汽车和工业安全应用中的模对模测试和ECC错误缓解

Gabriele Boschi, Elisa Spano, H. Grigoryan, Arun Kumar, Gurgen Harutunyan
{"title":"汽车和工业安全应用中的模对模测试和ECC错误缓解","authors":"Gabriele Boschi, Elisa Spano, H. Grigoryan, Arun Kumar, Gurgen Harutunyan","doi":"10.1109/ITC44778.2020.9325242","DOIUrl":null,"url":null,"abstract":"Two significant trends can be nowadays seen in automotive and industrial applications: an increase of the amount of data that is stored and elaborated by those systems, thus requiring bigger on-board DRAMs (Dynamic Random Access Memories), and the strict demands for reliability and safety. Safety is ruled by standards, that impose requirements for acceptable FIT rate–one of the most common metrics used for quantitatively evaluating the effects of such errors. It is then relevant to investigate the errors that can occur in DRAMs and propose mitigation techniques to deal with them. In this paper, die-to-die testing scenario is considered, and a methodology is described for mitigating the effects of errors by using well-known Error Correcting Codes (ECC). An advanced ECC solution is then presented along with the infrastructure needed for effectively testing DRAMs, including soft errors and permanent faults. The FIT rates calculations are finally considered, together with examples and case studies illustrating the effectiveness of the proposed solution.","PeriodicalId":251504,"journal":{"name":"2020 IEEE International Test Conference (ITC)","volume":"237 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Die-to-Die Testing and ECC Error Mitigation in Automotive and Industrial Safety Applications\",\"authors\":\"Gabriele Boschi, Elisa Spano, H. Grigoryan, Arun Kumar, Gurgen Harutunyan\",\"doi\":\"10.1109/ITC44778.2020.9325242\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Two significant trends can be nowadays seen in automotive and industrial applications: an increase of the amount of data that is stored and elaborated by those systems, thus requiring bigger on-board DRAMs (Dynamic Random Access Memories), and the strict demands for reliability and safety. Safety is ruled by standards, that impose requirements for acceptable FIT rate–one of the most common metrics used for quantitatively evaluating the effects of such errors. It is then relevant to investigate the errors that can occur in DRAMs and propose mitigation techniques to deal with them. In this paper, die-to-die testing scenario is considered, and a methodology is described for mitigating the effects of errors by using well-known Error Correcting Codes (ECC). An advanced ECC solution is then presented along with the infrastructure needed for effectively testing DRAMs, including soft errors and permanent faults. The FIT rates calculations are finally considered, together with examples and case studies illustrating the effectiveness of the proposed solution.\",\"PeriodicalId\":251504,\"journal\":{\"name\":\"2020 IEEE International Test Conference (ITC)\",\"volume\":\"237 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE International Test Conference (ITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITC44778.2020.9325242\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Test Conference (ITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITC44778.2020.9325242","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

如今在汽车和工业应用中可以看到两个重要的趋势:这些系统存储和处理的数据量增加,因此需要更大的板载dram(动态随机存取存储器),以及对可靠性和安全性的严格要求。安全是由标准来规定的,这些标准对可接受的FIT率提出了要求,FIT率是定量评估此类错误影响的最常用指标之一。然后,调查dram中可能发生的错误并提出缓解技术来处理它们是相关的。本文考虑了模对模测试场景,并描述了一种通过使用众所周知的纠错码(ECC)来减轻错误影响的方法。然后提出了一种先进的ECC解决方案,以及有效测试dram所需的基础设施,包括软错误和永久故障。最后考虑了FIT比率的计算,并结合实例和案例研究说明了所提出的解决方案的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Die-to-Die Testing and ECC Error Mitigation in Automotive and Industrial Safety Applications
Two significant trends can be nowadays seen in automotive and industrial applications: an increase of the amount of data that is stored and elaborated by those systems, thus requiring bigger on-board DRAMs (Dynamic Random Access Memories), and the strict demands for reliability and safety. Safety is ruled by standards, that impose requirements for acceptable FIT rate–one of the most common metrics used for quantitatively evaluating the effects of such errors. It is then relevant to investigate the errors that can occur in DRAMs and propose mitigation techniques to deal with them. In this paper, die-to-die testing scenario is considered, and a methodology is described for mitigating the effects of errors by using well-known Error Correcting Codes (ECC). An advanced ECC solution is then presented along with the infrastructure needed for effectively testing DRAMs, including soft errors and permanent faults. The FIT rates calculations are finally considered, together with examples and case studies illustrating the effectiveness of the proposed solution.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信