Ceramic packaging of PiezoMEMS devices

Abstract

In the contribution the design and the fabrication of two different types of ceramic packaging for PiezoMEMS devices is presented. The first ceramic packaging is designed for housing the piezoelectric energy harvester. This packaging is made using LTCC technology and in the final application will integrate piezoelectric device, electronic circuit, storage capacitor and other components into the complex microsystem. The second packaging is developed for piezoelectric vibrating device as a part of water-purification system. In this case, the thick-film technology is used for electrical interconnection of piezoelectric actuators and for the hermetic watertight insulation of the system.