substrate. In this paper the main paste properties such as printability of a commercial flux solder paste with those of the fluxless solder paste are compared. Likewise, the soldering results after a reflow process of these different paste systems are evaluated and compared. The experimental results show that the thermogravimetric method is an efficient way to gain deeper understanding of the redox processes which occur under formic acid activation. It is possible to solder residue-free with a fluxless solder paste. The resulting solder joints have the same quality as those for standard solder paste in terms of voids detected by X-Ray, mechanical integrity by shear strength.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125858548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Ceramic packaging of PiezoMEMS devices","authors":"D. Belavic, G. Muscalu, K. Vojisavljević, M. Hodnik, D. Kuščer, T. Kos, Tanja Pečnik, S. Drnovsek, J. Zajac, B. Malič, Adrian Anghelescu","doi":"10.23919/EMPC.2017.8346888","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346888","url":null,"abstract":"In the contribution the design and the fabrication of two different types of ceramic packaging for PiezoMEMS devices is presented. The first ceramic packaging is designed for housing the piezoelectric energy harvester. This packaging is made using LTCC technology and in the final application will integrate piezoelectric device, electronic circuit, storage capacitor and other components into the complex microsystem. The second packaging is developed for piezoelectric vibrating device as a part of water-purification system. In this case, the thick-film technology is used for electrical interconnection of piezoelectric actuators and for the hermetic watertight insulation of the system.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122277185","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Silver sinter paste for SiC bonding with improved mechanical properties","authors":"W. Schmitt, Ly May Chew, D. Schnee","doi":"10.23919/EMPC.2017.8346905","DOIUrl":"https://doi.org/10.23919/EMPC.2017.8346905","url":null,"abstract":"Silver sintering become a common technology for high reliability or high temperature electronic devices. Different sintering processes are applied depending upon application requirements, for instance pressure sintering process is optimized for elevated life time power modules. The pressure of the sintering process can be adjusted in order to modify the properties of the sinter layer. In general, higher pressure or temperature leads to higher Young's modulus. With respect to the lifetime of an interconnection, the Young's modulus, the dimension of the connected area and the CTE mismatch of the joint materials play an important role in temperature cycling. Thermo-mechanical tension might not be reduced easily by the interconnection material if the Young's modulus of the material itself is too high. A brittle die attach material might crack due to the bending of the package caused by the CTE mismatch of the used materials. This leads to a degradation of thermal conductivity and a reduced life time of the components, particularly on components which are operated at above 175°C. Silver sinter material with a reduced Young's modulus as well as an adjusted CTE is desired to avoid crack, especially for the interconnection of large areas. This paper shows the change of mechanical properties, by adding non silver particles to the sinter paste. The Young's modulus became independent of process parameters. The silver sinter interconnection became stable against further thermal exposure.","PeriodicalId":329807,"journal":{"name":"2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition","volume":"318 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132746219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}