Process management system analysis and design of SMT reflow soldering process

Li Chun-quan, Wu Zhao-hua
{"title":"Process management system analysis and design of SMT reflow soldering process","authors":"Li Chun-quan, Wu Zhao-hua","doi":"10.1109/ICEPT.2005.1564743","DOIUrl":null,"url":null,"abstract":"Reflow soldering processes are the key processes affecting SMT product quality. First, in the paper, the essential of building SMT processes management was discussed. Then, based on the discussion, taking temperature data as the primary object, process management system analysis of reflow soldering processes was achieved from three aspects: temperature data acquisition, long-distance temperature data transmission and process management software design of reflow soldering processes. At last, general structure of system was advanced and process management system of SMT reflow soldering processes was built through hardware and software designs. The system can promote the improvement of process management ability and level of reflow soldering processes.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564743","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Reflow soldering processes are the key processes affecting SMT product quality. First, in the paper, the essential of building SMT processes management was discussed. Then, based on the discussion, taking temperature data as the primary object, process management system analysis of reflow soldering processes was achieved from three aspects: temperature data acquisition, long-distance temperature data transmission and process management software design of reflow soldering processes. At last, general structure of system was advanced and process management system of SMT reflow soldering processes was built through hardware and software designs. The system can promote the improvement of process management ability and level of reflow soldering processes.
SMT回流焊工艺管理系统的分析与设计
回流焊工艺是影响SMT产品质量的关键工艺。本文首先讨论了建立SMT工艺管理的本质。然后,在讨论的基础上,以温度数据为主要对象,从温度数据采集、温度数据远程传输和回流焊工艺管理软件设计三个方面对回流焊工艺过程管理系统进行了分析。最后提出了系统总体结构,并通过硬件和软件设计构建了SMT回流焊工艺管理系统。该系统能促进回流焊工艺管理能力和水平的提高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信