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2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)最新文献

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Experimentally validated aluminum nitride based pressure, temperature and 3-axis acceleration sensors integrated on a single chip 实验验证了基于氮化铝的压力、温度和3轴加速度传感器集成在单个芯片上
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765744
F. Goericke, K. Mansukhani, Kansho Yamamoto, A. Pisano
{"title":"Experimentally validated aluminum nitride based pressure, temperature and 3-axis acceleration sensors integrated on a single chip","authors":"F. Goericke, K. Mansukhani, Kansho Yamamoto, A. Pisano","doi":"10.1109/MEMSYS.2014.6765744","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765744","url":null,"abstract":"This paper reports a unified fabrication process used to build multiple Aluminum Nitride (AlN) based micro-electromechanical system (MEMS) sensors on a single chip. A fully functional AlN-based sensor cluster has been demonstrated and is presented in this paper. This sensor cluster is a “five degree-of-freedom” cluster; it measures 3-axis acceleration, temperature and pressure fabricated on a 1 cm × 1 cm die. In addition to utilizing AlN as both the structural and active layer of the sensors, this work is novel because all sensors are fabricated in the same fabrication run.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"241 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116293087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Encased cantilevers for low-noise force and mass sensing in liquids 用于液体中低噪声力和质量传感的封闭式悬臂梁
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765590
D. Ziegler, A. Klaassen, Dara Bahri, D. Chmielewski, A. Nievergelt, F. Mugele, J. Sader, P. Ashby
{"title":"Encased cantilevers for low-noise force and mass sensing in liquids","authors":"D. Ziegler, A. Klaassen, Dara Bahri, D. Chmielewski, A. Nievergelt, F. Mugele, J. Sader, P. Ashby","doi":"10.1109/MEMSYS.2014.6765590","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765590","url":null,"abstract":"Viscous damping severely limits the performance of resonator based sensing in liquids. We present encased cantilevers that overcome this limitation with a transparent and hydrophobic encasement built around the resonator. Only a few micrometers of the cantilever probe protrude from the encasement and water does not enter the encasement. This maintains high Q-factors and reduces the thermo-mechanical noise levels by over one order of magnitude and reaches minimal detectable forces of 12 fN/·Hz in liquids. These probes expand the frontiers of cantilever based sensing. We discuss their design and fabrication with special focus on squeeze film damping and demonstrate their successful application for quantitative mass sensing of single nanoparticles and gentle Atomic Force Microscopy imaging of soft matter in liquids.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"223 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124430597","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
A flexible tactile and shear sensing array fabricated by novel buckypaper patterning technique 一种柔性触觉与剪切传感阵列，采用新颖的纸模技术制作
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765671
Cheng-Wen Ma, Li-Sheng Hsu, Jui-Chang Kuo, Y. Yang
{"title":"A flexible tactile and shear sensing array fabricated by novel buckypaper patterning technique","authors":"Cheng-Wen Ma, Li-Sheng Hsu, Jui-Chang Kuo, Y. Yang","doi":"10.1109/MEMSYS.2014.6765671","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765671","url":null,"abstract":"In this work, we present a flexible tactile and shear sensing array utilizing patterned buckypaper as the sensing elements. A novel fabrication process for patterning buckypaper with high aspect ratio was proposed. The fabricated sensing device possesses the advantages such as anisotropic sensing capability, flexibility, simple fabrication, and low cost. The measured resistance vs. applied shear force on a single sensing element shows that the element exhibits different sensitivities along different directions. This anisotropic sensing capability can be employed for better shear sensing. The sensing elements also give good sensitivity and repeatability.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125977348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Fabrication of a monolithic microdischarge-based pressure sensor for harsh environments 用于恶劣环境的单片微放电压力传感器的研制
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765574
Xin Luo, C. K. Eun, Y. Gianchandani
{"title":"Fabrication of a monolithic microdischarge-based pressure sensor for harsh environments","authors":"Xin Luo, C. K. Eun, Y. Gianchandani","doi":"10.1109/MEMSYS.2014.6765574","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765574","url":null,"abstract":"This paper presents a 6-mask monolithic fabrication process for a pressure sensor that uses a differential microdischarge signal to sense diaphragm deflection. Microdischarge-based transduction is potentially advantageous for device miniaturization and harsh environments because of inherently large signals and immunity to temperature. This work reports a monolithic fabrication process that successfully addresses a number of challenges for microdischarge-based pressure sensors, such as three-dimensional (3D) electrical connection by electroplating laser-drilled through-glass vias (TGVs), and backside terminals for appropriate packages. The device has an exterior volume of 585×540×200 μm3 (0.05 mm3). Preliminary results show an estimated average sensitivity equivalent to 9,800 ppm/MPa over 0-40 MPa pressure range.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129478970","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
From chips to dust: The MEMS shatter secure chip 从芯片到尘埃:MEMS粉碎安全芯片
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765843
N. Banerjee, Y. Xie, M. M. Rahman, H. Kim, C. Mastrangelo
{"title":"From chips to dust: The MEMS shatter secure chip","authors":"N. Banerjee, Y. Xie, M. M. Rahman, H. Kim, C. Mastrangelo","doi":"10.1109/MEMSYS.2014.6765843","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765843","url":null,"abstract":"This paper presents the implementation of a transience mechanism for silicon microchips via low-temperature postprocessing steps that transform almost any electronic, optical or MEMS substrate chips into transient ones. Transience is achieved without any hazardous or explosive materials. Triggered chip transience is achieved by the incorporation of a distributed, thermally-activated expanding material on the chip backside. When heated at 160°C the expanding material produces massive chip cleavage mechanically shattering the chip into a heap of silicon dust.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128408822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Parametric filtering surpasses resonator noise in ALN contour-mode oscillators 参数滤波在ALN轮廓模振荡器中优于谐振腔噪声
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765880
C. Cassella, N. Miller, J. Segovia-Fernandez, G. Piazza
{"title":"Parametric filtering surpasses resonator noise in ALN contour-mode oscillators","authors":"C. Cassella, N. Miller, J. Segovia-Fernandez, G. Piazza","doi":"10.1109/MEMSYS.2014.6765880","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765880","url":null,"abstract":"In this work we present a new method to lower the phase noise in acoustic resonator based oscillators. This method uses the nonlinear dynamics of a parametric divider made to work close to the bifurcation region. We call this technique \"parametric filtering\". This approach was applied to an oscillator based on an aluminum nitride contour-mode resonator vibrating around 227 MHz. This class of resonators exhibits frequency flicker noise that limits the oscillator phase noise close to the carrier. By means of parametric filtering we obtained an improvement in the phase noise of more than 14 and 19 dB, respectively at 1 and 10 kHz offsets. This technique can be applied to any MEMS oscillator and represents the first demonstration of open loop phase noise filtering.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127261671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A CMOS MEMS Pirani vacuum gauge with complementary bump heat sink and cavity heater 一种带有互补凸形散热器和腔体加热器的CMOS MEMS皮拉尼真空计
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765731
Yi-Chiang Sun, K.-C Liang, Chao-Lin Cheng, W. Fang
{"title":"A CMOS MEMS Pirani vacuum gauge with complementary bump heat sink and cavity heater","authors":"Yi-Chiang Sun, K.-C Liang, Chao-Lin Cheng, W. Fang","doi":"10.1109/MEMSYS.2014.6765731","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765731","url":null,"abstract":"A novel CMOS-MEMS Pirani vacuum gauge with complementary bump heat-sink and cavity heater design has been proposed and demonstrated. This design using CMOS-MEMS process to offer the following advantages for Pirani gauge: (1) The bump heat-sink vertical integrates with cavity heater increases the dynamic range and sensitivity without changing device footprint size, (2) The cavity in heater reduces the thermal mass for low-power operation, and (3) Easy integration with packaged CMOS-MEMS devices for pressure monitoring [1]. The design is implemented using the standard TSMC 0.18μm 1P6M CMOS process. A 120μm×120μm die size with 0.53μm sensing gap is demonstrated. Measurement indicates the gauge has sensing range 0.3-100torr with sensitivity of 1.53×104(K/W)/torr. The power consumption is 67μW for 1% resistance change. In comparison, the gauge with typical heat-sink/heater design has sensing range 1-100torr with sensitivity of 0.99×104(K/W)/torr and power consumption of 119μW.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128963112","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Realization of 240 nanometer resolution of cell positioning by a virtual flow reduction mechanism 利用虚拟流量减少机制实现240纳米分辨率的细胞定位
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765820
S. Sakuma, Keisuke Kuroda, M. Kaneko, F. Arai
{"title":"Realization of 240 nanometer resolution of cell positioning by a virtual flow reduction mechanism","authors":"S. Sakuma, Keisuke Kuroda, M. Kaneko, F. Arai","doi":"10.1109/MEMSYS.2014.6765820","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765820","url":null,"abstract":"This paper presents the real-time precise positioning of a single cell with extremely high resolution. The positioning system is based on the visual feedback control of the syringe pump. The issue for using a syringe is that the flow rate is geometrically amplified in microchannel due to the ratio of cross sectional areas of the syringe and the microchannel. In order to overcome this issue, we introduce the virtual flow reduction mechanism. This mechanism utilizes the elasticity of poly-dimethylpolysiloxane (PDMS) microfluidic chip where the pressure peak is limited but the pressure response decreases with a sufficiently large time constant compared with the sampling time. By using this characteristic, we design and develop the system together with an online vision system. Through experiments, we could confirm that the cell positioning resolution is 240 nm corresponding to 1 pixel of the vision.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"8 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125655976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Nanoparticles sorting and assembly based on double-axicon in an optofluidic chip 基于双轴子的光流芯片纳米颗粒分选与组装
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765816
Y. Z. Shi, S. Xiong, L. K. Chin, M. Ren, A. Liu
{"title":"Nanoparticles sorting and assembly based on double-axicon in an optofluidic chip","authors":"Y. Z. Shi, S. Xiong, L. K. Chin, M. Ren, A. Liu","doi":"10.1109/MEMSYS.2014.6765816","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765816","url":null,"abstract":"This paper presents a novel optofluidic system for nanoparticle sorting by using interference patterns generated through a double-axicon. The tightly confined Bessel beam is used to sort the 200-nm and 500-nm polystyrene nanoparticles massively and simultaneously by adjusting the flow rate and the laser power. Additionally, 2-μm polystyrene particles are assembled into a 2D array by utilizing the discrete interference pattern. This system first utilizes the interference patterns based on the on-chip double-axicon, and integrates the sorting and assembly abilities into a single chip. It has a great potential in bacterial and DNA sorting and cell assembly.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130652696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Low-cost microbolometer with nano-scaled plasmonic absorbers for far infrared thermal imaging applications 用于远红外热成像应用的具有纳米等离子体吸收器的低成本微热计
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI: 10.1109/MEMSYS.2014.6765705
F. Utermohlen, D. B. Etter, David Borowsky, I. Herrmann, C. Schelling, F. Hutter, S. Sun, J. Burghartz
{"title":"Low-cost microbolometer with nano-scaled plasmonic absorbers for far infrared thermal imaging applications","authors":"F. Utermohlen, D. B. Etter, David Borowsky, I. Herrmann, C. Schelling, F. Hutter, S. Sun, J. Burghartz","doi":"10.1109/MEMSYS.2014.6765705","DOIUrl":"https://doi.org/10.1109/MEMSYS.2014.6765705","url":null,"abstract":"We present a scalable low-cost microbolometer technology platform which is based on separate fabrication of MEMS and read-out ASIC CMOS wafers. Mechanical, electrical and hermetical connection is achieved by Cu-based thermocompression bonding. The performance loss due to the resulting backside illumination of the sensor is compensated by an optimized microbolometer design including nano-scaled plasmonic absorbers, a dedicated pixel geometry and the use of highly temperature sensitive devices. The low-cost approach features CMOS compatible MEMS processes, wafer level packaging and uncooled operation of the sensor.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130672544","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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