Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI:10.1109/ICEPT.2005.1564653

D. Tian, Hongtao Chen, Chunqing Wang

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引用次数: 4

Abstract

The interfacial microstructure evolution between Sn-3.5Ag-0.75Cu solder ball and Au/Ni/Cu pad was investigated under as-bonded and thermal aging conditions. Moreover, the shear and mechanical shock tests were carried out to study the failure mechanisms. Results showed that only one intermetallic compound, fine needle-like AuSn4 was found at the solder/pad interface under as-bonded condition. After aging, Ag3Sn appeared in the solder bulk as a particle-like or elongated structure. Meanwhile, the intermetallic compounds layer became flat and a quaternary intermetallic compound Cu-Sn-Ni-Au appeared between AuSn4 layer and Ni(NiFe) layer. In addition, parts of AuSn4 spalled into the solder bulk with long hour aging. In the shear test, the solder joint exhibited a ductile failure. While in the mechanical shock test, the cracks initiated at the right end of the horizontal pad and propagate through the interfaces between IMCs. Furthermore, the factors dominating the failure mode were investigated which consists of external force and stress distribution, interfacial reaction and strain rate

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热时效对球焊接头显微组织、剪切和机械冲击失效的影响

研究了Sn-3.5Ag-0.75Cu钎料球与Au/Ni/Cu焊盘在焊态和热时效条件下的界面组织演变。并进行了剪切试验和机械冲击试验，对其破坏机理进行了研究。结果表明:在焊接状态下，钎料/焊盘界面处只存在一种金属间化合物，即细小的针状AuSn4;时效后，Ag3Sn在钎料体中以颗粒状或细长状结构出现。同时，金属间化合物层变得平坦，在AuSn4层和Ni(NiFe)层之间出现了Cu-Sn-Ni-Au四元金属间化合物。此外，由于长时间老化，部分AuSn4脱落到焊料块中。在剪切试验中，焊点表现出延性破坏。而在机械冲击试验中，裂纹从水平垫块的右端开始，并通过imc之间的界面传播。进一步分析了影响破坏模式的因素，包括外力和应力分布、界面反作用力和应变速率

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2005 6th International Conference on Electronic Packaging Technology

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