IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)最新文献_第5页

Human based knowledge for the probe failure pattern classification with the use of a backpropagation neural network. Application on submicron linear technologies 利用反向传播神经网络对探测器故障模式进行基于人的知识分类。亚微米线性技术的应用

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731547

C. Ortega, J. Ignacio, A. Montull, E. Sobrino

引用次数: 4

The quantitation of surface modifications in 200 and 300 mm wafer processing with an automated contact angle system 用自动接触角系统定量测定200和300毫米硅片加工过程中的表面变化

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731571

R. Carpio, D. Hudson

引用次数: 0

Advanced aqueous wafer cleaning in power semiconductor device manufacturing 功率半导体器件制造中先进的晶圆水清洗技术

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731561

R. Ridley, T. Grebs, J. Trost, R. Webb, M. Schuler, R.F. Longenberger, T. Fenstemacher, M. Caravaggio

{"title":"Advanced aqueous wafer cleaning in power semiconductor device manufacturing","authors":"R. Ridley, T. Grebs, J. Trost, R. Webb, M. Schuler, R.F. Longenberger, T. Fenstemacher, M. Caravaggio","doi":"10.1109/ASMC.1998.731561","DOIUrl":"https://doi.org/10.1109/ASMC.1998.731561","url":null,"abstract":"While the standard RCA wafer cleaning technique (Kern, 1970), is still predominantly used in semiconductor device manufacturing, several potential problems with this technique have been identified, such as surface roughness, contamination, chemical and DI water cost. Also, most of the work carried out in the area of wafer cleaning has been focused on the low power IC industry, where the active area of the device lay in the top 1 or 2 /spl mu/m of the wafer. However, in the discrete power device industry, the use of lateral and vertical current flow for high current density distribution means that the entire substrate becomes part of the device active area. Therefore, metallic contamination even in the silicon bulk can severely degrade device performance. In this study, a modified RCA wafer cleaning mixture with improved megasonic energy enhancement (Schulze and Deboy, Proc. SPIE vol. 2638, pp. 234-41, 1995) and various rinsing techniques is investigated for use in high-volume power semiconductor device manufacturing. The effectiveness of the modified dilute SC-1/SC-2 procedure is demonstrated by various material, electrical and optical analysis techniques such as ELYMAT, TXRF, laser particle counting and Wright etching. The overall advanced aqueous wafer cleaning technique shows excellent contamination removal, cleaning efficiencies /spl ges/95% at 0.15 /spl mu/m, and a reduced cost of ownership.","PeriodicalId":290016,"journal":{"name":"IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123526213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Beyond cost-of-ownership: a causal methodology for costing wafer processing 超越拥有成本:晶圆加工成本的因果方法

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731573

S. Miraglia, P. Miller, T. Richardson, G. Blunt, C. Blouin

{"title":"Beyond cost-of-ownership: a causal methodology for costing wafer processing","authors":"S. Miraglia, P. Miller, T. Richardson, G. Blunt, C. Blouin","doi":"10.1109/ASMC.1998.731573","DOIUrl":"https://doi.org/10.1109/ASMC.1998.731573","url":null,"abstract":"Classical cost-of-ownership data provides detailed cost data of equipment assets but does not provide wafer processing costs. Starting with a cost-of-ownership model, a wafer processing cost model was developed and validated. This cost-of-processing model provides wafer processing cost data from raw wafer through final passivation and parametric testing. This new model goes beyond classical cost-of-ownership data and captures more than just equipment costs-process, product, and fabricator costs are also captured. These costs are then causally spread to wafers via various algorithmic methodologies. In order to do this, some historical cost problems had to be addressed, such as how to properly weight equipment usage and account for dedicated equipment requirements, deal with measurement sampling, incorporate idle time and contingency, and account for different photolithographic field sizes. Output from the model was fully validated against actual spending and tied to accounting data in order to assure a full dollar capture. The model is currently being used for product costing, decision making, and cost reduction activities at the IBM Microelectronics Division Manufacturing Facility in Essex Junction, Vermont.","PeriodicalId":290016,"journal":{"name":"IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121238792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Uses of corona oxide silicon (COS) measurements for diffusion process monitoring and troubleshooting 使用电晕氧化物硅(COS)测量扩散过程监测和故障排除

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731569

R.G. Cosway, K.B. Catmull, J. Shray, R. Naujokaitis, M. Peters, D. Grant, G. Horner, B. Letherer

引用次数: 1

Simulation analysis of 300 mm intrabay automation vehicle capacity alternatives 300mm车厢内自动化车辆容量方案仿真分析

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731644

G. Mackulak, F. P. Lawrence, J. Rayter

引用次数: 16

Simulation of test wafer consumption in a semiconductor facility 半导体设备中测试晶圆消耗的模拟

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731576

B. Foster, D. Meyersdorf, J. M. Padillo, R. Brenner

引用次数: 18

A comparison of critical area analysis tools [IC yield] 临界面积分析工具的比较[IC成品率]

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731381

S. Fitzpatrick, G. O'Donoghue, G. Cheek

引用次数: 5

Process control and monitoring with laser interferometry based endpoint detection in chemical mechanical planarization 基于激光干涉法的化工机械刨平终点检测过程控制与监测

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731624

D. A. Chan, B. Swedek, A. Wiswesser, M. Birang

引用次数: 11

Correlation of digital image metrics to production ADC matching performance 数字图像指标与产品ADC匹配性能的相关性

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI: 10.1109/ASMC.1998.731407

J. Blais, V. Fischer, Y. Moalem, M. Saunders

引用次数: 6