Diamond pins utilized as thermal vias for high heat flux spreading in CTE-compatible lids and substrates for semiconductor packaging

Abstract

CVD diamond segments inserted into an extremely high thermal conductivity graphite heat spreader within an expansion-matched composite structure are described as a semiconductor packaging material construction. These development materials are evaluated to address high heat flux spreading requirements of on-die hot spots and the need to match differing coefficients of thermal expansion with other packaging components and semiconductor die materials