电子芯片两相射流冲击冷却的计算研究

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI:10.1109/STHERM.1999.762422

D. Wang, E. Yu, A. Przekwas

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引用次数: 20

摘要

建立并演示了硅芯片射流冲击冷却的两相模型。采用欧拉双流体模型求解相变冷却剂的沸腾传热问题。模拟结果预测了整体冷却性能，与实验数据吻合较好。发现自然对流冷却方案的沸腾效应比射流冲击方案更为明显。在射流撞击情况下，也观察到沸腾效应的饱和点。对于所考虑的芯片的冲击射流冷却，也找到了一个优化的流量。

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A computational study of two phase jet impingement cooling of an electronic chip

A two phase model has been developed and demonstrated for jet impingement cooling of a silicon chip. The Eulerian two-fluid model is applied for resolution of boiling heat transfer of a phase-change coolant. The simulation result predicts the overall cooling performance and is in reasonably good agreement with the reported experimental data. The boiling effect is found to be more pronounced for natural convection cooling than for the jet impingement scheme. A saturation point of the boiling effect is also observed in the jet impingement case. An optimized flow rate has also been found for the impingement jet cooling of the chip considered.

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Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)

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