2020 IEEE International Test Conference (ITC)最新文献

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Streaming Scan Network (SSN): An Efficient Packetized Data Network for Testing of Complex SoCs 流扫描网络(SSN):用于复杂soc测试的高效分组数据网络
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325233
J. Cote, M. Kassab, W. Janiszewski, Ricardo Rodrigues, Reinhard Meier, Bartosz Kaczmarek, P. Orlando, G. Eide, J. Rajski, G. Colón-Bonet, N. Mysore, Ya Yin, P. Pant
{"title":"Streaming Scan Network (SSN): An Efficient Packetized Data Network for Testing of Complex SoCs","authors":"J. Cote, M. Kassab, W. Janiszewski, Ricardo Rodrigues, Reinhard Meier, Bartosz Kaczmarek, P. Orlando, G. Eide, J. Rajski, G. Colón-Bonet, N. Mysore, Ya Yin, P. Pant","doi":"10.1109/ITC44778.2020.9325233","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325233","url":null,"abstract":"System-on-Chip (SoC) designs are increasingly difficult to test using traditional scan access methods without incurring inefficient test time, high planning effort, and physical design/timing closure challenges. The number of cores keeps growing while chip pin counts available for scan remain constant or decline, limiting the ability to drive cores concurrently. With increasingly commonplace tiling and abutment, the scan distribution hardware must be placed inside the cores, making balanced pipelining when broadcasting to identical cores difficult. optimizing test time requires analyzing all the cores and subsequently changing the test hardware in the cores. Internal shift speed constraints may limit the ability to shift data in and out of the chip at high rates. Differences in pattern counts or scan chain lengths between cores tested in parallel can result in padding and increased test time. SSN is a bus-based scan data distribution architecture designed to address all these challenges. It enables simultaneous testing of any number of cores even with few chip I/Os. It facilitates short test time by enabling high-speed data distribution, by efficiently handling imbalances between cores, and by supporting testing of any number of identical cores with a constant cost. It provides a plug-and-play interface in each core that is well suited for abutted tiles, and simplifies scan timing closure. This paper also compares the test cost and implementation productivity of SSN with those of Intel’s Structural Test Fabric.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125422512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Online Fault Detection in ReRAM-Based Computing Systems by Monitoring Dynamic Power Consumption 基于动态功耗监测的rerram计算系统在线故障检测
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325259
Mengyun Liu, K. Chakrabarty
{"title":"Online Fault Detection in ReRAM-Based Computing Systems by Monitoring Dynamic Power Consumption","authors":"Mengyun Liu, K. Chakrabarty","doi":"10.1109/ITC44778.2020.9325259","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325259","url":null,"abstract":"A ReRAM-based computing system (RCS) provides an energy-efficient hardware implementation of vector-matrix multiplication for machine-learning hardware. However, it is vulnerable to faults due to the immature ReRAM fabrication process. We propose an efficient online fault-detection method for RCS; the proposed method monitors the dynamic power consumption of each ReRAM crossbar and determines the occurrence of faults when a changepoint is detected in the monitored power-consumption time series. In order to estimate the percentage of faulty cells in a faulty ReRAM crossbar, we compute statistical features before and after the changepoint and train a predictive model using machine-learning techniques. In this way, the computationally expensive fault localization and error-recovery steps are carried out only when a high fault rate is estimated. Simulation results show that, with the fault-detection method and the predictive model, the test time is significantly reduced while high classification accuracy for the MNIST and CIFAR-10 datasets using RCS can still be ensured.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126248686","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Die-to-Die Testing and ECC Error Mitigation in Automotive and Industrial Safety Applications 汽车和工业安全应用中的模对模测试和ECC错误缓解
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325242
Gabriele Boschi, Elisa Spano, H. Grigoryan, Arun Kumar, Gurgen Harutunyan
{"title":"Die-to-Die Testing and ECC Error Mitigation in Automotive and Industrial Safety Applications","authors":"Gabriele Boschi, Elisa Spano, H. Grigoryan, Arun Kumar, Gurgen Harutunyan","doi":"10.1109/ITC44778.2020.9325242","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325242","url":null,"abstract":"Two significant trends can be nowadays seen in automotive and industrial applications: an increase of the amount of data that is stored and elaborated by those systems, thus requiring bigger on-board DRAMs (Dynamic Random Access Memories), and the strict demands for reliability and safety. Safety is ruled by standards, that impose requirements for acceptable FIT rate–one of the most common metrics used for quantitatively evaluating the effects of such errors. It is then relevant to investigate the errors that can occur in DRAMs and propose mitigation techniques to deal with them. In this paper, die-to-die testing scenario is considered, and a methodology is described for mitigating the effects of errors by using well-known Error Correcting Codes (ECC). An advanced ECC solution is then presented along with the infrastructure needed for effectively testing DRAMs, including soft errors and permanent faults. The FIT rates calculations are finally considered, together with examples and case studies illustrating the effectiveness of the proposed solution.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"237 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122964580","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Improved Chain Diagnosis Methodology for Clock and Control Signal Defect Identification 时钟与控制信号缺陷识别的改进链诊断方法
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325236
Bharath Nandakumar, Sameer Chillarige, Anil Malik, Atul Chabbra, Nicholai L'Esperance, Robert Redburn
{"title":"Improved Chain Diagnosis Methodology for Clock and Control Signal Defect Identification","authors":"Bharath Nandakumar, Sameer Chillarige, Anil Malik, Atul Chabbra, Nicholai L'Esperance, Robert Redburn","doi":"10.1109/ITC44778.2020.9325236","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325236","url":null,"abstract":"The main goal of existing scan chain diagnosis approaches is to identify a point (or range of points) in the scan chain(s) at which values are directly corrupted due to a defect. A common assumption made in these techniques is the defect causing failure is in the scan chain/path itself. Based on the real silicon failure analysis over years, this assumption is often found to be correct, but not always. Specifically, in cases where a single defect is expected (stress fails and field returns), yet multiple chains fail, this assumption is more often incorrect. In these cases, the defect was found to be in the clock and control signal logic. This paper proposes an improved approach to diagnose defects on clock and control signal lines to enhance accuracy of scan chain diagnosis. Experimental results on injected clock and control signal defects demonstrate the effectiveness of the proposed technique. Physical Failure Analysis (PFA) on selected silicon devices confirmed the results of proposed technique.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115872039","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Novel Eye Diagram Estimation Technique to Assess Signal Integrity in High-Speed Memory Test 基于眼图估计的高速记忆测试信号完整性评估方法
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325279
Youngsu Oh, Dongmin Han, Byeongseon Go, Seungtaek Lee, Woosik Jeong
{"title":"Novel Eye Diagram Estimation Technique to Assess Signal Integrity in High-Speed Memory Test","authors":"Youngsu Oh, Dongmin Han, Byeongseon Go, Seungtaek Lee, Woosik Jeong","doi":"10.1109/ITC44778.2020.9325279","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325279","url":null,"abstract":"This paper presents a method for the evaluation of the eye diagram of a signal by analyzing the atypical Shmoo plot extracted from an automatic test equipment using a loopback technique. The loopback technique was used to minimize the external noise generated by an oscilloscope, thereby making it easier to measure the signals and collect raw data. In addition, the Shmoo plot extracted using a shorting package enables analyses of the signals entering the device in actual situations. Subsequently, an analysis tool was developed to investigate characteristics of the extracted atypical Shmoo plot, such as jitter, rise and fall time, and signal data rate. Furthermore, this tool indicates the signal loss rate for all the pass zones and center point deviations in the eye diagram. The analysis tool produces an eye diagram from the extracted Shmoo plot to determine the signal quality status and also statistically analyzes the extracted raw data to determine the process capability of the automatic test equipment.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125624414","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SAT-ATPG Generated Multi-Pattern Scan Tests for Cell Internal Defects: Coverage Analysis for Resistive Opens and Shorts SAT-ATPG生成的电池内部缺陷的多模式扫描测试:电阻开路和短路的覆盖分析
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325240
Sujay Pandey, Zhiwei Liao, Shreyas Nandi, Sanya Gupta, S. Natarajan, Arani Sinha, A. Singh, A. Chatterjee
{"title":"SAT-ATPG Generated Multi-Pattern Scan Tests for Cell Internal Defects: Coverage Analysis for Resistive Opens and Shorts","authors":"Sujay Pandey, Zhiwei Liao, Shreyas Nandi, Sanya Gupta, S. Natarajan, Arani Sinha, A. Singh, A. Chatterjee","doi":"10.1109/ITC44778.2020.9325240","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325240","url":null,"abstract":"Recent advances in process technology have resulted in novel defect mechanisms making the test generation process very challenging. In addition to complete opens and shorts that can be represented via extreme defect resistance magnitudes, partial resistive opens and shorts are also of concern in deeply scaled CMOS technologies. For open defects with intermediate defect magnitude values, it has been shown that multi-pattern tests are necessary for defect exposure. We extend this approach to short defects with intermediate defect magnitude values to obtain a suite of multi-pattern tests for standard cell instances that cover complete as well as partial intra-cell open and short defects. A hierarchical scan-compatible SAT-based test generation approach for full scan sequential circuits is then proposed that allows such multi-pattern tests to be applied to the circuit via the scan infrastructure. A key innovation is the combined use of shift and capture operations along with launch-on-capture and launch-on-shift scan based test application for increased defect coverage. Resulting defect coverage improvements over conventional two-pattern tests are demonstrated on ISCAS89 benchmark circuits.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124429199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A Weak Asynchronous RESet (ARES) PUF Using Start-up Characteristics of Null Conventional Logic Gates 利用零逻辑门启动特性的弱异步复位(ARES) PUF
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325278
Sreeja Chowdhury, R. Y. Acharya, William Boullion, A. Felder, Mark Howard, J. Di, Domenic Forte
{"title":"A Weak Asynchronous RESet (ARES) PUF Using Start-up Characteristics of Null Conventional Logic Gates","authors":"Sreeja Chowdhury, R. Y. Acharya, William Boullion, A. Felder, Mark Howard, J. Di, Domenic Forte","doi":"10.1109/ITC44778.2020.9325278","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325278","url":null,"abstract":"Physical unclonable functions (PUFs) are widely researched security primitive in the digital and analog domain but have yet to be explored for asynchronous circuits. In this paper, we propose novel optimization methods to design a weak Asynchronous RESet (ARES) PUF that exploits random start-up characteristics of Threshold M of N Null Conventional Logic (NCL) gates as a source of entropy. We employ two different methods to design the ARES PUF. The first includes traditional delay matching techniques using linear programming-based optimization, whereas the second one uses the genetic algorithm (GA) with delay matching as a fitness function. Both methodologies are explained with analysis and design specifications required to model NCL TH22 gates to achieve PUF characteristics. Threshold 2 of 2 (TH22) and 4 of 4 (TH44) gates are used as test cases for evaluation and comparison. Simulation results using initial delay matching techniques at 90nm and 65nm technology in HSPICE shows that the proposed ARES PUF has a uniqueness of 49.98% and reliability of 96.53% across $V_{DD} $ variation (± 10%) and 93.39% across temperature variation $(0^{circ}C- 80^{circ}C)$. Whereas, the GA method can optimize NCL cells to form a PUF with 49% uniqueness at 65nm with an average reliability of 96.4% across $V_{DD} $ and 93.82% across temperature. Preliminary silicon results for proposed TH22 at TSMC 90nm technology node shows a 34% improvement in uniqueness compared to standard TH22 gate with best-case uniqueness of 53.3% and reliability of 100% respectively across repeated measurements (noise). Unlike standard TH22, standard TH44 performs better with 47.62% best-case uniqueness and 98.1% reliability.1","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116679429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Automating Design For Yield: Silicon Learning to Predictive Models and Design Optimization 自动化设计为产量:硅学习预测模型和设计优化
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325263
S. Venkataraman, Pongpachara Limpisathian, P. Meinerzhagen, S. Natarajan, Eric Yang
{"title":"Automating Design For Yield: Silicon Learning to Predictive Models and Design Optimization","authors":"S. Venkataraman, Pongpachara Limpisathian, P. Meinerzhagen, S. Natarajan, Eric Yang","doi":"10.1109/ITC44778.2020.9325263","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325263","url":null,"abstract":"We propose a framework to co-optimize Yield along with Power, Performance and Area (PPA) through the design flow from logic synthesis through placement and routing (APR). We accomplish this by learning from silicon using a combination of test/diagnosis, inline/metrology and Failure Analysis (FA) results to create predictive models using Machine Learning (ML) techniques that are then used during design. Simulation results across three different CPU and Graphics cores show promising results with projected yield improvements of 11-17% with no area and performance / timing penalty with respect to design targets but with tradeoffs to both static and dynamic power. Better joint exploration of the PPA space along with yield indicates it is possible to recover yield with close to iso-PPA with respect to design targets. Pre-silicon results show $sim 10.4$% yield increase with iso-area and -iso-performance and $sim 1$% power penalty on a processor core.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"186 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132055337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning 基于集成学习的晶圆缺陷特征模式识别
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325237
L. Chen, Katherine Shu-Min Li, Ken Chau-Cheung Cheng, Sying-Jyan Wang, Andrew Yi-Ann Huang, Leon Chou, Nova Cheng-Yen Tsai, Chen-Shiun Lee
{"title":"TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning","authors":"L. Chen, Katherine Shu-Min Li, Ken Chau-Cheung Cheng, Sying-Jyan Wang, Andrew Yi-Ann Huang, Leon Chou, Nova Cheng-Yen Tsai, Chen-Shiun Lee","doi":"10.1109/ITC44778.2020.9325237","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325237","url":null,"abstract":"We propose a machine learning based method targeted for accurate wafer defect map classification. The proposed method is referred to as TestDNA-E, as it applies ensemble learning based on improved TestDNA features. Experimental results show that the proposed method achieves high hit rate for each defect type and overall accuracy.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126928705","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Automated Socket Anomaly Detection through Deep Learning 通过深度学习自动套接字异常检测
2020 IEEE International Test Conference (ITC) Pub Date : 2020-11-01 DOI: 10.1109/ITC44778.2020.9325269
Nidhi Agrawal, Min Yang, Constantinos Xanthopoulos, Vijayakumar Thangamariappan, Joe Xiao, Chee-Wah Ho, Keith Schaub, Ira Leventhal
{"title":"Automated Socket Anomaly Detection through Deep Learning","authors":"Nidhi Agrawal, Min Yang, Constantinos Xanthopoulos, Vijayakumar Thangamariappan, Joe Xiao, Chee-Wah Ho, Keith Schaub, Ira Leventhal","doi":"10.1109/ITC44778.2020.9325269","DOIUrl":"https://doi.org/10.1109/ITC44778.2020.9325269","url":null,"abstract":"The paper will demonstrate the application of Deep Learning (DL) for the detection of defective tester sockets. The proposed methodology relies on images like those used for manual or rule-based inspection, commonly collected using Automated Optical Inspection (AOI) equipment. This work represents a practical example of the use of Machine Learning for achieving improved inspection-quality outcomes at a lower cost. The experimental evaluation of the proposed methodology was performed on production set of collected socket images.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125235259","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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