倒装片键合:如何满足高精度要求?

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI:10.23919/EMPC.2017.8346863

Caroline Avrillier, P. Metzger

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引用次数: 4

摘要

本文介绍了实现高精度倒装芯片键合的关键参数。三个主要模块之间的相互作用是至关重要的:倒装芯片键合器、要键合的组件和完成该过程的环境。三个应用程序将说明这些考虑。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Flip-chip bonding: How to meet high accuracy requirements?

This paper presents considerations on key parameters to obtain a high accuracy flip-chip bonding. Mutual interaction between three main blocks, the flip-chip bonder, the components to be bonded and the environment where the process is done is crucial. Three applications will illustrate these considerations.

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2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

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