B. Kaczer, R. Degraeve, A. De Keersgieter, K. Van de Mieroop, T. Bearda, G. Groeseneken
{"title":"Consistent model for short-channel nMOSFET post-hard-breakdown characteristics","authors":"B. Kaczer, R. Degraeve, A. De Keersgieter, K. Van de Mieroop, T. Bearda, G. Groeseneken","doi":"10.1109/VLSIT.2001.934979","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934979","url":null,"abstract":"We show that dissimilar post-hard-breakdown nFET characteristics can be consistently explained by the location of a constant-size breakdown path. A physically based model and an equivalent circuit for a hard-broken nFET are given.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124995023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
H. Uh, J.K. Lee, Y. Ahn, S. Lee, S. Hong, J. Lee, G. Koh, G. Jeong, T. Chung, Kinam Kim
{"title":"A strategy for long data retention time of 512 Mb DRAM with 0.12 /spl mu/m design rule","authors":"H. Uh, J.K. Lee, Y. Ahn, S. Lee, S. Hong, J. Lee, G. Koh, G. Jeong, T. Chung, Kinam Kim","doi":"10.1109/VLSIT.2001.934930","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934930","url":null,"abstract":"Data retention time has been investigated for mass-produced 512 Mb DRAMs with 0.12 /spl mu/m design rules. Cell junction leakage components were analyzed for the first time using a test structure. It was found that process-induced trap density and electric field at the storage node (SN) junction should be reduced to control leakage current and thus data retention time. Moreover, we propose a novel cell transistor using localized channel and field implantation (LOCFI) which greatly suppresses the ion implantation damage and reduces the electric field at the same time. Finally, data retention time has been improved by 3/spl sim/4 times due to the LOCFI cell transistor with optimized process conditions.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116809552","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Ghani, K. Mistry, P. Packan, M. Armstrong, S. Thompson, S. Tyagi, M. Bohr
{"title":"Asymmetric source/drain extension transistor structure for high performance sub-50 nm gate length CMOS devices","authors":"T. Ghani, K. Mistry, P. Packan, M. Armstrong, S. Thompson, S. Tyagi, M. Bohr","doi":"10.1109/VLSIT.2001.934925","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934925","url":null,"abstract":"In this paper, we present for the first time an asymmetric source/drain extension (SDE) transistor structure which can achieve high I/sub DSAT/ at gate dimensions below 50 nm. We demonstrate that this structure alleviates the severe I/sub DSAT/ degradation reported in the literature for devices when gate to source/drain overlap dimensions are reduced to under 20 nm/side (Thomson et al, 1998). Sub-15 nm gate to source/drain overlap is mandatory for supporting gate dimensions below 50 nm (Ghani et al, 2000). Moreover, fabrication of this structure employs a standard process flow in which SDE regions are formed by ion implantation and a subsequent drive-in anneal. Fundamental principles of device operation of the asymmetric SDE transistor are presented followed by a description of the process flow and an in-depth analysis of electrical characteristics and associated trade-offs.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114116226","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Hareland, J. Maiz, M. Alavi, K. Mistry, Steve Walsta, C. Dai
{"title":"Impact of CMOS process scaling and SOI on the soft error rates of logic processes","authors":"S. Hareland, J. Maiz, M. Alavi, K. Mistry, Steve Walsta, C. Dai","doi":"10.1109/VLSIT.2001.934953","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934953","url":null,"abstract":"Technology scaling, reduction in operating voltages, and the increase in cache size and circuit complexity have been key enablers to achieving the performance improvement expectation dictated by Moore's Law. The resulting reduction in the node charge of circuit latches and cache cells has resulted in an ever increasing soft error rate (SER) estimation for logic components. This paper reports the SER impact of process scaling over four technology generations (0.35, 0.25, 0.18, 0.13 /spl mu/m) and provides an experimental assessment of alpha and, for the first time, neutron SER on advanced SOI processes, which have been considered as a possible method to reduce the SER of advanced technologies.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124537344","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Gate voltage dependent model for TDDB lifetime prediction under direct tunneling regime","authors":"M. Takayanagi, S. Takagi, Y. Toyoshima","doi":"10.1109/VLSIT.2001.934968","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934968","url":null,"abstract":"Systematic experiments are carried out in this paper for quantitative understanding of gate voltage scaling for TDDB under the direct tunneling regime. It is found that the slope of ln T/sub BD/ has a nonlinear relationship to V/sub ox/. A simple model to explain the experimental voltage acceleration factor is proposed based on the anode hole injection (AHI) concept. It is shown, according to model prediction, that the 1.8 nm gate oxide is still reliable under real operational voltage conditions.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128172070","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Shih-Fen Huang, C. Wann, Yu-Shyang Huang, Chih-Yung Lin, T. Schafbauer, Shui-Ming Cheng, Yao-Ching Cheng, D. Vietzke, M. Eller, Chuan Lin, Q. Ye, N. Rovedo, S. Biesemans, P. Nguyen, R. Dennard, Bomy Chen
{"title":"Scalability and biasing strategy for CMOS with active well bias","authors":"Shih-Fen Huang, C. Wann, Yu-Shyang Huang, Chih-Yung Lin, T. Schafbauer, Shui-Ming Cheng, Yao-Ching Cheng, D. Vietzke, M. Eller, Chuan Lin, Q. Ye, N. Rovedo, S. Biesemans, P. Nguyen, R. Dennard, Bomy Chen","doi":"10.1109/VLSIT.2001.934972","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934972","url":null,"abstract":"We analyze the scalability of the two well bias strategies: reverse bias to reduce standby power, and forward bias to improve the speed or to reduce active power. We then present the device design space that includes well bias as an integral part of the design variables following the SIA Roadmap specifications. We show that proper well biases are needed for bulk CMOS just to continue to meet the SIA Roadmap requirements for performance and standby current. The scalabilities for forward bias and reverse bias are different. The advantage of reverse bias is diminishing with scaling due to low initial V/sub t/ values, short-channel effects, and band-to-band tunneling. The advantage of the forward body bias is preserved better with scaling due to high initial V/sub t/ values as well as smaller depletion width, and increases with V/sub t/ nonscaling. The forward bias approach is not effective in speed improvement for ultra-high performance applications with high V/sub dd/ overdrive and low V/sub t/ to start with, but is effective in active power reduction at a fixed speed target.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133461509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Ono, K. Fukasaku, T. Hirai, M. Makabe, S. Koyama, N. Ikezawa, K. Ando, T. Suzuki, K. Imai, N. Nakamura
{"title":"A multi-gate dielectric technology using hydrogen pre-treatment for 100 nm generation system-on-a-chip","authors":"A. Ono, K. Fukasaku, T. Hirai, M. Makabe, S. Koyama, N. Ikezawa, K. Ando, T. Suzuki, K. Imai, N. Nakamura","doi":"10.1109/VLSIT.2001.934956","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934956","url":null,"abstract":"A multi-gate dielectric technology using hydrogen pre-treatment has been developed for 100-nm generation CMOS technologies. This process can remove the chemical oxide layer and smoothes the Si surface before gate-oxidation to improve interface carrier mobility as well as reliability of 1.3 nm ultra-thin gate dielectric film. In multi-oxide processing, the hydrogen pretreatment does not affect the performance or yield in the thick gate region (1.6-3.4 nm). Using this technology, we have achieved I/sub D//sup sat/ of 780 /spl mu/A//spl mu/m (I/sub OFF/=25 nA//spl mu/m) and 305 /spl mu/A//spl mu/m (I/sub OFF/=30 nA//spl mu/m) for 70-nm nMOS and pMOS, respectively, with 1.3 nm gate dielectric at 1.0 V operation. In addition to the performance improvement, the reliability in terms of TDDB and NBTI (negative bias temperature instability) were also improved.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"92 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115535941","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Togo, K. Watanabe, M. Terai, S. Kimura, A. Morioka, T. Yamamoto, T. Tatsumi, T. Mogami
{"title":"Controlling base-SiO/sub 2/ density of low-leakage 1.6 nm gate-SiON for high-performance and highly reliable n/pFETs","authors":"M. Togo, K. Watanabe, M. Terai, S. Kimura, A. Morioka, T. Yamamoto, T. Tatsumi, T. Mogami","doi":"10.1109/VLSIT.2001.934957","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934957","url":null,"abstract":"We report the importance of high-density base-SiO/sub 2/ for nitridation, and demonstrate a low-leakage and highly reliable 1.6 nm gate-SiON without performance degradation in n/pFETs using a radical process. It was found that the high-density 1.6 nm SiO/sub 2/ is ten times more reliable than low-density SiO/sub 2/ in n/pFETs and is suitable as a base layer for radical nitridation as it maintains the surface nitridation of the SiO/sub 2/ and the ideal SiON/Si-substrate interface. The 1.6 nm SiON with the high-density base-SiO/sub 2/ produces comparable drivability in n/pFETs, and has one and half orders of magnitude less gate leakage in nFETs, one order of magnitude less gate leakage in pFETs, and ten times more reliability in n/pFETs than the 1.6 nm SiO/sub 2/.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129931446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Impact of vias on the thermal effect of deep sub-micron Cu/low-k interconnects","authors":"TingYen Chiang, K. Saraswat","doi":"10.1109/VLSIT.2001.934989","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934989","url":null,"abstract":"This paper investigates in detail the impact of vias on the thermal characteristics of high performance Cu/low-k interconnects. It shows that the effectiveness of vias in reducing the temperature rise in interconnects is highly dependent on the dielectric material used. An efficient 3D electro-thermal simulation methodology is presented to evaluate the temperature profile along wires and the thermal coupling between them. The possibility that the thermal effect may degrade the expected speed improvement from the use of low-k dielectrics is discussed. Finally, the more realistic RC performances of various low-k schemes, under the impact of thermal effects, are examined.","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"31 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128859853","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Q. Ouyang, Xiangdong Chen, A. Tasch, L. Register, S. Banerjee, J. Chu, J. Ott
{"title":"Fabrication of a novel vertical pMOSFET with enhanced drive current and reduced short-channel effects and floating body effects","authors":"Q. Ouyang, Xiangdong Chen, A. Tasch, L. Register, S. Banerjee, J. Chu, J. Ott","doi":"10.1109/VLSIT.2001.934943","DOIUrl":"https://doi.org/10.1109/VLSIT.2001.934943","url":null,"abstract":"We have fabricated, for the first time, a novel vertical p-channel metal-oxide-semiconductor field-effect transistor (MOSFET), also called the high mobility hetero-junction transistor (HMHJT). Significantly reduced short channel effects and floating body effects, and enhanced drive current have been achieved. Compared to a Si control device, the fabricated p-HMHJT has a 1.65/spl times/ higher drive current (V/sub DS/=-1.6 V and V/sub G/-V/sub T/=-2 V), and a 70/spl times/ lower off-state leakage (V/sub DS/=-1.6 V).","PeriodicalId":232773,"journal":{"name":"2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126856197","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}