{"title":"用于恶劣环境的单片微放电压力传感器的研制","authors":"Xin Luo, C. K. Eun, Y. Gianchandani","doi":"10.1109/MEMSYS.2014.6765574","DOIUrl":null,"url":null,"abstract":"This paper presents a 6-mask monolithic fabrication process for a pressure sensor that uses a differential microdischarge signal to sense diaphragm deflection. Microdischarge-based transduction is potentially advantageous for device miniaturization and harsh environments because of inherently large signals and immunity to temperature. This work reports a monolithic fabrication process that successfully addresses a number of challenges for microdischarge-based pressure sensors, such as three-dimensional (3D) electrical connection by electroplating laser-drilled through-glass vias (TGVs), and backside terminals for appropriate packages. The device has an exterior volume of 585×540×200 μm3 (0.05 mm3). Preliminary results show an estimated average sensitivity equivalent to 9,800 ppm/MPa over 0-40 MPa pressure range.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Fabrication of a monolithic microdischarge-based pressure sensor for harsh environments\",\"authors\":\"Xin Luo, C. K. Eun, Y. Gianchandani\",\"doi\":\"10.1109/MEMSYS.2014.6765574\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a 6-mask monolithic fabrication process for a pressure sensor that uses a differential microdischarge signal to sense diaphragm deflection. Microdischarge-based transduction is potentially advantageous for device miniaturization and harsh environments because of inherently large signals and immunity to temperature. This work reports a monolithic fabrication process that successfully addresses a number of challenges for microdischarge-based pressure sensors, such as three-dimensional (3D) electrical connection by electroplating laser-drilled through-glass vias (TGVs), and backside terminals for appropriate packages. The device has an exterior volume of 585×540×200 μm3 (0.05 mm3). Preliminary results show an estimated average sensitivity equivalent to 9,800 ppm/MPa over 0-40 MPa pressure range.\",\"PeriodicalId\":312056,\"journal\":{\"name\":\"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-03-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.2014.6765574\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2014.6765574","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fabrication of a monolithic microdischarge-based pressure sensor for harsh environments
This paper presents a 6-mask monolithic fabrication process for a pressure sensor that uses a differential microdischarge signal to sense diaphragm deflection. Microdischarge-based transduction is potentially advantageous for device miniaturization and harsh environments because of inherently large signals and immunity to temperature. This work reports a monolithic fabrication process that successfully addresses a number of challenges for microdischarge-based pressure sensors, such as three-dimensional (3D) electrical connection by electroplating laser-drilled through-glass vias (TGVs), and backside terminals for appropriate packages. The device has an exterior volume of 585×540×200 μm3 (0.05 mm3). Preliminary results show an estimated average sensitivity equivalent to 9,800 ppm/MPa over 0-40 MPa pressure range.