A novel parallel manipulator design for packaging and assembly

Abstract

The mechanisms with type of right-angle coordinate system and planar joints are two kinds of manipulators which apply extensive in microelectronics, and gradually apply to packaging and assembly line work. However, the structure with open serial chain of this two kinds of mechanisms made the stiffness and the ability of load too lower to adapt the need of production. In order to deal with this situation, a novel parallel manipulator with three degree-of-freedom (dof), two translate dof and one rotate dof, is applied to microelectronics packaging. A procedure to analyze the kinematics property of 3-RPS 2TIR parallel manipulator is presented via screw theory. The dof of this mechanism is proved equal to three, including two translate and one rotational dof respectively. Singularity analysis is provided by screw theory. Applied with the Jacobian matrix, the kinematics analysis is also provided and simulation with kinematics is given.