Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)最新文献_第2页

Creation and evaluation of compact models for thermal characterisation using dedicated optimisation software 使用专用优化软件创建和评估热特性的紧凑模型

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762447

C. Lasance, D. den Hertog, P. Stehouwer

引用次数: 96

Composite Materials for Electronic Packaging and Thermal Management 电子封装和热管理用复合材料

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762420

C. Zweben

引用次数: 2

Analytical forced convection modeling of plate fin heat sinks 板翅式散热器的强制对流分析模型

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762426

P. Teertstra, M. Yovanovich, J. Culham, T. Lemczyk

引用次数: 237

Junction-to-top and junction-to-board thermal resistance measurement for 119 BGA packages 119 BGA封装的结对顶和结对板热阻测量

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762441

T. Chung, M. Kim, J. Baek, S. Oh

{"title":"Junction-to-top and junction-to-board thermal resistance measurement for 119 BGA packages","authors":"T. Chung, M. Kim, J. Baek, S. Oh","doi":"10.1109/STHERM.1999.762441","DOIUrl":"https://doi.org/10.1109/STHERM.1999.762441","url":null,"abstract":"Junction-to-top (/spl theta//sub jt/) and junction-to-board (/spl theta//sub jb/) thermal resistance of a 119 BGA package for 4 Mbit SP SRAM have been investigated using the cold plate-Teflon block method and was compared with the junction-to-case thermal resistance (/spl theta//sub jc/) measurement method. Both thermal dice and real dice were prepared to measure the 119 BGA package thermal resistance. The junction-to-case and junction-to-top thermal resistance for a real die are about 3.5/spl deg/C/W and 3.8/spl deg/C/W respectively, whereas with a thermal die, the junction-to-case and junction-to-top thermal resistance are 4.0/spl deg/C/W and 4.8/spl deg/C/W respectively. For both thermal and real die, the junction-to-case thermal resistance is less than the junction-to-top thermal resistance. This is attributed to the different thermal boundary conditions applied to the 119 BGA package for each test method. In the meantime, thermal resistances of packages with thermal dice were approximately 14.3/spl sim/26.3% higher than those of package with real dice, the reason for which is being investigated.","PeriodicalId":253023,"journal":{"name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120989923","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Thermal modeling of diamond-based power electronics packaging 金刚石基电力电子封装的热建模

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762434

P. Fabis, D. Shum, H. Windischmann

引用次数: 66

Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods 基于DELPHI/SEED方法的有效部件边界无关紧凑热模型的生成与验证

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762449

H. Pape, G. Noebauer

{"title":"Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods","authors":"H. Pape, G. Noebauer","doi":"10.1109/STHERM.1999.762449","DOIUrl":"https://doi.org/10.1109/STHERM.1999.762449","url":null,"abstract":"In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), methods for thermal characterization of active components developed in DELPHI were evaluated by component suppliers. The methods were improved for practical application and extended to all IC package types. Test parts were chosen to cover as wide as possible a range of different plastic packages currently in use, including comparison of Alloy 42 (FeNi42) and Cu-based leadframe material, as well as a large and a small chip inside the same package, standard and thermally enhanced power devices, DSO, QFP and BGA packages. For all device types investigated, it was possible to generate simple resistor networks which reproduce junction temperatures and fluxes of a detailed finite element model for all 38 boundary conditions suggested in DELPHI with an average accuracy of 1-2%. Maximum errors are in general about 10% or less. As result of the SEED project, methods for thermal characterization of active components are available, which not only work in practice, but are also robust and low cost, because no test PCB is needed for measurements. Physically, they are much better suited to model validations than existing thermal resistance measurements. The resulting thermal resistor network allows end users for the first time to routinely predict the junction temperatures of components in their specific applications with an acceptable accuracy. The final goal of a simple and universal thermal characterization of electronic components is achieved. Standardization and adoption is in progress.","PeriodicalId":253023,"journal":{"name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128100514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 43

Analysis of the effect of bypass on the performance of heat sinks using flow network modeling (FNM) 利用流动网络模型(FNM)分析旁路对散热器性能的影响

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762427

A. Radmehr, K. Kelkar, P. Kelly, S. Patankar, S.S. Kang

引用次数: 11

A computational study of two phase jet impingement cooling of an electronic chip 电子芯片两相射流冲击冷却的计算研究

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762422

D. Wang, E. Yu, A. Przekwas

引用次数: 20

Evaluation of airflow prediction methods in compact electronic enclosures 小型电子机箱中气流预测方法的评价

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762428

Rebecca Biswas, Raghu, Agarwal, Avijit Goswami

{"title":"Evaluation of airflow prediction methods in compact electronic enclosures","authors":"Rebecca Biswas, Raghu, Agarwal, Avijit Goswami","doi":"10.1109/STHERM.1999.762428","DOIUrl":"https://doi.org/10.1109/STHERM.1999.762428","url":null,"abstract":"In forced convection cooled electronic enclosure design, one of the most important parameters is enclosure airflow. Enclosure airflow mainly depends upon enclosure pressure drop and fan characteristics. Fan curves are often used in conjunction with system pressure drop (impedance) characteristics to determine airflow. CFD tool accuracy depends mainly on accurate modeling of system pressure loss (grilles, filters, etc.) and fan curve data accuracy. The fan curves, which show fan air delivery capacity at various pressure drops, are usually generated with no obstructions close to the fan. However, electronic systems contain densely packaged components, including airflow obstructions such as inlet and outlet grilles in close proximity to the fan, so methods using fan curves can often be inaccurate for airflow prediction. Inaccuracies can also occur by using grille pressure loss data from handbooks. The objective of this study is to understand the accuracy of airflow prediction methods use pressure loss and fan curve data compared to experimental results obtained in a wind tunnel. The system used is representative of typical electronic systems, which include major components such as fans, inlet and outlet grilles and an array of stacked PCBs. Further components such as capacitors, inductors, transformers and heat sinks are also included to increase the total pressure drop. Base configuration variations are made by changing grille open area, fan size and using fans in series and parallel configurations. It is found that differences of up to 20% can occur depending on the method used to calculate flow.","PeriodicalId":253023,"journal":{"name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114968904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18

Measurements of adhesive bondline effective thermal conductivity and thermal resistance using the laser flash method 用激光闪光法测量胶结线的有效导热系数和热阻

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762433

R. Campbell, S.E. Smith, R. Dietz

{"title":"Measurements of adhesive bondline effective thermal conductivity and thermal resistance using the laser flash method","authors":"R. Campbell, S.E. Smith, R. Dietz","doi":"10.1109/STHERM.1999.762433","DOIUrl":"https://doi.org/10.1109/STHERM.1999.762433","url":null,"abstract":"Thermal modeling of device packages requires accurate thermophysical property data for package materials. Accurate data for the thermal resistance of the adhesive bondline used to attach a high power device to a substrate is critical because this thermal resistance can be a significant part of the total thermal resistance in the heat flow path from the device junction to the package case or ambient. The bondline thermal resistance can in principle be calculated by dividing the expected or measured bondline thickness by the adhesive thermal conductivity measured on a free-standing cured sample. However, at a typical bondline thickness of 15-75 /spl mu/m, the contact thermal resistance between the adhesive and its adherents can be significant compared to the intrinsic thermal resistance of the adhesive and thus cannot be ignored. Also, the thermal conductivity measured on a free-standing cured sample may not be equivalent to the thermal conductivity of the adhesive in the bonded assembly. This paper investigates some of the variables that determine adhesive bondline effective thermal conductivity and contact resistance. The results of multilayer laser flash diffusivity measurements are presented for a range of available adhesives in \"sandwich\" sample assemblies that simulate the package. Thermal conductivity measurements of the free-standing adhesives are also obtained by the laser flash method.","PeriodicalId":253023,"journal":{"name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134242496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 54