2005 6th International Conference on Electronic Packaging Technology最新文献_第3页

The impact of zincation on the electroless nickel UBM for low cost flip chip technology 镀锌对低成本倒装技术中化学镀镍UBM的影响

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564662

Yu Yang, Jian Cai, Shuidi Wang, Songliang Jia

{"title":"The impact of zincation on the electroless nickel UBM for low cost flip chip technology","authors":"Yu Yang, Jian Cai, Shuidi Wang, Songliang Jia","doi":"10.1109/ICEPT.2005.1564662","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564662","url":null,"abstract":"Electroless nickel on aluminum bondpads followed by solder bumping is regarded as one of the promising solutions of low cost flip chip technology. Zincation is a key process step to form a strong, electrical conductive connection between nickel and aluminum. The morphology of the bondpad changes slightly after the degreasing and oxide removal procedures. Large zinc grains grow during zincation. To get more uniform and smooth zinc films, a second zincation is applied. The newly deposited zinc film leads to better adhesion of the flip chip interconnection. Therefore double zincation is employed instead of single zincation. The change of the surface roughness corresponds well with its morphology. The surface of the bondpad is examined by SEM and AFM. Another key factor of the zincation procedure is the immersion time in the bath. And in this paper the immersion time for the first and second zincations is 45 and 15s respectively. For a properly prepared nickel UBM on an 80/spl mu/m/spl times/80/spl mu/m Al bondpad followed by a eutectic SnPb solder bump (250/spl mu/m in diameter), its shear strength is as high as 150 MPa and the electrical resistance of a bump is as low as 0.05/spl Omega/.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"370 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123408778","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Modeling and Simulation of Thermal-mechanical Characteristics of the Packaging of Tire Pressure Monitoring System(TPMS) 胎压监测系统(TPMS)包装热力学特性建模与仿真

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564701

Xiaojun Wang, Zhiguo Wu, Sheng Liu

{"title":"Modeling and Simulation of Thermal-mechanical Characteristics of the Packaging of Tire Pressure Monitoring System(TPMS)","authors":"Xiaojun Wang, Zhiguo Wu, Sheng Liu","doi":"10.1109/ICEPT.2005.1564701","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564701","url":null,"abstract":"Correct tire pressure is a critical factor in the safe operation and performance of a motor vehicle. Over inflated tires often result in unnecessary tire wear, reduced gas mileage, and less than optimal vehicle performance. Under inflated tires typically result in increased tire wear, decreased vehicle performance, and compromise the ability of the tires to maintain a safe interface with the road. A tire pressure monitoring system (TPMS) is designed to monitor air pressure and temperature in the tires of a motor vehicle, and that generates a signal indicative of the tire pressure and temperature in each of the tires to increase the vehicle performance and safety. A TPMS mounted to tire rings under tire rolling conditions is presented with a plastic packaging. In order to increase the reliability of the monitoring system, one type of filling glue is used to encapsulate the space existing in the monitoring system. The modeling and numerical simulation for the TPMS with various rolling conditions is conducted to investigate the thermo-mechanical characteristics of the packaging. In our design, the focus is on the selection of the filling glue; also the temperature effect on the materials' mechanical properties is included in the study. A reasonable model is obtained by appropriate simplification of geometry and material properties of the needed components in the TPMS. Stresses and deformation at different temperatures are predicted and results have shown the stresses in our design are low enough for TMPS to operate safely under harsh road conditions","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122574402","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint 热时效对球焊接头显微组织、剪切和机械冲击失效的影响

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564653

D. Tian, Hongtao Chen, Chunqing Wang

{"title":"Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint","authors":"D. Tian, Hongtao Chen, Chunqing Wang","doi":"10.1109/ICEPT.2005.1564653","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564653","url":null,"abstract":"The interfacial microstructure evolution between Sn-3.5Ag-0.75Cu solder ball and Au/Ni/Cu pad was investigated under as-bonded and thermal aging conditions. Moreover, the shear and mechanical shock tests were carried out to study the failure mechanisms. Results showed that only one intermetallic compound, fine needle-like AuSn4 was found at the solder/pad interface under as-bonded condition. After aging, Ag3Sn appeared in the solder bulk as a particle-like or elongated structure. Meanwhile, the intermetallic compounds layer became flat and a quaternary intermetallic compound Cu-Sn-Ni-Au appeared between AuSn4 layer and Ni(NiFe) layer. In addition, parts of AuSn4 spalled into the solder bulk with long hour aging. In the shear test, the solder joint exhibited a ductile failure. While in the mechanical shock test, the cracks initiated at the right end of the horizontal pad and propagate through the interfaces between IMCs. Furthermore, the factors dominating the failure mode were investigated which consists of external force and stress distribution, interfacial reaction and strain rate","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125914822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Wafer-to-Wafer Bonding Techniques: From MEMS Packaging to IC Integration Applications 晶圆间键合技术:从MEMS封装到IC集成应用

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564704

R. Pelzer, H. Kirchberger, P. Kettner

{"title":"Wafer-to-Wafer Bonding Techniques: From MEMS Packaging to IC Integration Applications","authors":"R. Pelzer, H. Kirchberger, P. Kettner","doi":"10.1109/ICEPT.2005.1564704","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564704","url":null,"abstract":"Device stacking and packaging on wafer-level plays a key role for the continuous miniaturization, expansion of functionality and reduction of production costs of MEMS and MCMs. The field of applications for integrated devices and MEMS is huge and the packaging requirements for the different systems are versatile. Driven by the automotive industry, extensive research and development in the field of wafer bonding resulted in a variety of different technologies. The primary targets of packaging steps are not only protecting devices from environmental influences, it is also important to compensate for stress, or to enable final testing in an efficient manner. The type of interaction of the MEMS with the environment determines the design, packaging materials and the packaging technique. Inappropriate choice of the package may result in poor reliability and narrow the spectrum of the system's applications. Therefore it's not surprising that packaging represents the major part of the cost of the whole MEMS device (30-50% of the costs may represent packaging; for some devices up to 80% have been reported). As several of these techniques are suitable for 3D stacking of IC chips as well, we will explain and discuss these requirements for this application, too","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"7 9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126084336","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Vision based Integrated System for Automated Anodic Bonding of MEMS Sensors 基于视觉的MEMS传感器自动阳极键合集成系统

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564719

S. Li-ning, Xie Hui, Rong Weibin, C. Liguo

引用次数: 0

Effect of Mg on the Microstructure and Properties of Sn-Ag-Cu Lead-free Solder Mg对Sn-Ag-Cu无铅钎料组织和性能的影响

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564690

L. Sheng, Wei Chenggang

引用次数: 7

Process management system analysis and design of SMT reflow soldering process SMT回流焊工艺管理系统的分析与设计

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564743

Li Chun-quan, Wu Zhao-hua

引用次数: 2

Thermodynamic calculation-aided design Pb-free solders and related experimental research 热力学计算辅助设计无铅焊料及相关实验研究

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564681

Ying Liang, F. Sun, Lifeng Wang, Miaosen Yang

{"title":"Thermodynamic calculation-aided design Pb-free solders and related experimental research","authors":"Ying Liang, F. Sun, Lifeng Wang, Miaosen Yang","doi":"10.1109/ICEPT.2005.1564681","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564681","url":null,"abstract":"A new solder alloy with the composition of Sn-3.0Ag-0.5Cu-4.5Bi was developed by means of thermodynamic calculation (CAPHAD) method. The Sn-Ag-Cu eutectic system was further optimized by adding the forth element of Bi in order to improve its melting behavior and mechanical properties; the melting point was reduced by about 5 degree compared to the former system. Its non-equilibrium solidification process was simulated according to the Scheil-Gulliver model and the phase transformation during cooling was predicted; as predicted, the solid phase comes out with /spl beta/-Sn, /spl eta/-Cu/sub 6/Sn/sub 5/, Ag/sub 3/Sn and a little Bi-rich phase in sequence. In the experiment procedure, the designed solder was re-melted and prepared using vacuum equipment. Its melting temperature was measured by differential scanning calorimeter (DSC); its microstructure was investigated by means of optical microscope (OM), scanning electron microscope (SEM) and energy dispersive X-ray analysis (EDX). As observed, the structure of the new alloy consists of matrix /spl beta/-Sn, eutectic area and small Bi grains which dispersed in the matrix; most Ag/sub 3/Sn are fibrous or needlelike, less flaky or granular Cu/sub 6/Sn/sub 5/ distribute dispersedly; Ag/sub 3/Sn and Cu/sub 6/Sn/sub 5/ mostly present in forms of block at concentrative area. The above calculation and simulation agree with the experimental results well.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134321577","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The growth behavior of intermetallic compound layer at solder/Cu joint interface during soldering 焊接过程中钎料/Cu界面金属间化合物层的生长行为

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564659

Wu Feng-shun, Hu Yanxiang, Wu Yiping, An Bing, Z. Jinsong

{"title":"The growth behavior of intermetallic compound layer at solder/Cu joint interface during soldering","authors":"Wu Feng-shun, Hu Yanxiang, Wu Yiping, An Bing, Z. Jinsong","doi":"10.1109/ICEPT.2005.1564659","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564659","url":null,"abstract":"In this paper, the growth behavior of intermetallic compound (TMC) layer at solder/Cu interface during soldering had been studied by using three Pb-free solder, Sn-3.5Ag, Sn-3.5Ag-0.5Cu and Sn-0.7Cu alloys. Meanwhile, Sn63-Pb37 eutectic alloy was used for comparison. In order to study the effects of reaction time on the formation and the growth behavior of IMC layer between four different solder and Cu substrate, the specimens were reacted at the temperature of 260/spl deg/C for 30s, 60s, 90s, 240s and 480s respectively. Optical microscope (OM) was used to measure the thickness of IMC layers and observe the microstructure of solder joint. The results show that the mean thickness of interfacial IMC layers increased with the increase of reaction time for the same solder, but the effects of reaction time on the thickness of IMC layer was not monotonous, when the reaction time prolonged to 480s, the mean thickness of IMC layer of Sn-0.7Cu and Sn63-Pb37 solder joints decreased mildly. The high content of Sn in Pb-free solder can cause a more rapid consumption of Cu. So, by contrast with three Pb-free solders, Sn63-Pb37/Cu joints have the thinnest IMC layer for each reaction time. The chemical reaction intensity of following four solders with Cu weakens as the order listed below: Sn3.5Ag, Sn3.5Ag0.5Cu, SnO.7Cu, Sn63Pb37. We found a surprising phenomenon that some Cu blocks/particles distributed in the IMC layer or near the IMC layer, and when the immerging time was long enough, the faultage usually emerged at the solder/substrate interface of the solder joints.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116085076","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Introduction of JIS related to lead-free solder and soldering 介绍与无铅焊锡和焊接相关的JIS

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI: 10.1109/ICEPT.2005.1564644

T. Takemoto

{"title":"Introduction of JIS related to lead-free solder and soldering","authors":"T. Takemoto","doi":"10.1109/ICEPT.2005.1564644","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564644","url":null,"abstract":"Toward July 1, 2006, almost all major electric and electronic manufacturing companies have been finished their development on lead-free soldering in Japan. To support the promotion of practical use of lead-free solder, preparation of standards is effective. The outline of standards for lead-free solder under preparation in JIS, ISO and IEC is briefly reviewed. To coordinate among these standards is quite important to avoid double standards. The main solders to be included in these standards are Sn-Sb, Sn-Cu(-Ag), Sn-Ag-Cu, Sn-Ag-In-Bi, Sn-Zn and Sn-Bi(-Ag). The most popular alloy systems is Sn-Ag-Cu, in Japan Sn-3.0Ag-0.5Cu is a normally used solder. The ideal standards should have material specification and test methods for solder, flux and mixture of them. In Japan Solder Research Committee of Japan Welding Engineering Society (JWES) is corresponding to both ISO and IEC to enhance consistency among the standards related to lead-free solder. The JIS of test method for lead-free solders had been already published in 2003 as JIS Z 3198-Part 1 /spl sim/Part 7. They include the measurement for melting temperature range, mechanical properties by a tensile test, wettability tests and joint strength tests. According to the test method specified in JIS Z 3198-1, Solder Research Committee of JWES determined the melting temperature range of all lead-free solders that will be adopted in JIS.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124691361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4