Research on Interfacial Intermetallics Growth Behavior of SnAgCu/Cu Solder Joints under Thermal-shearing Cycling

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI:10.1109/ICEPT.2005.1564725

Zhang Jiangang, Huang Jihua, Qi Lihua, Wang Ye, Zhang Hua

引用次数: 0

Abstract

In this paper, the growth behavior of intermetallic compounds (IMCs) at the Sn-3.5Ag-0.5Cu/Cu interface under thermal-shearing cycling from 25degC to 125degC had been investigated. Meanwhile, the IMCs at Sn-3.5Ag-0.5Cu/Cu interface under isothermal aging were applied for comparison. The results show that the scallop-shaped Cu6Sn 5 IMC is formed during soldering and then the morphology of IMC changes from scallop-shaped to chunk-shaped and the thickness of IMCs increases with isothermal aging or thermal-shearing cycling. The growth rate of the IMCs increases with the increase of the shearing strain(stress). In addition, accumulative Ag3Sn IMC is found at the interface under thermal-shearing cycling

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热剪切循环作用下SnAgCu/Cu焊点界面金属间化合物生长行为研究

本文研究了25 ~ 125℃热剪切循环作用下Sn-3.5Ag-0.5Cu/Cu界面上金属间化合物(IMCs)的生长行为。同时，采用等温时效Sn-3.5Ag-0.5Cu/Cu界面的IMCs进行对比。结果表明:在焊接过程中先形成扇形Cu6Sn - 5 IMC，然后随着等温时效或热剪切循环，IMC的形貌由扇形变为块状，IMC的厚度增加;IMCs的生长速率随剪切应变(应力)的增加而增加。在热剪切循环作用下，界面处存在累积的Ag3Sn IMC

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2005 6th International Conference on Electronic Packaging Technology

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