P. Teertstra, M. Yovanovich, J. Culham, T. Lemczyk
{"title":"板翅式散热器的强制对流分析模型","authors":"P. Teertstra, M. Yovanovich, J. Culham, T. Lemczyk","doi":"10.1109/STHERM.1999.762426","DOIUrl":null,"url":null,"abstract":"An analytical model is presented that predicts the average heat transfer rate for forced convection air cooled plate fin heat sinks for use in the design and selection of heat sinks for electronics applications. Using a composite solution based on the limiting cases of fully-developed and developing flow between isothermal parallel plates, the average Nusselt number can be calculated as a function of the heat sink geometry and fluid velocity. The resulting model is applicable for the full range of Reynolds number, 0.1<Re/sub b/*<100, and accurately predicts the experimental results to within an RMS difference of 2.1%.","PeriodicalId":253023,"journal":{"name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"237","resultStr":"{\"title\":\"Analytical forced convection modeling of plate fin heat sinks\",\"authors\":\"P. Teertstra, M. Yovanovich, J. Culham, T. Lemczyk\",\"doi\":\"10.1109/STHERM.1999.762426\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An analytical model is presented that predicts the average heat transfer rate for forced convection air cooled plate fin heat sinks for use in the design and selection of heat sinks for electronics applications. Using a composite solution based on the limiting cases of fully-developed and developing flow between isothermal parallel plates, the average Nusselt number can be calculated as a function of the heat sink geometry and fluid velocity. The resulting model is applicable for the full range of Reynolds number, 0.1<Re/sub b/*<100, and accurately predicts the experimental results to within an RMS difference of 2.1%.\",\"PeriodicalId\":253023,\"journal\":{\"name\":\"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-03-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"237\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.1999.762426\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1999.762426","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analytical forced convection modeling of plate fin heat sinks
An analytical model is presented that predicts the average heat transfer rate for forced convection air cooled plate fin heat sinks for use in the design and selection of heat sinks for electronics applications. Using a composite solution based on the limiting cases of fully-developed and developing flow between isothermal parallel plates, the average Nusselt number can be calculated as a function of the heat sink geometry and fluid velocity. The resulting model is applicable for the full range of Reynolds number, 0.1
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