Vision based Integrated System for Automated Anodic Bonding of MEMS Sensors

S. Li-ning, Xie Hui, Rong Weibin, C. Liguo
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Abstract

Piezoresistive silicon pressure sensors are widely used in automotive, aerospace and medical equipment industries. Batch bonding of the sensors is limited by the manual manipulation required specially trained technicians. In order to reduce the production costs and simultaneously obtain high production quality, a vision based integrated system for automated anodic bonding is presented. This system consists of a vision subsystem, macro/micro stages, a vacuum micromanipulator, and some additional subsystems. The macro/micro stage performs fine positioning and bonding under the navigation of the vision, the vacuum micromanipulator integrated with smart force sensor can perform highly-precise bonding tasks and a nondestructive transportation of the chip and the quartz base. To perform manipulations automatically, a control system, including a task planning level and a real-time execution level, was developed. The automated batch bonding is validated by further experiment
基于视觉的MEMS传感器自动阳极键合集成系统
压阻式硅压力传感器广泛应用于汽车、航空航天和医疗设备行业。传感器的批量粘合受限于需要经过专门培训的技术人员的手动操作。为了在降低生产成本的同时获得高质量的产品,提出了一种基于视觉的自动化阳极键合集成系统。该系统由视觉子系统、宏/微级、真空微机械臂和一些附加子系统组成。宏/微观阶段在视觉导航下进行精细定位和粘接,集成智能力传感器的真空微机械臂可以完成高精度的粘接任务和芯片与石英底座的无损输送。为了实现自动操作,开发了一个控制系统,包括任务规划层和实时执行层。通过进一步的实验验证了该方法的有效性
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