具有离散热源的单一和联合挤压材料的热性能

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI:10.1109/STHERM.1999.762430

B. Lall

{"title":"具有离散热源的单一和联合挤压材料的热性能","authors":"B. Lall","doi":"10.1109/STHERM.1999.762430","DOIUrl":null,"url":null,"abstract":"A comparative investigation of single- and joint-extrusion approaches to the cooling of discrete heat sources is presented. An analytical approach based on iterations of a conjugate thermal network is presented to provide first-order approximations of the thermal design in quick solution times. Correlations are presented for fin-usage-partitioning due to differences in device location and power for the joint-extrusion approach. CFD results were found to be in good agreement with experimentally measured results. CFD solution is recommended for design refinement beyond the quick-solution first-order design of the analytical scheme.","PeriodicalId":253023,"journal":{"name":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal performance of single- and joint-extrusions with discrete heat sources\",\"authors\":\"B. Lall\",\"doi\":\"10.1109/STHERM.1999.762430\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A comparative investigation of single- and joint-extrusion approaches to the cooling of discrete heat sources is presented. An analytical approach based on iterations of a conjugate thermal network is presented to provide first-order approximations of the thermal design in quick solution times. Correlations are presented for fin-usage-partitioning due to differences in device location and power for the joint-extrusion approach. CFD results were found to be in good agreement with experimentally measured results. CFD solution is recommended for design refinement beyond the quick-solution first-order design of the analytical scheme.\",\"PeriodicalId\":253023,\"journal\":{\"name\":\"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-03-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.1999.762430\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1999.762430","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

对离散热源的单挤压和联合挤压冷却方法进行了比较研究。提出了一种基于共轭热网络迭代的解析方法，可在快速求解时间内提供热设计的一阶近似。由于联合挤压方法的设备位置和功率的差异，提出了鳍片使用分区的相关性。计算结果与实验测量结果吻合较好。在分析方案的快速解决一阶设计之外，建议采用CFD解决方案进行设计改进。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Thermal performance of single- and joint-extrusions with discrete heat sources

A comparative investigation of single- and joint-extrusion approaches to the cooling of discrete heat sources is presented. An analytical approach based on iterations of a conjugate thermal network is presented to provide first-order approximations of the thermal design in quick solution times. Correlations are presented for fin-usage-partitioning due to differences in device location and power for the joint-extrusion approach. CFD results were found to be in good agreement with experimentally measured results. CFD solution is recommended for design refinement beyond the quick-solution first-order design of the analytical scheme.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)

自引率

0.00%

发文量