2005 6th International Conference on Electronic Packaging Technology最新文献

{"title":"Lead-free solder materials for sustainable development of green electronics in China","authors":"Jusheng Ma, Guohai Chen","doi":"10.1109/ICEPT.2005.1564657","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564657","url":null,"abstract":"Building recycle society is the key to ensure the sustainable development of China. The green electronics, including the advanced electronic packaging technology, play a most important role to promote the development of recycle society. In this paper, the development and trend of the green electronic industry, technology and laws in China and other countries are reviewed. New lead-free solder alloys and its application characteristics, also the evaluation methods are illustrated. Some suggestions are put forward.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125047045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effect of Rare Earths on Microstructure and Properties of Sn2.0Ag0.7CuRE Solder Alloy","authors":"Zhang Keke, Chen Guanghui, Yu Yangchun, Yan Yanfu, M. Hua","doi":"10.1109/ICEPT.2005.1564711","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564711","url":null,"abstract":"In the study the fabrication, microstructure, mechanical and physical properties and wettability of Sn_2.0Ag_0.7CuRE solder alloy are investigated. Result shows that when the content of RE<0.1%(mass fraction), RE distributes uniformly in the solder alloy, and the tensile strength and conductance of Sn_2.0Ag_0.7CuRE solder alloy are better than those of traditional Sn³⁷Pb solder. Its elongation and spreading area are almost equal to that of Sn³⁷Pb. When the content of RE reaches 0.5%, RE compounds can be easily found around the boundaries of grains and phases. The tensile strength and elongation and spreading area of Sn_2.0Ag_0.7CuRE solder alloy all decrease sharply. Therefore, RE amount added to the Sn_2.0Ag_0.7CuRE solder alloy under 0.1% is proper","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125822238","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A novel parallel manipulator design for packaging and assembly","authors":"Z. Dachang, Feng Yanping, Fang Yuefam","doi":"10.1109/ICEPT.2005.1564722","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564722","url":null,"abstract":"The mechanisms with type of right-angle coordinate system and planar joints are two kinds of manipulators which apply extensive in microelectronics, and gradually apply to packaging and assembly line work. However, the structure with open serial chain of this two kinds of mechanisms made the stiffness and the ability of load too lower to adapt the need of production. In order to deal with this situation, a novel parallel manipulator with three degree-of-freedom (dof), two translate dof and one rotate dof, is applied to microelectronics packaging. A procedure to analyze the kinematics property of 3-RPS 2TIR parallel manipulator is presented via screw theory. The dof of this mechanism is proved equal to three, including two translate and one rotational dof respectively. Singularity analysis is provided by screw theory. Applied with the Jacobian matrix, the kinematics analysis is also provided and simulation with kinematics is given.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125555917","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs","authors":"L. Wan, P. Markondeya Raj, M. Swaminathan, R. Tummala","doi":"10.1109/ICEPT.2005.1564691","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564691","url":null,"abstract":"Embedded capacitor is a better solution than surface mount capacitors for decoupling in a high speed, high performance packages/PCBs. Our study has showed that with conventional approaches, the embedded capacitor for decoupling in power delivering network can work from 100 MHz to 1 GHz systems. Pushing the operating frequency over 1 GHz is a challenge for system designers. This paper discusses the embedded decoupling capacitor design for multi-GHz systems through principles, simulation, measurement error, and error elimination.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115205365","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Reliability study of ceramic substrate in a SIP type package","authors":"Yumin Liu, Y. Liu, J. Yang, Qiuxiao Qian, S. Irving","doi":"10.1109/ICEPT.2005.1564693","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564693","url":null,"abstract":"Ceramic substrate reliability in a lead frame based system in package (SIP) is investigated during the assembly process. Ceramic is a brittle material in the temperature range of the assembly process, so its failure mechanism is mainly fracture. Ceramic cracks can be caused either by thermo mechanical or by purely mechanical loads. In this study, only the mechanical impact on the ceramic substrate is investigated during assembly molding process. The effects of both lead frame downset and support pin over-press are studied through the commercial finite element code Ansys. Parametric studies show that the change of the lead frame downset before the assembly molding process has little impact on the ceramic substrate stress. However, the change of the support pin over-press tolerance has a large impact on the ceramic substrate stress. According to these simulation results, effective measures can be taken to control the support pin over-press, to avoid the risk of ceramic substrate failure during the assembly process.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"128 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122753537","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Reflow profile simulation by finite element method for a BGA package","authors":"Shen Liang, Wang Mingxiang, He Yonghong, Lam Tim Fai, Jiang Qi","doi":"10.1109/ICEPT.2005.1564717","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564717","url":null,"abstract":"During reflow process, solder ball temperature profile is a concern, but it is difficult to direct measure the temperature. In this study, a forced convective airflow reflow furnace was analyzed. Measured profiles from two typical BGA packages were simulated successfully. Temperature profile of package surface has been compared with that of solder balls. Temperature distribution among solder ball array has been observed and analyzed. It has been found that impinging jet airflow model provides appropriate convective heat transfer coefficient that can be applied to profile simulation successfully. Dominant heat transfer mechanism is vertical thermal conduction from package top surface to solder ball, while other heat transfer mechanism also have notable effects on solder ball temperature. Solder ball array layout has a significant effect on temperature uniformity of solder balls. A uniform distribution can be obtained when all the balls are located under chip area.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122019993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The thermo-physical properties of high dense Mo/Cu composites fabricated by squeeze casting technology","authors":"Guo-qin Chen, Gaohui Wu, D. Zhu, Qiang Zhang","doi":"10.1109/ICEPT.2005.1564680","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564680","url":null,"abstract":"For applicability in the field of semiconductor, it is important that the thermal expansion coefficient of heat sink materials approximates to those of semiconductor chip and peripheral material. In addition, high thermal conductivity and densification also is required. Mo/Cu composites are desirable for thermal management applications because of its combination of low thermal expansion coefficient and high thermal conductivity. In this paper, Mo/Cu composites with volume fractions of 55% /spl sim/ 67% Mo content have been fabricated by the cost-effective squeeze-casting technology. The microstructures and thermo-physical properties of the Mo/Cu composites were investigated. The experimental results showed that: (1) the full densities of the Mo/Cu composites were achieved and the microstructures of the Mo/Cu composites were homogenous compound structures of adhesive phase Cu linking Mo grains. (2) The mean linear coefficients of thermal expansion (20 /spl deg/C /spl sim/ 100/spl deg/C) of Mo/Cu composites ranged from 7.9 to 9.3 /spl times/ 10/sup -6// /spl deg/C and decreased with an increase in volume fraction of Mo content. The experimental coefficients of thermal expansion agreed well with predicted values based on Kerner's model. (3) Their thermal conductivities were increased with the increasing of volume fraction of Cu content and as high as 220-270 W/(m/spl middot//spl deg/C). This was attributed to the fact that the full densities and high purity of Mo/Cu composites were achieved through the cost-effective squeeze-casting technology processes. As a result, the properties of the Mo/Cu composites are good enough to satisfy electronic packaging applications.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130612172","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Reliability of Ball Grid Array (BGA) Assembly with Reworkable Capillary Underfill Material","authors":"Fangjuan Qi, Yaping Ding, Zhanlai, Ding, Hua Fu","doi":"10.1109/ICEPT.2005.1564706","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564706","url":null,"abstract":"In this paper, the reliability of the BGA assembly with underfill material is studied by three-point bend test, mechanical bending fatigue test and thermal fatigue test. With the rapid development of surface mount technology (SMT), ball grid array (BGA)/chip scale package (CSP) are widely used in portable electronic devices, such as phone, pager, and PDA. But to increase reliability of BGA/CSP is a big challenge to the application of these devices. One important method to improve reliability of BGA or CSP is underfilling technology. Therefore, the effect of reworkable capillary underfill material on reliability of BGA assembly needs to be investigated systematically. In this study, samples are reflowed with an optimized \"rpid ramp\" temperature profile. Then some samples are underfilled by two different reworkable capillary underfill materials. All three kinds of samples are divided into three groups respectively. One group of samples is subjected to three point bend load at normal temperature on the mini-mechanical testing. The second group of samples is subjected to mechanical bending fatigue load at a fatigue frequency of 60 cyclic per minute on mini-mechanical testing too. The third group of samples is subjected to thermal fatigue shock at temperature -40~+125degC, and the dwell time 20 min. Three point bend experimental results show that the reworkable capillary underfill material can improved the static mechanical reliability of BGA assembly. And the failure modes BGA assembly is also different with different underfill material. The mechanical bending fatigue experimental results show that the BGA assembly with two different reworkable capillary underfill exhibits higher mechanical bending fatigure reliability than that of the BGA assembly without any underfill materials. Thermal fatigue experimental results show that the thermal fatigue reliability of BGA assembly with U1 underfill material is lower than that of BGA assembly without any underfill material. The reliability of BGA assembly with U2 underfill material is higher than that of BGA assembly without any underfill material","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121496580","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Experimental Research of Copper Wire Ball Bonding","authors":"Hong Shouyu, Hang Chunjing, Wang Chunqing","doi":"10.1109/ICEPT.2005.1564648","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564648","url":null,"abstract":"The bonding procedure of copper wire ball bonding on an aluminum-metallized silicon substrate was investigated in this paper. The four crucial parameters: ultrasonic power, impact force, frequency duration and bonding temperature were optimized. It was found that the process window was quite narrow, thus the bonding process was less stable. In conjunction with the results of the process optimization, the effect of all the parameters on the bonding quality and mechanisms were investigated. The SEM analysis results of FAB (free air ball) showed the solidification proceeded from the ball end towards the wire end while the orientation of the cell-type fine substructures was irregular. This was attributed to a rapid solidification of Cu during the electric sparking which was protected by mixed reducing gas","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"99 35","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113943644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Research on Interfacial Intermetallics Growth Behavior of SnAgCu/Cu Solder Joints under Thermal-shearing Cycling","authors":"Zhang Jiangang, Huang Jihua, Qi Lihua, Wang Ye, Zhang Hua","doi":"10.1109/ICEPT.2005.1564725","DOIUrl":"https://doi.org/10.1109/ICEPT.2005.1564725","url":null,"abstract":"In this paper, the growth behavior of intermetallic compounds (IMCs) at the Sn-3.5Ag-0.5Cu/Cu interface under thermal-shearing cycling from 25degC to 125degC had been investigated. Meanwhile, the IMCs at Sn-3.5Ag-0.5Cu/Cu interface under isothermal aging were applied for comparison. The results show that the scallop-shaped Cu6Sn 5 IMC is formed during soldering and then the morphology of IMC changes from scallop-shaped to chunk-shaped and the thickness of IMCs increases with isothermal aging or thermal-shearing cycling. The growth rate of the IMCs increases with the increase of the shearing strain(stress). In addition, accumulative Ag3Sn IMC is found at the interface under thermal-shearing cycling","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114710258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}