结板热阻的测量与仿真及其在热建模中的应用

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI:10.1109/STHERM.1999.762450

B. Joiner, V. Adams

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引用次数: 21

摘要

结对板热阻/spl θ //sub JB/或θ JB，是表面贴装集成电路封装相对于印刷电路板温度的热性能的优劣指标。描述了通过测量或模拟确定/spl θ //sub JB/的方法。在热建模中使用/spl theta//sub JB/的示例以及预期精度的估计。与基于结对环境热阻的热性能估计相比，该模型提供了实质性的精度改进。

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Measurement and simulation of junction to board thermal resistance and its application in thermal modeling

The junction-to-board thermal resistance, /spl theta//sub JB/ or theta JB, is a figure of merit for the thermal performance of surface mount integrated circuit packages relative to the printed circuit board temperature. The determination of /spl theta//sub JB/ by measurement or simulation is described. Examples of the use of /spl theta//sub JB/ in thermal modeling are provided along with estimates of anticipated accuracy. This model provides substantial accuracy improvements over estimates of thermal performance based on junction-to-ambient thermal resistance.

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Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)

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