用于高性能电子模块冷却的增强型热虹吸热回路的实验研究

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) Pub Date : 1999-03-09 DOI:10.1109/STHERM.1999.762421

R. C. Chu, R. Simons, G. Chrysler

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引用次数: 30

摘要

本文讨论了利用增强型热虹吸热回路作为直接空气冷却或液体对空气强制对流冷却的替代方案的模块冷却研究。以水作为热虹吸管的工作流体，通过实验研究了填充体积、热负荷和冷凝器空气流量对热虹吸管整体热阻性能的影响。本文还对利用翅片提高蒸发器性能进行了研究，并报道了研究结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module

This paper discusses the investigation of module cooling utilizing an enhanced thermosyphon heat loop as an alternative to direct air cooling or liquid-to-air cooling with forced convection of the liquid. Using water as the working fluid in the thermosyphon, experiments were conducted to investigate the effects of fill volume, heat load, and condenser air flow rate on overall thermosyphon performance in terms of thermal resistance. Enhancement of evaporator performance using fins was also investigated and the results are reported in the paper.

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来源期刊

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)

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