2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)最新文献

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Non-uniform chip-temperature dependent signal integrity 非均匀芯片温度相关的信号完整性
A. Ajami, K. Banerjee, Massoud Pedram
{"title":"Non-uniform chip-temperature dependent signal integrity","authors":"A. Ajami, K. Banerjee, Massoud Pedram","doi":"10.1109/VLSIT.2001.934991","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934991","url":null,"abstract":"In traditional design flows, the chip temperature is assumed to be uniform across the substrate. However, for most high-performance designs, the substrate temperature is nonuniform, which can be a major source of inaccuracy in delay and skew computations. This paper introduces the analysis and modeling of nonuniform substrate temperature and its effect on signal integrity. Using a novel nonuniform temperature-dependent analytical distributed RC interconnect delay model, the thermally dependent signal integrity metrics, i.e. signal delay and clock skew, are analyzed and some design techniques are provided to eliminate the nonuniform temperature-dependent clock skew.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122678570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Realization of high performance dual gate DRAMs without boron penetration by application of tetrachlorosilane silicon nitride films 应用四氯硅烷氮化硅薄膜实现无硼渗透的高性能双栅dram
M. Tanaka, S. Saida, F. Inoue, M. Kojima, T. Nakanishi, K. Suguro, Y. Tsunashima
{"title":"Realization of high performance dual gate DRAMs without boron penetration by application of tetrachlorosilane silicon nitride films","authors":"M. Tanaka, S. Saida, F. Inoue, M. Kojima, T. Nakanishi, K. Suguro, Y. Tsunashima","doi":"10.1109/VLSIT.2001.934980","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934980","url":null,"abstract":"It is well known that conventional SiN films accelerate boron penetration due to hydrogen desorption during a high temperature annealing process after SiN deposition (Pfiester et al, 1990). The boron penetration causes depletion of the gate electrodes and threshold voltage deviations, and degrades the PMOSFETs. In the case of next generation DRAMs, thick SiN films are necessary as a hard mask for a self-aligned contact (SAC) process to increase the density. Simultaneously, dual gate CMOS systems should be applied to realize high performance. Therefore, SiN films without boron penetration must be developed for realization of dual gate CMOS systems with a SAC process. Conventional silicon nitride (SiN) films accelerate boron penetration, which causes the degradation of PMOSFETs. It was found that boron penetration becomes worse in proportion to SiH content incorporated in SiN LPCVD films. Applications of SiH-less SiN films, formed from tetrachlorosilane (TCS) and ammonia, have successfully realized the high performance of PMOSFETs in dual gate system DRAMs.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128893747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Effects of high-/spl kappa/ dielectrics on the workfunctions of metal and silicon gates 高/声压级kappa/电介质对金属和硅栅极工作性能的影响
Y. Yeo, P. Ranade, Q. Lu, R. Lin, T. King, C. Hu
{"title":"Effects of high-/spl kappa/ dielectrics on the workfunctions of metal and silicon gates","authors":"Y. Yeo, P. Ranade, Q. Lu, R. Lin, T. King, C. Hu","doi":"10.1109/VLSIT.2001.934941","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934941","url":null,"abstract":"We explore the dependence of metal and polysilicon gate work functions on the underlying gate dielectric in advanced MOS transistors. The interface dipole theory is employed to explain our experimental observation that metal work functions on high-/spl kappa/ dielectrics differ appreciably from their values on SiO/sub 2/ or in vacuum. This model shows excellent agreement with original data and reported results in the literature. In addition, we also explain the weaker dependence of n/sup +/ and p/sup +/ polysilicon gate work functions on the gate dielectric. Challenges for gate work function engineering are highlighted. This work provides additional guidelines on the choice of gate materials for future CMOS technology incorporating high-/spl kappa/ gate dielectrics.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127563752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 23
Oxidation-resistant amorphous TaN barrier for MIM-Ta/sub 2/O/sub 5/ capacitors in giga-bit DRAMs 用于千兆位dram中MIM-Ta/sub 2/O/sub 5/电容器的抗氧化非晶TaN阻挡层
Y. Nakamura, I. Asano, M. Hiratani, T. Saito, H. Goto
{"title":"Oxidation-resistant amorphous TaN barrier for MIM-Ta/sub 2/O/sub 5/ capacitors in giga-bit DRAMs","authors":"Y. Nakamura, I. Asano, M. Hiratani, T. Saito, H. Goto","doi":"10.1109/VLSIT.2001.934936","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934936","url":null,"abstract":"We demonstrate that an amorphous TaN layer with no grain boundaries shows a good oxidation-resistant performance after forming and annealing the Ta/sub 2/O/sub 5/ dielectric of MIM capacitors for DRAM applications at 550/spl deg/C in O/sub 2/ ambient. We fabricated an MIM-Ta/sub 2/O/sub 5/ capacitor with a concave-type Ru storage node on the TaN barrier metal. This showed a contact resistivity of 0.27 k/spl Omega//spl middot//spl mu/m/sup 2/, a capacitance of 20 fF/bit, and a leakage current of 0.9 fA/bit (-1 to 1 V). We further fabricated a crown-type Ru electrode to demonstrate scalability to 0.10 /spl mu/m design rules.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117212245","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Performance improvement of metal gate CMOS technologies 金属栅CMOS技术的性能改进
S. Matsuda, H. Yamakawa, A. Azuma, Y. Toyoshima
{"title":"Performance improvement of metal gate CMOS technologies","authors":"S. Matsuda, H. Yamakawa, A. Azuma, Y. Toyoshima","doi":"10.1109/VLSIT.2001.934948","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934948","url":null,"abstract":"Metal gate CMOS technologies for high speed applications were investigated using the damascene metal gate process (Yagishita et al., 1999). We demonstrated the performance improvement by no gate depletion effect in the metal gate using actual devices. Ti/W was used as a single work function metal gate material and ultra shallow buried channel profile was formed for threshold voltage control. The self-aligned channel structure effectively reduces source/drain junction capacitance. An extremely good metal/SiO/sub 2/ interface with the CVD-TiN gate stack realizes intrinsic channel mobility. The propagation delay time of a CMOS inverter ring oscillator was 20 ps, and projected next generation performance would be better due to the improved technologies.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121416800","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
A study of analog characteristics of CMOS with heavily nitrided NO oxynitrides 重氮化一氧化氮氧化物CMOS模拟特性的研究
T. Ohguro, T. Nagano, M. Fujiwara, M. Takayanagi, T. Shimizu, H. Momose, S. Nakamura, Y. Toyoshima
{"title":"A study of analog characteristics of CMOS with heavily nitrided NO oxynitrides","authors":"T. Ohguro, T. Nagano, M. Fujiwara, M. Takayanagi, T. Shimizu, H. Momose, S. Nakamura, Y. Toyoshima","doi":"10.1109/VLSIT.2001.934964","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934964","url":null,"abstract":"Recently, heavily nitrided NO oxynitride has been proposed as an alternative to pure oxide in order to realize high drivability and suppress a large gate leakage current (Fujiwara et al, Digest of IEDM 2000, pp. 227-30, 2000). However, in general, oxynitride has higher interface state density than that of pure oxide, and brings low frequency noise (or 1/f noise) degradation (Kimijima et al., 1999). Thus, analog characteristics under such aggressive doping conditions should be observed carefully for realization of high performance mixed analog and digital LSIs. In this paper, we report analysis of the 1/f noise degradation due to heavily nitrided NO oxynitrides and predict the interface state density value to satisfy 1999 ITRS Roadmap requirements. Additionally, a buried channel type MOSFET is proposed for suppression of the 1/f noise and f/sub T/ degradation.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"246 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122478214","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
A manufacturable 25 nm planar MOSFET technology 一种可制造的25nm平面MOSFET技术
Y. Ponomarev, J. Loo, C. Dachs, F. Cubaynes, M. Verheijen, M. Kaiser, J. van Berkum, S. Kubicek, J. Bolk, M. Rovers
{"title":"A manufacturable 25 nm planar MOSFET technology","authors":"Y. Ponomarev, J. Loo, C. Dachs, F. Cubaynes, M. Verheijen, M. Kaiser, J. van Berkum, S. Kubicek, J. Bolk, M. Rovers","doi":"10.1109/VLSIT.2001.934933","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934933","url":null,"abstract":"The limits of scaling of planar Si MOSFET devices has been a subject of increasing interest in recent years. Consumer demand for high-performance electronic products has stimulated an ever-increasing rate of scaling of mainstream CMOS. Several results for devices with sub-50 nm gate lengths have already been reported (e.g. Timp et al., 1998; Chau et al., 2000; Wakabayashi et al., 2000) to approach the required performance values. We present here the results of study of manufacturability of sub-50 nm MOSFETs using tools routinely available for production of the 0.18 /spl mu/m CMOS generation. We show that by adapting 248 nm lithography, using nonequilibrium n-type junction formation and specially developed low-temperature processing, it is possible to manufacture devices with gate lengths as small as 15 nm. It is also confirmed that heavily pocketed devices with sub-50 nm gates show deterioration in performance.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115761824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Carrier mobility enhancement in strained Si-on-insulator fabricated by wafer bonding 晶圆键合制备应变硅绝缘子的载流子迁移率增强
L. Huang, J. Chu, S. Goma, C. D'Emic, S. Koester, D. Canaperi, P. Mooney, S. Cordes, J. Speidell, R. M. Anderson, H.-S.P. Wong
{"title":"Carrier mobility enhancement in strained Si-on-insulator fabricated by wafer bonding","authors":"L. Huang, J. Chu, S. Goma, C. D'Emic, S. Koester, D. Canaperi, P. Mooney, S. Cordes, J. Speidell, R. M. Anderson, H.-S.P. Wong","doi":"10.1109/VLSIT.2001.934945","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934945","url":null,"abstract":"N- and p-MOSFETs have been fabricated in strained Si on SiGe on insulator (SSOI) with high (15-25%) Ge content. Wafer bonding and H-induced layer transfer techniques enabled the fabrication of the high Ge content SiGe-on-insulator (SGOI) substrates. Mobility enhancement of 46% for electrons and 60-80% for holes (for 20%-25% Ge content) has been demonstrated in SSOI MOSFETs. This could lead to next generation device performance enhancement.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128447733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 32
A fully planarized 8M bit ferroelectric RAM with 'chain' cell structure 具有“链式”单元结构的全平面化8M位铁电RAM
T. Ozaki, J. Iba, H. Kanaya, T. Morimoto, O. Hidaka, A. Taniguchi, Y. Kumura, K. Yamakawa, Y. Oowaki, I. Kunishima
{"title":"A fully planarized 8M bit ferroelectric RAM with 'chain' cell structure","authors":"T. Ozaki, J. Iba, H. Kanaya, T. Morimoto, O. Hidaka, A. Taniguchi, Y. Kumura, K. Yamakawa, Y. Oowaki, I. Kunishima","doi":"10.1109/VLSIT.2001.934975","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934975","url":null,"abstract":"A 8M-bit fully functional ferroelectric RAM (FeRAM) with 0.25 /spl mu/m CMOS process was successfully fabricated by using a highly reliable Pt-SRO-PZT-SRO-Pt stacked capacitor and aluminum reflow based low damage metallization process. The chip area of 76 mm/sup 2/ was achieved by using a 'chain' cell structure.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"08 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130565551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A high performance 0.12 /spl mu/m CMOS with manufacturable 0.18 /spl mu/m technology 一种高性能0.12 /spl μ m CMOS,可制造0.18 /spl μ m技术
K. Ichinose, T. Saito, Y. Yanagida, Y. Nonaka, K. Torii, H. Sato, N. Saito, S. Wada, K. Mori, S. Mitani
{"title":"A high performance 0.12 /spl mu/m CMOS with manufacturable 0.18 /spl mu/m technology","authors":"K. Ichinose, T. Saito, Y. Yanagida, Y. Nonaka, K. Torii, H. Sato, N. Saito, S. Wada, K. Mori, S. Mitani","doi":"10.1109/VLSIT.2001.934970","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934970","url":null,"abstract":"High-performance 0.12 /spl mu/m CMOS devices with manufacturable 0.18 /spl mu/m technology are presented. A nominal I/sub dsat/N/P of 950/410 /spl mu/A//spl mu/m at an I/sub off/ of 12 nA//spl mu/m is achieved by reducing the body effect. The double-sidewall structure developed can reduce gate-fringe capacitance without increasing the junction leakage, and the inverter delay of 11 ps/stage is achieved at a nominal L/sub gate/ of 0.12 /spl mu/m. Small 6T-SRAM cells of 3.1 /spl mu/m/sup 2/ with 0.5 /spl mu/m gate pitch are implemented using a vertical well isolation and a self-aligned contact (SAC). In the SAC process, a blanket Si/sub 3/N/sub 4/ layer used as an etching stopper is optimized for the I/sub dsat/N/P ratio and the negative bias temperature instability (NBTI) reliability. The 9-level interconnection is optimized to reduce a long wire RC-delay.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122523473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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