SAT-ATPG生成的电池内部缺陷的多模式扫描测试:电阻开路和短路的覆盖分析

Sujay Pandey, Zhiwei Liao, Shreyas Nandi, Sanya Gupta, S. Natarajan, Arani Sinha, A. Singh, A. Chatterjee
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引用次数: 3

摘要

最近工艺技术的进步导致了新的缺陷机制,使得测试生成过程非常具有挑战性。除了可以通过极端缺陷电阻值表示的完全开路和短路外,部分电阻开路和短路也是深度缩放CMOS技术关注的问题。对于中等缺陷大小的开放缺陷,已经证明了多模式测试是缺陷暴露的必要条件。我们将这种方法扩展到具有中间缺陷大小值的短缺陷,以获得一套多模式测试,用于覆盖完整以及部分细胞内开放缺陷和短缺陷的标准细胞实例。然后提出了一种分层扫描兼容的基于sat的全扫描顺序电路测试生成方法,该方法允许通过扫描基础设施将这种多模式测试应用于电路。一个关键的创新是结合使用移位和捕获操作,以及基于增加缺陷覆盖率的基于捕获和转移扫描的测试应用程序。在ISCAS89基准电路上演示了与传统双模式测试相比缺陷覆盖率的改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SAT-ATPG Generated Multi-Pattern Scan Tests for Cell Internal Defects: Coverage Analysis for Resistive Opens and Shorts
Recent advances in process technology have resulted in novel defect mechanisms making the test generation process very challenging. In addition to complete opens and shorts that can be represented via extreme defect resistance magnitudes, partial resistive opens and shorts are also of concern in deeply scaled CMOS technologies. For open defects with intermediate defect magnitude values, it has been shown that multi-pattern tests are necessary for defect exposure. We extend this approach to short defects with intermediate defect magnitude values to obtain a suite of multi-pattern tests for standard cell instances that cover complete as well as partial intra-cell open and short defects. A hierarchical scan-compatible SAT-based test generation approach for full scan sequential circuits is then proposed that allows such multi-pattern tests to be applied to the circuit via the scan infrastructure. A key innovation is the combined use of shift and capture operations along with launch-on-capture and launch-on-shift scan based test application for increased defect coverage. Resulting defect coverage improvements over conventional two-pattern tests are demonstrated on ISCAS89 benchmark circuits.
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