Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium最新文献

{"title":"Measurement and simulation of stacked die thermal resistances","authors":"B. Joiner, J. M. de Oca, S. Neelakantan","doi":"10.1109/TCAPT.2009.2028813","DOIUrl":"https://doi.org/10.1109/TCAPT.2009.2028813","url":null,"abstract":"Packages with multiple die provide additional challenges when documenting their thermal performance. To explore the thermal performance of multi-chip packages, stacked die configurations were chosen with the die stacked upon each other. A plastic ball grid array package (PBGA) was thermally tested with three die configurations. The thermal performance of the package was determined using the JEDEC 51 specifications. The package was also simulated using a finite element simulation to better illustrate the package performance. In addition, the validity of the superposition technique was evaluated in the determination of junction temperatures with change in power of the various die","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"119 6","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120913199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Optimized thermo-reflectance system for measuring the thermal properties of thin-films and their interfaces","authors":"M. Burzo, P. Komarov, P. Raad","doi":"10.1109/STHERM.2006.1625211","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625211","url":null,"abstract":"An overall evaluation of the transient thermo-reflectance (TTR) technique as applied to the measurement of thermal properties of electronic materials is presented in this article. First, the TTR method is presented. Then, the focus is placed on a systematic characterization of the performance of the thermoreflectance technique in which the influences of the most important system parameters on the accuracy of the TTR measurements are ascertained (Burzo et al., 2002). Finally, the power of the TTR measurement technique and its optimization are demonstrated through representative measurements, first of bulk materials (Komarov et al., 2003) and then of thin-film materials. Results are then shown addressing the effects of doping, isotopic purity, interface resistance, deposition/growing methods, and film thickness on the thermal properties of the selected bulk and thin-film layers","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127505028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"ASTM D 5470 TIM material testing","authors":"Kevin Hanson","doi":"10.1109/STHERM.2006.1625205","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625205","url":null,"abstract":"The ASTM D 54701 standard is currently being revised to cover a test method for the measurement of thermal impedance and calculation of an apparent thermal conductivity for thermal interface materials (TIM) ranging from liquid compounds to hard solids. Modifications to the procedure include the use of mechanical stops to control the specimen thickness under test and an in situ thickness measurement to monitor the specimen thickness if the thickness dimension of the specimen can change during the test. Rigid materials that will not coalesce together require the preparation of specimens of different thickness to obtain the multiple thermal impedance measurements needed to calculate the thermal conductivity. The revised method does not call out a specific clamping pressure to be used for all material types but instead specifies that the clamping pressure required is either that which is sufficient to contact the mechanical stops or to coalesce multiple layers together without damaging the test specimens. Measuring the 3 primary properties - the heat flow through the test specimen, the temperature difference across it, and the thickness of the specimen under test - is still stressed","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133728092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Optimization of microchannel heat sinks using entropy generation minimization method","authors":"W. Khan, M. Yovanovich, J. Culham","doi":"10.1109/STHERM.2006.1625210","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625210","url":null,"abstract":"In this study, an entropy generation minimization (EGM) procedure is employed to optimize the overall performance of microchannel heat sinks. This allows the combined effects of thermal resistance and pressure drop to be assessed simultaneously as the heat sink interacts with the surrounding flow field. New general expressions for the entropy generation rate are developed by considering an appropriate control volume and applying mass, energy, and entropy balances. The effect of channel aspect ratio, fin spacing ratio, heat sink material, Knudsen numbers and accommodation coefficients on the entropy generation rate is investigated in the slip flow region. Analytical/empirical correlations are used for heat transfer and friction coefficients, where the characteristic length is used as the hydraulic diameter of the channel. A parametric study is also performed to show the effects of different design variables on the overall performance of microchannel heat sinks","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"201 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123029649","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Practical utilization of low melting alloy thermal interface materials","authors":"R. F. Hill, J.L. Strader","doi":"10.1109/STHERM.2006.1625201","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625201","url":null,"abstract":"The use of low melting alloy thermal interface materials results in exceptionally low thermal resistance between heat-generating electronic components and heat removal systems. Under certain conditions, these alloys can oxidize which may lead to degradation in thermal performance. In addition, if the alloy is used in the molten state, there is a possibility of electrical shorts resulting from escaping metal. Oxidation and electrical shorts are shown to be minimized through a variety of design parameters. These include the use of oversized metal alloy TIM's that form a seal around the interface area; soldering the low melting alloys directly to the heat removal component; use of a gasket to provide a barrier to prevent air from entering the interface area and to serve as a collection vehicle for excess molten alloy; and operating below the melting point of the alloy after a \"burn-in\" cycle. The use of low melting alloys, in conjunction with a series of design guidelines, provides a thermal solution with improved reliability and exceptionally low thermal resistance","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114736249","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Diamond pins utilized as thermal vias for high heat flux spreading in CTE-compatible lids and substrates for semiconductor packaging","authors":"D. Saums, B. Edward, P. Ruzicka, K. Fennessy, R. Hay, J. Zimmer, G. Sundberg","doi":"10.1109/STHERM.2006.1625223","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625223","url":null,"abstract":"CVD diamond segments inserted into an extremely high thermal conductivity graphite heat spreader within an expansion-matched composite structure are described as a semiconductor packaging material construction. These development materials are evaluated to address high heat flux spreading requirements of on-die hot spots and the need to match differing coefficients of thermal expansion with other packaging components and semiconductor die materials","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116230288","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Micro-scale liquid cooling system for high heat flux processor cooling applications","authors":"G. Upadhya, M. Munch, P. Zhou, J. Horn, D. Werner, M. Mcmaster","doi":"10.1109/STHERM.2006.1625215","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625215","url":null,"abstract":"The requirements for thermal management in high performance computers are rapidly outpacing the capabilities of the best commercial heat sinks, including those with integrated heat pipes. The problem lies in three compounding trends: a) higher total chip power, b) higher local heat flux in chip hotspots, and c) smaller system enclosures. Pumped liquid cooling is a promising alternative, but this approach requires innovation and careful design to cool a high heat flux chip within a targeted system volume. To address this problem, Cooligy has developed a new pumped liquid, microscale cooling system for use in high heat flux applications. The cooling system features a microstructure heat exchanger for high heat flux removal capability, a reliable mechanical pump for delivering fluid with the required flow rate and pressure, and an efficient liquid-air radiator heat exchanger. The microstructure heat exchanger is optimally designed to handle high heat flux on a high-performance microprocessor and the mechanical pump is compact, and demonstrates high reliability. In this paper, an example of high heat flux processor cooling using the new micro-scale liquid cooling system developed at Cooligy is described, for a workstation processor cooling application. The liquid cooling system is in high volume production","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"277 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123064508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal resistance-based bounds for the effective conductivity of composite thermal interface materials","authors":"P. Karayacoubian, M. Yovanovich, J. Culham","doi":"10.1109/STHERM.2006.1625202","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625202","url":null,"abstract":"Thermally enhanced greases made of dispersions of small conductive particles suspended in fluidic polymers can offer significant advantages when used as a thermal interface material (TIM) in microelectronics cooling applications. The following study presents the application of two simple theorems for establishing bounds on the effective thermal conductivity of such inhomogeneous media. An upper bound is established when isotherms are assumed perpendicular to the direction of heat flow through the material. In a similar manner, a lower bound is established when adiabats are assumed parallel to the direction of heat flow. As an example of the application of these theorems, the TIM is assumed to be composed of a cubic array of uniform spheres in a surrounding medium. In most instances, a geometric mean of the bounding solutions determined for this case gives good agreement with experimental data available in the literature. Numerical simulations of a spherical particle in a unit cube cell confirm the validity of the model. This model is not applicable to systems in which the discontinuous phase is either well-connected throughout or has settled. The potential of extending this preliminary thermal resistance-based approach to investigate other geometries and effects associated with distribution, orientation, and boundary resistance is discussed","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129672816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Operating controls and dynamics for floating refrigerant loop for high heat flux electronics","authors":"K. Lowe, C.W. Avers, J. S. Hsu","doi":"10.1109/STHERM.2006.1625217","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625217","url":null,"abstract":"The Oak Ridge National Laboratory (ORNL) Power Electronics and Electric Machinery Research Center (PEEMRC) have been developing technologies to address the thermal issues associated with hybrid vehicles. This work is part of the ongoing FreedomCAR and Vehicle Technologies (FCVT) program, performed for the Department of Energy (DOE). Removal of the heat generated from electrical losses in traction motors and their associated power electronics is essential for the reliable operation of motors and power electronics. As part of a larger thermal management project, which includes shrinking inverter size and direct cooling of electronics, ORNL has developed U.S. Patent No. 6,772,603 B2, Methods and apparatus for thermal management of vehicle systems and components (Hsu et al, 2004), and patent pending Floating loop system for cooling integrated motors and inverters using hot liquid refrigerant (Hsu et al, 2004). The floating-loop system provides a large coefficient of performance (COP) for hybrid drive component cooling. This loop uses R-134a as a coolant and shares the vehicle's existing air-conditioning (AC) condenser, which dissipates waste heat to the ambient air. Because temperature requirements for cooling power electronics and electric machines are not as low as that required for passenger compartment air, this adjoining loop can operate on the high-pressure side of the existing AC system. This arrangement also allows for the floating loop to run without a compressor and requires only a small pump to move the liquid refrigerant. For the design to be viable, the loop must not adversely affect the existing system. The loop should also, ideally, provide a high COP, a flat temperature profile, and low pressure drop. To date, the floating-loop test prototype has successfully removed 2 kW of heat load in a 9 kW automobile passenger AC system with and without the automotive AC system running. However, during the cyclic operation of the floating refrigerant loop, some two-phase transient behavior is evident. In order to maintain stable running conditions, specific operating controls were implemented. Also thermodynamic energy balances were conducted to further analyze the operating conditions","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126635047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Assembly of MCM thermal solution utilizing individual heat spreaders","authors":"D. Edwards, R. Hering, D.C. Long, S. Singh","doi":"10.1109/STHERM.2006.1625222","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625222","url":null,"abstract":"Some recent IBM UNIX servers use multi-chip modules (MCMs) with multi-core processor chips with very high power densities, requiring aggressive thermal solutions. The thermal solution includes flip chips with individually attached heat spreaders. Because of the difficulty of reworking the thermal solution, and the high value of the module at the time the cooling solution is assembled, very high assembly yields were required. This drove new technologies, and new processes to enable assembly of highly efficient cooling structures with very high yields. This paper addresses the challenges of assembling the heat spreader cooling solution, and describes how these challenges were overcome","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127943249","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}