Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)

Experimental validation of numerical heat transfer predictions for singleand multi-component printed circuit boards in natural convection environments

Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762429 P. Rodgers, V. Eveloy, J. Lohan, Carl-Magnus Fager, P. Tiilikka, J. Rantala

Compact thermal models of conduction cooled packages

Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762452 A. Ortega, A. Aranyosi, R. Griffin, S. West, D. Edwards

Thermal design for flip chip on board in natural convection

Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762438 Chul-Bee Hwang