M. Deng, C. Mukherjee, N. Davy, V. Nodjiadjim, M. Riet, C. Mismer, J. Renaudier, M. D. Matos, C. Maneux
{"title":"InP DHBT Characterization up to 500 GHz and Compact Model Validation Towards THz Circuit Design","authors":"M. Deng, C. Mukherjee, N. Davy, V. Nodjiadjim, M. Riet, C. Mismer, J. Renaudier, M. D. Matos, C. Maneux","doi":"10.1109/BCICTS50416.2021.9682466","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682466","url":null,"abstract":"We report on-wafer characterization results up to 500 GHz on a 0.4×5 μm2 InP/InGaAs DHBT. The measurements were performed using an on-wafer Thru-Reflect-Line (TRL) calibration kit especially developed in this technology. The resulting measurements allowed to validate both the RF performance of the 0.4-μm InP/InGaAs DHBT fabricated by III-V Lab, featuring 390/600 GHz ${f_{T}f_{{max}}}$, and the HiCuM compact model towards future circuit design at submillimeter-wave frequencies thanks to 90% typical yield reached in this technology.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"236 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133365850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"GaN and GaAs HEMT Channel Current Model for Nonlinear Microwave and RF Applications","authors":"A. Parker","doi":"10.1109/BCICTS50416.2021.9682497","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682497","url":null,"abstract":"An explicit drain current model accounts for channel charge and electron velocity in GaN and GaAs HEMTs. Saturated current is shown to be dependent on the bulk potential gradient and correct determination of mobility and peak velocity potential. As an advancement over existing approaches, the model produces an improved prediction of linearity and temperature dependence in a compact formulation. It offers superior high-order linearity prediction critical for wireless applications.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132882438","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R. Hersent, T. Johansen, V. Nodjiadjim, F. Jorge, B. Duval, F. Blache, M. Riet, C. Mismer, A. Konczykowska
{"title":"Design, Modelling and Characterization of a 3-Vppd 90-GBaud Over-110-GHz-Bandwidth Linear Driver in 0.5-μm InP DHBTs for Optical Communications","authors":"R. Hersent, T. Johansen, V. Nodjiadjim, F. Jorge, B. Duval, F. Blache, M. Riet, C. Mismer, A. Konczykowska","doi":"10.1109/BCICTS50416.2021.9682463","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682463","url":null,"abstract":"In this article, we present the modelling, design and characterization of a 3-Vppd linear-output-swing 90-GBd PAM-4 modulator driver, realised in III-V Lab's in-house 0.5-μm InP DHBT technology (380/520-GHz ${f_{T}/f_{{max}}}$, 4.2-V ${BV_{text{CE0}}}$). The driver exhibits 13-dB equalisation capabilities at 95 GHz with a bandwidth well beyond 110 GHz. It features a 0.67-W power consumption, resulting in a 1.5-GBd FoM with good output signal quality. To the best of our knowledge this linear driver shows the highest >64 GBd PAM-4 performance in current state-of-the-art, without DSP nor pre-emphasis. We also report on a newly developed 0.5-μm InP DHBT technology and its modelling using small-value external parasitic EM-simulation extraction, showing improved high-frequency prediction accuracy at circuit level.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123818491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Romstadt, H. Papurcu, Ahmad Zaben, Steffen Hansen, K. Aufinger, N. Pohl
{"title":"Comparison on spectral purity of two SiGe D-Band frequency octuplers in MIMO radar MMICs","authors":"J. Romstadt, H. Papurcu, Ahmad Zaben, Steffen Hansen, K. Aufinger, N. Pohl","doi":"10.1109/BCICTS50416.2021.9682491","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682491","url":null,"abstract":"This paper presents and compares the design and measurement results of two D-Band MIMO radar IC versions regarding their transmit paths in Infineon's $0.13 mu mathrm{m}$ SiGe BiCMOS technology B11HFC. Each MMIC is mounted on a testing PCB where a differential feeding structure is connected to a D-Band rectangular waveguide (RWG). Every MMIC has four transmit paths, which generate and drive the D-Band signals, and four receive paths. These signals result from frequency multiplication with octuplers that consist of bootstrapped frequency doublers, distribution networks, filters, and PAs. Due to minor changes to components at the beginning of the octupler chain, the second MMIC achieves a better spectral purity of the output signal. At the center frequency, the harmonic rejection increased by more than 13 dB with respect to unwanted frequency components in the D-Band. Overall, both versions have a measured 3 dB bandwidth of 37 GHz/31 GHz with a peak output power of −7.4 dBm/−4.7 dBm and a center frequency of 132.5 GHz/134.5 GHz.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"215 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127093230","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Sotoodeh, R. Urata, Xiang Zhou, L. Verslegers, Hong Liu
{"title":"Modulator Technologies for Intra-Datacenter Optical Interconnects Beyond 1Tbps","authors":"M. Sotoodeh, R. Urata, Xiang Zhou, L. Verslegers, Hong Liu","doi":"10.1109/BCICTS50416.2021.9682481","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682481","url":null,"abstract":"We review the technology options and challenges of scaling intra-datacenter optical interconnects beyond 1Tb/s. We examine if coherent technology has an immediate future in short reach applications. We provide an overview of the modulator technologies that help us realize this scaling task, with an emphasis on Silicon photonics. Finally, we highlight the importance of tighter electro-optical integration at high baud rates.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132269654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Teruo Jyo, M. Nagatani, M. Mutoh, Y. Shiratori, H. Wakita, Hiroyuki Takahashi
{"title":"An Over 130-GHz-Bandwidth InP-DHBT Baseband Amplifier Module","authors":"Teruo Jyo, M. Nagatani, M. Mutoh, Y. Shiratori, H. Wakita, Hiroyuki Takahashi","doi":"10.1109/BCICTS50416.2021.9682479","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682479","url":null,"abstract":"We designed and fabricated a wideband baseband amplifier module with 1-mm coaxial connectors for over 100-GHz-bandwidth applications. An amplifier IC was designed and fabricated in 250-nm InP DHBT technology. Two peaking methods were used in the amplifier IC to compensate for the loss from packaging. The amplifier IC was mounted on a quartz-based substrate by flip-chip bonding to avoid large loss and reflection. The impedance of RF lines on the substrate was designed by taking into account an underfill used to maintain the strength of the flip-chip bonding. The fabricated amplifier IC achieved a DC gain of 7.5 dB with a peaking gain of +6.4 dB at 175 GHz and a bandwidth of 208 GHz. The fabricated amplifier module achieved a DC gain of 7.3 dB with a bandwidth of over 130 GHz, the widest bandwidth ever reported among baseband amplifier modules.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"130 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132666869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Meneghini, N. Modolo, A. Nardo, C. D. Santi, Andrea Minetto, Luca Sayadi, C. Koller, S. Sicre, G. Prechtl, G. Meneghesso, E. Zanoni
{"title":"Charge Trapping in GaN Power Transistors: Challenges and Perspectives","authors":"M. Meneghini, N. Modolo, A. Nardo, C. D. Santi, Andrea Minetto, Luca Sayadi, C. Koller, S. Sicre, G. Prechtl, G. Meneghesso, E. Zanoni","doi":"10.1109/BCICTS50416.2021.9682455","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682455","url":null,"abstract":"Over the past decade, gallium nitride has emerged as an excellent semiconductor for the fabrication of power devices, to be used in energy conversion systems and switching-mode power converters. GaN and its alloys have a high breakdown field, a high saturation velocity and a wide energy gap, thus being suitable for high temperature and high voltage operation. The use of large-size silicon substrates allows large-wafer processing, with positive impact on cost reduction and yield. Further advantages will come from monolithic integration, that allows for the fabrication of fast and compact integrated circuits, all based on gallium nitride. Such integrated circuits will enable compact and high-frequency converter design, and will contribute to making gallium nitride a ubiquitous technology. This paper summarizes the most relevant properties of gallium nitride and related transistors, and describes the main challenges related to charge trapping in GaN HEMTs. Specific attention is given to the dynamic-on resistance process and to the hot-electron trapping phenomena, that have been recently investigated with the aim of ensuring reliable and high-frequency operation.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124086204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Žilak, Željko Osrečki, M. Koričić, F. Bogdanović, T. Suligoj
{"title":"Potential of High-Voltage Single-Emitter RESURF Horizontal Current Bipolar Transistor for RF Circuits","authors":"J. Žilak, Željko Osrečki, M. Koričić, F. Bogdanović, T. Suligoj","doi":"10.1109/BCICTS50416.2021.9682490","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682490","url":null,"abstract":"High-voltage single-emitter (HV SE) Horizontal Current Bipolar Transistor (HCBT) with CMOS $p$-well RESURF region is analyzed with respect to its utilization in RF circuits. If compared to the high-speed (HS) HCBT, it retains the high-frequency characteristics to a certain extent due to the reduced base-collector capacitance by the full depletion of $n$-collector region, which is also accompanied by the breakdown voltage increase (e.g., BVCEO from 3.4 V to 10.5 V). The minimum noise figure $NF_{min}$ of 1.2 dB at 0.9 GHz and 1.54 dB at 2.4 GHz is reported, which is by about 0.2 dB higher than in HS HCBT. Basically, the same linear operating area at low-voltage and high-current regions as in HS HCBT is achieved by transistor area increase, which is relevant for the Class-A power amplifiers. The examined device exhibits maximum output power of 19.3 dBm and gain of 17.3 dB in PldB at 0.9 GHz, $I_{C}=44.4 text{mA}$ and $V_{text{CE}}$ as high as 8 V. Therefore, the HV SE HCBT is shown to be suitable for the sub-5 GHz RF circuits, offering operation at higher $VCE$ attractive for high-voltage applications such as access points.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"173 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122821142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Bo-Jung Peng, S. Mothes, M. Annamalai, M. Schröter
{"title":"Evaluation of Stacked-CNTFET Structures for High-performance Applications","authors":"Bo-Jung Peng, S. Mothes, M. Annamalai, M. Schröter","doi":"10.1109/BCICTS50416.2021.9682469","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682469","url":null,"abstract":"The performance trade-off for FET structures with different arrangements of vertically stacked CNTs, including single columns and matrices, is investigated by 3D device simulation including known relevant physical effects such as carrier tunneling through the contact barriers, scattering transport in the channel and electrostatic screening effects. While a single tube gate-all-around (GAA) based structure provides highest drain current, it is not optimal for high-frequency applications and yields lower transistor speed compared to stacked structures with reduced gate metallization.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"153 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134353246","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Christoph Weimer, P. Sakalas, Markus Müller, G. Fischer, M. Schröter
{"title":"An Experimental Load-Pull Based Large-Signal RF Reliability Study of SiGe HBTs","authors":"Christoph Weimer, P. Sakalas, Markus Müller, G. Fischer, M. Schröter","doi":"10.1109/BCICTS50416.2021.9682473","DOIUrl":"https://doi.org/10.1109/BCICTS50416.2021.9682473","url":null,"abstract":"Results of a large-signal RF reliability study of SiGe HBTs are presented. The study consists of consecutive stress phases with different stress conditions. First, the DUT is stressed statically, which leads only to the widely reported excess base current at relatively low injection levels. Second, the DUT is stressed dynamically with voltage swings that significantly exceed the statically defined open-base collector-emitter breakdown voltage. The DUT withstands this type of stress, which proves SiGe HBTs to be extremely robust. Third, experimental evidence is established for significant degradation of the admittance parameters that occurs only under extreme nonlinear large-signal operation. Further experimental evidence suggests that the observed degradation occurs inside the internal HBT.","PeriodicalId":284660,"journal":{"name":"2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"137 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133850583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}