铜丝球键合的实验研究

Hong Shouyu, Hang Chunjing, Wang Chunqing
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引用次数: 20

摘要

研究了铜丝球在金属化铝硅衬底上的键合过程。对超声功率、冲击力、频率持续时间和键合温度四个关键参数进行了优化。发现工艺窗口很窄,键合过程稳定性较差。结合工艺优化结果,研究了各参数对键合质量的影响及键合机理。自由空气球(FAB)的SEM分析结果表明,凝固过程由球端向丝端进行,而细胞型细子结构的取向不规则。这是由于电火花过程中铜的快速凝固,而混合还原性气体保护了这一过程
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental Research of Copper Wire Ball Bonding
The bonding procedure of copper wire ball bonding on an aluminum-metallized silicon substrate was investigated in this paper. The four crucial parameters: ultrasonic power, impact force, frequency duration and bonding temperature were optimized. It was found that the process window was quite narrow, thus the bonding process was less stable. In conjunction with the results of the process optimization, the effect of all the parameters on the bonding quality and mechanisms were investigated. The SEM analysis results of FAB (free air ball) showed the solidification proceeded from the ball end towards the wire end while the orientation of the cell-type fine substructures was irregular. This was attributed to a rapid solidification of Cu during the electric sparking which was protected by mixed reducing gas
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