A comparison of critical area analysis tools [IC yield]

S. Fitzpatrick, G. O'Donoghue, G. Cheek
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引用次数: 5

Abstract

The application of critical area analysis has become more mainstream in the semiconductor industry. The critical area of a circuit is a measure of the sensitivity of a product layout to defects, which is subsequently used in accurate yield models. Intuitively, if a circuit is more dense, the defect sensitivity is higher than a less dense circuit. Commercial tools have only recently become available to measure critical area. Several approaches have been developed to measure layout critical area. A short summary of each approach is described, as well as a brief description of how critical area is incorporated into a yield model. The results of applying critical area analysis tools are then described.
临界面积分析工具的比较[IC成品率]
在半导体工业中,临界区分析的应用已成为主流。电路的临界区域是衡量产品布局对缺陷的灵敏度,随后用于精确的良率模型。直观地说,如果一个电路密度越大,缺陷灵敏度就会比密度较小的电路高。商业工具直到最近才可用来测量关键区域。目前已有几种测量布局临界面积的方法。本文简要介绍了每种方法,并简要介绍了如何将关键区域纳入产量模型。然后描述应用关键区域分析工具的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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