Composite Materials for Electronic Packaging and Thermal Management

This paper discusses the investigation of module cooling utilizing an enhanced thermosyphon heat loop as an alternative to direct air cooling or liquid-to-air cooling with forced convection of the liquid. Using water as the working fluid in the thermosyphon. experiments were conducted investigating the effects of fill volume, heat load, and condenser air flow rate on overall thermosyphon performance in terms of thermal resistance. Enhancement of evaporator performance using fins was also investigated and the results are reported in the paper.