Design, simulation and measurement techniques for embedded decoupling capacitors in multi-GHz packages/PCBs

L. Wan, P. Markondeya Raj, M. Swaminathan, R. Tummala
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引用次数: 7

Abstract

Embedded capacitor is a better solution than surface mount capacitors for decoupling in a high speed, high performance packages/PCBs. Our study has showed that with conventional approaches, the embedded capacitor for decoupling in power delivering network can work from 100 MHz to 1 GHz systems. Pushing the operating frequency over 1 GHz is a challenge for system designers. This paper discusses the embedded decoupling capacitor design for multi-GHz systems through principles, simulation, measurement error, and error elimination.
多ghz封装/ pcb中嵌入式去耦电容器的设计、仿真和测量技术
对于高速、高性能封装/ pcb的去耦,嵌入式电容器是比表面贴装电容器更好的解决方案。我们的研究表明,采用传统方法,输电网络中用于去耦的嵌入式电容器可以在100 MHz到1 GHz的系统中工作。将工作频率提高到1ghz以上对系统设计人员来说是一个挑战。本文从原理、仿真、测量误差和误差消除等方面讨论了多ghz系统的嵌入式去耦电容设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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