Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)最新文献_第3页

Measurement and simulation of junction to board thermal resistance and its application in thermal modeling 结板热阻的测量与仿真及其在热建模中的应用

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762450

B. Joiner, V. Adams

引用次数: 21

Optimizing cost and thermal performance: rapid prototyping of a high pin count cavity-up enhanced plastic ball grid array (EPBGA) package 优化成本和热性能:高引脚数空腔增强型塑料球栅阵列(EPBGA)封装的快速原型设计

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762440

B. Zahn

{"title":"Optimizing cost and thermal performance: rapid prototyping of a high pin count cavity-up enhanced plastic ball grid array (EPBGA) package","authors":"B. Zahn","doi":"10.1109/STHERM.1999.762440","DOIUrl":"https://doi.org/10.1109/STHERM.1999.762440","url":null,"abstract":"A three-dimensional finite element model of a 420 lead (5 row perimeter) cavity-up enhanced plastic ball grid array (EPBGA) package was developed using the ANSYS/sup TM/ finite element simulation code. The developed model was utilized to perform a sensitivity analysis in order to quantify the effects of varying package and system motherboard designs. Design variables included: (1) chip size; (2) package substrate metallized plane layers; (3) motherboard metallized plane layers; (4) inner solder ball matrix and vias; (5) package aluminum heat spreader thickness; and (6) chip power dissipation. Predicted package junction-to-ambient thermal resistance (/spl theta//sub JA/) values were used in conjunction with a central composite design of experiments to develop a response surface equation which quickly predicts EPBGA package thermal performance as a function of the six design variables. The methodology described allows for rapid analysis of design options in the \"dynamic\" environment of prototyping, and the implementation of optimized cost effective package designs to meet required standards under multiple customer environments.","PeriodicalId":253023,"journal":{"name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125455110","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Thermal performance of single- and joint-extrusions with discrete heat sources 具有离散热源的单一和联合挤压材料的热性能

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762430

B. Lall

引用次数: 0

Thermal management of heat spreader materials for flip chip type package 倒装式封装散热材料的热管理

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762435

Y. Hirose, S. Yamagata, M. Imamura, Y. Abe, A. Fukui, M. Shimazu, N. Fujimori

引用次数: 6

Performance comparison of BGA and flex-CSP using parametric FEA models 基于参数化有限元模型的BGA和flex-CSP性能比较

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762437

B. Lall

引用次数: 4

Active thermal spreader with solid coolant 主动热扩散与固体冷却剂

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762423

J. Batchelder

引用次数: 0

Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module 用于高性能电子模块冷却的增强型热虹吸热回路的实验研究

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762421

R. C. Chu, R. Simons, G. Chrysler

引用次数: 30

Thermal impact of solder voids in the electronic packaging of power devices 电力器件电子封装中焊料空洞的热影响

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI: 10.1109/STHERM.1999.762424

N. Zhu

{"title":"Thermal impact of solder voids in the electronic packaging of power devices","authors":"N. Zhu","doi":"10.1109/STHERM.1999.762424","DOIUrl":"https://doi.org/10.1109/STHERM.1999.762424","url":null,"abstract":"The subject of this paper is the thermal impact of solder voids in the electronic packaging of semiconductor power devices. First, the pros and cons of some conventional methods used in thermal analysis are assessed, with emphasis on the accuracy of the commonly-used 45/spl deg/ model in calculating thermal resistance. Finite element thermal analysis is then applied to the case of different solder voids, which are classified and modeled numerically. The thermal resistance for each case is calculated and compared. It is found that different kinds of solder voids have a quite different impact upon the overall package thermal impedance. Large, coalesced voids have a more significant effect than small, distributed voids. The influence of solder voids on the example of a semiconductor laser chip is also analyzed. It is found that the long strip-type heat generating areas/volumes associated with semiconductor laser chips result in a strong sensitivity to the orientation of solder voids underneath. Finally, solder joint inspection criteria outlined in MIL-STD-883D method 2030 are discussed. Some possible modifications are proposed for the inspection of solder joints in semiconductor laser chip bonding.","PeriodicalId":253023,"journal":{"name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133851851","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 62